A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
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1. A display comprising: a display substrate; an array of bottom conductive layers on the display substrate; a passivation layer spanning across the display substrate and directly over the array of bottom conductive layers a corresponding array of vertical semiconductor-based LEDs bonded to the array of bottom conductive layers, and embedded within the passivation layer; wherein the passivation layer laterally surrounds a quantum well within each vertical semiconductor-based LED, and a top surface of the passivation layer does not cover a top surface of each vertical semiconductor-based LED; and one or more top conductive layers spanning directly over the passivation layer and the vertical semiconductor-based LEDs, and in electrical contact with the vertical semiconductor-based LEDs.
A display includes a substrate, an array of conductive layers on the substrate, and a passivation layer covering the substrate and the conductive layers. An array of vertical semiconductor LEDs are bonded to the conductive layers and embedded within the passivation layer. The passivation layer laterally surrounds a quantum well inside each LED, but does not cover the top of each LED. Conductive layers span over the passivation layer and the LEDs, making electrical contact with the LEDs. This creates a display where LEDs are protected by a passivation layer without being fully covered, allowing for electrical connection.
2. The display of claim 1 , wherein the passivation layer comprises a thermoset material.
The display described above includes a passivation layer comprising a thermoset material. A thermoset material is a polymer that cures irreversibly, providing a robust and stable encapsulation for the LEDs.
3. The display of claim 1 , wherein the one or more top conductive layers are in electrical contact with one or more electrode lines.
In the display described previously, the top conductive layers connect to electrode lines. The electrode lines allow for addressing and controlling the individual LEDs in the display array, enabling the display to generate images.
4. The display substrate of claim 1 , wherein each vertical semiconductor-based LED comprises sidewalls and a conformal dielectric barrier layer spanning along the sidewalls.
In the display described previously, each vertical semiconductor-based LED has sidewalls covered by a conformal dielectric barrier layer. This layer insulates the LED sidewalls and prevents electrical shorts, allowing for improved device performance and reliability.
5. The display substrate of claim 4 , wherein the conformal dielectric barrier layer is 50-600 angstroms thick.
In the display described previously, the conformal dielectric barrier layer covering the LED sidewalls is between 50 and 600 angstroms thick. This specific thickness range provides a good balance between insulation and minimizing any impact on light extraction from the LED.
6. The display substrate of claim 5 , wherein the conformal dielectric barrier layer comprises Al 2 O 3 .
In the display described previously, the conformal dielectric barrier layer is made of Aluminum Oxide (Al2O3). Aluminum Oxide is a common dielectric material that provides good electrical insulation and chemical stability.
7. The display substrate of claim 1 , wherein the array of vertical semiconductor-based LEDs is bonded to the array of bottom conductive layers with a corresponding array of bonding layers.
In the display described previously, the array of vertical semiconductor LEDs is bonded to the array of bottom conductive layers using a corresponding array of bonding layers. These bonding layers create a physical and electrical connection between the LEDs and the underlying circuitry.
8. The display substrate of claim 7 , wherein each bonding layer in the array of bonding layers is an alloy bonding layer.
In the display described previously, the bonding layers are alloy bonding layers. An alloy bonding layer provides a strong and reliable connection between the LED and the conductive layer, improving the device's overall durability.
9. The display substrate of claim 8 , wherein each alloy bonding layer is an alloy of a first bonding layer on a corresponding vertical semiconductor-based LED with a second bonding layer on a corresponding bottom conductive layer.
In the display described previously, the alloy bonding layer is formed from a first bonding layer on the LED combining with a second bonding layer on the bottom conductive layer. The two layers intermix to form the alloy during the bonding process.
10. The display substrate of claim 9 , wherein the alloy bonding layer has a higher melting temperature than both of the first bonding layer and the second bonding layer.
In the display described previously, the alloy bonding layer has a higher melting temperature than either of the original bonding layers on the LED or the conductive layer. This ensures the bond remains stable during device operation and prevents delamination at higher temperatures.
11. The display of claim 1 , wherein the display substrate has a pixel density of greater than 300 pixels per inch.
The display described previously has a pixel density of greater than 300 pixels per inch. This high pixel density allows for a high-resolution display with sharp image quality.
12. The display substrate of claim 11 , wherein each vertical semiconductor-based LED has a maximum width of 1 to 100 μm.
In the display described previously with a pixel density greater than 300 pixels per inch, each vertical semiconductor LED has a maximum width between 1 and 100 μm. This small LED size is necessary to achieve the high pixel density.
13. The display substrate of claim 11 , wherein each vertical semiconductor-based LED has a maximum width of 1 to 10 μm.
In the display described previously with a pixel density greater than 300 pixels per inch, each vertical semiconductor LED has a maximum width between 1 and 10 μm. This very small LED size allows for a higher pixel density and sharper image quality compared to the previous claim.
14. The display substrate of claim 1 , wherein the display substrate includes active matrix display circuitry.
The display described previously includes active matrix display circuitry. This circuitry allows for individual control of each pixel in the display, enabling high contrast ratios and fast response times.
15. The display of claim 14 , wherein the active matrix display circuitry includes thin film transistors.
In the display described previously with active matrix circuitry, the active matrix circuitry includes thin film transistors (TFTs). TFTs are used to switch each pixel on and off, controlling the light output and creating the image.
16. The display of claim 1 , further comprising a second passivation layer over the display substrate and underneath the passivation layer, wherein the second passivation layer includes an array of opening exposing the array of bottom conductive layers.
The display described previously further comprises a second passivation layer underneath the first passivation layer. This second passivation layer has openings exposing the array of bottom conductive layers. This allows the LEDs to directly contact the conductive layers while still providing an insulating layer across the display substrate.
17. The display substrate of claim 16 , wherein the second passivation layer comprises a material selected form the group consisting of silicon oxide (SiO 2 ), silicon nitride (SiN x ), poly(methyl methacrylate) (PMMA), benzocyclobutene (BCB), polyimide, and polyester.
In the display described previously, the second passivation layer comprises a material selected from the group consisting of silicon oxide (SiO2), silicon nitride (SiNx), poly(methyl methacrylate) (PMMA), benzocyclobutene (BCB), polyimide, and polyester. These materials provide good insulation and can be easily deposited on the display substrate.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
January 27, 2016
March 7, 2017
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