A substrate for embedding an imaging device includes: a core layer; a first multilayered wiring layer that is formed onto the core layer, the core layer and the first multilayered wiring layer having a cavity penetrating therethrough; a second multilayered wiring layer that is formed onto the core layer on a side opposite to the first multilayered wiring layer and that includes a conductive pattern formed at a position facing the cavity; a resin portion that is arranged inside the cavity and includes a bottom surface supported by the second multilayered wiring layer, a side face supported by the core layer, and a curved surface formed on a side opposite to the bottom surface; and an imaging device adhered along the curved surface inside the cavity.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A substrate for embedding an imaging device, comprising: a core layer; a first multilayered wiring layer that is formed onto the core layer, the core layer and the first multilayered wiring layer having a cavity penetrating therethrough; a second multilayered wiring layer that is formed onto the core layer on a side opposite to the first multilayered wiring layer and that includes a conductive pattern formed at a position facing the cavity; a resin portion that is arranged inside the cavity and includes a bottom surface supported by and directly connected to the second multilayered wiring layer, a side face supported by and directly connected to the core layer, and a curved surface formed on a side opposite to the bottom surface; and an imaging device adhered along the curved surface inside the cavity.
2. The substrate for embedding the imaging device according to claim 1 , wherein the curved surface of the resin portion curves towards the second multilayered wiring layer.
3. The substrate for embedding the imaging device according to claim 1 , wherein the imaging device protrudes out beyond the curved surface of the resin portion.
4. The substrate for embedding the imaging device according to claim 1 , wherein the curved surface of the resin portion protrudes out beyond the imaging device.
5. The substrate for embedding the imaging device according to claim 1 , wherein the cavity is hermetically sealed by the second multilayered wiring layer.
6. The substrate for embedding the imaging device according to claim 1 , wherein the core layer is made of metal, and wherein the conductive pattern of the second multilayered wiring layer is electrically connected to the core layer.
7. An imaging apparatus, comprising: a lens unit configured to transmit external light; a core layer that is arranged facing the lens unit; a first multilayered wiring layer that is formed onto a lens unit side of the core layer, said core layer and said first multilayered wiring layer having a cavity penetrating therethrough; a second multilayered wiring layer that is formed onto the core layer on a side opposite to the first multilayered wiring layer and that includes a conductive pattern formed at a position facing the cavity; a resin portion that is arranged inside the cavity and includes a bottom surface supported by and directly connected to the second multilayered wiring layer, a side face supported by and directly connected to the core layer, and a curved surface that is formed on a side opposite to the bottom surface and has a shape determined according to a configuration of the lens unit; and an imaging device adhered along the curved surface inside the cavity that receives the external light passing through the lens unit.
8. The imaging apparatus according to claim 7 , wherein the core layer is made of metal.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
December 4, 2015
November 1, 2016
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