Memory device

1. A memory device, comprising: a controller; a first electrode and a second electrode connected to the controller; and a variable resistance layer provided between the first electrode and the second electrode, the variable resistance layer including a chalcogenide compound including a grain boundary, the variable resistance layer having a first structure, and a second structure, a structure of the grain boundary of the second structure being different from a structure of the grain boundary of the first structure, the controller configured to be able to perform a first operation of applying a first voltage between the first electrode and the second electrode, a second operation of applying a second voltage between the first electrode and the second electrode and determining whether or not the variable resistance layer has the first structure, the second voltage being lower than the first voltage, and a third operation of applying a third voltage between the first electrode and the second electrode having the interposed variable resistance layer determined to have the first structure in the second operation, the third voltage being higher than the first voltage and the second voltage, wherein the controller is configured to be able to perform the third operation after the first operation is performed a first number of times, a fourth operation of applying a fourth voltage between the first electrode and the second electrode having the interposed variable resistance layer after the third operation is Performed a second number of times, the fourth voltage being higher than the third voltage, a fifth operation of applying a fifth voltage between the first electrode and the second electrode having the interposed variable resistance layer determined to not have the first structure in the second operation, the fifth voltage being higher than the second voltage and lower than the third voltage, a sixth operation of applying a sixth voltage between the first electrode and the second electrode and determining whether or not the variable resistance layer has the first structure, the sixth voltage being lower than the first voltage, the third operation after the fifth operation is performed a third number of times, and the third operation after the first operation and the fifth operation are performed a fourth number of times.

2. The memory device according to claim 1 , wherein the controller is configured to be able to perform a seventh operation of applying a seventh voltage between the first electrode and the second electrode having the interposed variable resistance layer having undergone the third operation and determining whether or not the variable resistance layer has the first structure, the seventh voltage being lower than the first voltage.

3. The memory device according to claim 1 , wherein the first voltage is lower than a voltage changing the structure of the grain boundary of the variable resistance layer, the third voltage is higher than a voltage changing the structure of the grain boundary of the variable resistance layer, and the first structure is changed to the second structure by implementing the third operation on the variable resistance layer.

4. The memory device according to claim 1 , wherein a density of the grain boundary of the first structure is higher than a density of the grain boundary of the second structure.

5. The memory device according to claim 1 , wherein a length extending in a direction of the grain boundary of the first structure is longer than a length extending in the direction of the grain boundary of the second structure, the direction being from the first electrode toward the second electrode.

6. The memory device according to claim 1 , wherein a density of a chemical element provided on the grain boundary of the first structure is higher than a density of the chemical element provided on the grain boundary of the second structure.

7. The memory device according to claim 1 , wherein the variable resistance layer includes at least one chemical element of germanium, silicon, or carbon, a first region covering one of an upper surface of the first electrode or a lower surface of the second electrode, and a second region, a concentration of the chemical element being lower in the second region than in the first region.

8. The memory device according to claim 7 , wherein the first structure is changed to the second structure by implementing the third operation on the variable resistance layer, and a portion of the grain boundary of the first structure and the first region of the first structure overlapping is larger than a portion of the grain boundary of the second structure and the first region of the first structure overlapping.

9. The memory device according to claim 1 , wherein the variable resistance layer having undergone the fourth operation has a third structure, and a resistance of the variable resistance layer having the third structure is higher than a resistance of the variable resistance layer having the first structure.

10. The memory device according to claim 1 , wherein a ramp-down time of the first voltage is shorter than a ramp-down time of the fifth voltage.

11. The memory device according to claim 1 , wherein the first voltage is lower than the fifth voltage.

12. The memory device according to claim 1 , wherein the first voltage is a negative voltage, and the fifth voltage is a positive voltage.

13. The memory device according to claim 1 , wherein the first electrode includes a plurality of first interconnects extending in a first direction, the plurality of first interconnects being connected to the controller, the second electrode includes a plurality of second interconnects extending in a second direction intersecting the first direction, the plurality of second interconnects being connected to the controller, the variable resistance layer includes a plurality of cells provided between each of the plurality of first interconnects and each of the plurality of second interconnects, the plurality of cells including a chalcogenide compound, and the plurality of cells includes the first structure and the second structure.

14. The memory device according to claim 1 , wherein the controller is configured to be able to perform an eighth operation of applying an eighth voltage between the first electrode and the second electrode having the interposed variable resistance layer determined to not have the first structure in the second operation, the eighth voltage being higher than the second voltage and lower than the third voltage, a ninth operation of applying a ninth voltage between the first electrode and the second electrode and determining whether or not the variable resistance layer has the first structure, the ninth voltage being lower than the first voltage, the third operation after the eighth operation is performed a fifth number of times, and the third operation after the first operation and the eighth operation is performed a sixth number of times.

15. A memory device, comprising: a first cell; a second cell; and a third cell, the first cell, the second cell, and the third cell including a first electrode, a variable resistance layer provided on the first electrode, the variable resistance layer including a chalcogenide compound including a grain boundary, and a second electrode provided on the variable resistance layer, a density of the grain boundary of the second cell being lower than a density of the grain boundary of the first cell, a length extending in a first direction of the grain boundary of the second cell is shorter than a length extending in the first direction of the grain boundary of the first cell, the first direction being from the first electrode toward the second electrode, a resistance of the third cell being higher than a resistance of the first cell, and a density of the grain boundary of the third cell being lower than the density of the grain boundary of the first cell.

16. The memory device according to claim 15 , wherein the variable resistance layer includes a chemical element included inside a crystal structure of the variable resistance layer, and a density of a plurality of chemical elements provided on the grain boundary of the second cell is lower than a density of the plurality of chemical elements provided on the grain boundary of the first cell.