LED lighting device in which color-mixed light according to a mixture of a blue optical emission spectrum according to the emission from an LED element, a red optical emission spectrum according to the emission from a red phosphor, and a green optical emission spectrum according to the emission from a green phosphor is emitted, wherein in the spectrum for the emitted color-mixed light, letting the relative spectral area for the principal-wavelength peak of the blue optical emission spectrum be AB and the peak emission intensity be IB, letting the relative spectral area of the green optical emission spectrum be AG and the peak emission intensity be IG, and letting the relative spectral area of the red optical emission spectrum be AR and the peak emission intensity be IR, then IB<IG, IB<IR, AB≦AG, AB≦AR, and AB/(AR+AG)≦0.4.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The LED lighting device as set forth in claim 1 , wherein A B /(A R +A G )≦0.1.
3. The LED lighting device as set forth in claim 1 , wherein A B /(A R +A G )≦0.05.
4. The LED lighting device as set forth in claim 1 , wherein with respect to the total relative spectral area for the color-mixed light, the relative spectral area of the region less than or equal to 480 nm wavelength is less than or equal to 20%.
5. The LED lighting device as set forth in claim 1 , wherein with respect to the total relative spectral area for the color-mixed light, the relative spectral area of the region less than or equal to 480 nm wavelength is less than or equal to 15%.
6. The LED lighting device as set forth in claim 1 , further including a yellow phosphor that by being excited by the emission from said blue LED element emits light having an optical emission peak in the 550 nm to 590 nm wavelength region.
7. The LED lighting device as set forth in claim 1 , wherein the emission color of the color-mixed light is a color temperature calculated by the method set forth in the appendix to JIS Z 8725, and is in the xy-coordinate range of the correlate color temperature or is in the ANSI (C 78.377) region.
8. The LED lighting device as set forth in claim 1 , including a resin sealant sealing said blue LED element; wherein said red phosphor and said green phosphor are compounded into said resin sealant.
9. The LED lighting device as set forth in claim 8 , wherein said resin sealant is silicone.
10. The LED lighting device as set forth in claim 1 , further including either a resin sheet or a resin cap for wavelength-converting light from said blue LED element; wherein said red phosphor and said green phosphor are compounded into said resin sheet or said resin cap.
11. The LED lighting device as set forth in claim 10 , including a resin sealant sealing said blue LED element; wherein said resin sheet is sealed within said resin sealant.
12. The LED lighting device as set forth in claim 10 , including a resin sealant sealing said blue LED element; wherein said resin sheet or said resin cap is disposed such as to cover said resin sealant.
13. The LED lighting device as set forth in claim 10 , further comprising: a light-source unit furnished with a circuit board and a plurality of LED packages containing said blue LED element, installed on said circuit board; a housing member housing said light-source unit; and said resin sheet in at least a single ply, disposed so as to cover said plurality of light-emitting diodes, and containing phosphors in order to wavelength-convert the optical emission from said blue LED elements and output the wavelength-converted light to the exterior.
14. The LED lighting device as set forth in claim 10 , wherein said resin sheet or said resin cap includes silicone.
15. The LED lighting device as set forth in claim 10 , including a resin sealant sealing said blue LED element; wherein said resin sheet or said resin cap is disposed in a position separated at a spacing from the blue LED element.
17. The LED lighting device manufacturing method set forth in claim 16 , wherein said step of disposing the phosphor-resin composition on the optical-emission region of the LED element is a step of sealing the blue LED element with said phosphor-resin composition.
18. The LED lighting device manufacturing method set forth in claim 16 , wherein said step of disposing the phosphor-resin composition on the optical-emission region of the LED element is a process in which the phosphor-resin composition is molded either into sheet form or cap form, and a process of disposing the phosphor-resin composition having been molded into sheet form or cap form on the optical-emission region of the LED element.
20. The LED lighting method set forth in claim 19 , wherein A B /(A R +A G )≦0.1.
21. The LED lighting method set forth in claim 19 , wherein with respect to the total relative spectral area for the color-mixed light, the relative spectral area of the region less than or equal to 480 nm wavelength is less than or equal to 20%.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
March 29, 2014
November 22, 2016
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