Patentable/Patents/US-9520353
US-9520353

Metal-insulation-metal device

PublishedDecember 13, 2016
Assigneenot available in USPTO data we have
Inventorsnot available in USPTO data we have
Technical Abstract

A metal-insulation-metal (MIM) device including a first metal layer, a first insulation layer, a second metal layer, and a second insulation layer is provided. The first insulation layer is disposed on the first metal layer. The second metal layer is disposed on a part of the first insulation layer. The second insulation layer is disposed on a side wall of the second metal layer and on another part of the first insulation layer. A width of the first insulation layer under the second metal layer and the second insulation layer parallel to the first metal layer is greater than a with of the second metal layer parallel to the first metal layer.

Patent Claims
4 claims

Legal claims defining the scope of protection, as filed with the USPTO.

1

1. A metal-insulation-metal (MIM) device comprising: a first metal layer; a first insulation layer disposed on the first metal layer; a second metal layer disposed on a part of the first insulation layer; and a second insulation layer disposed on a side wall of the second metal layer and on another part of the first insulation layer; wherein a width of the first insulation layer under the second metal layer and the second insulation layer parallel to the first metal layer is greater than a width of the second metal layer parallel to the first metal layer, wherein the first insulation layer comprising a multilayer structure, and the multilayer structure comprises a first silicon dioxide sub-layer, a second silicon dioxide sub-layer and a silicon nitride sub-layer, wherein the first silicon dioxide sub-layer is disposed between the silicon nitride sub-layer and the first metal layer, the second silicon dioxide sub-layer is disposed between the silicon nitride sub-layer and the second metal layer, and the silicon nitride sub-layer is disposed between the first silicon dioxide sub-layer and the second silicon dioxide sub-layer, wherein a width of the first silicon dioxide sub-layer parallel to the first metal layer is greater than a width of the silicon nitride sub-layer parallel to the first metal layer, and the width of the silicon nitride sub-layer parallel to the first metal layer is greater than a width of the second silicon dioxide sub-layer parallel to the first metal layer.

2

2. The MIM device according to claim 1 further comprising a third insulation layer covering the first metal layer, the first insulation layer, the second insulation layer and the second metal layer.

3

3. The MIM device according to claim 1 , wherein a width of the second insulation layer parallel to the first metal layer gradually decreases from a side of the second insulation layer close to the first metal layer to another side of the second insulation layer away from the first metal layer.

4

4. The MIM device according to claim 1 , wherein the second insulation layer is a silicon dioxide layer.

Classification Codes (CPC)

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Patent Metadata

Filing Date

May 12, 2015

Publication Date

December 13, 2016

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