An electronic apparatus includes a cover panel and a case, and at least a board disposed therebetween. A plurality of components are disposed on a board and have heights different from one another. A gap reduction member is disposed so as to face the plurality of components. Steps are formed on the gap reduction member in accordance with the heights of the plurality of components which faces the plurality of components to reduce breakage of a cover panel of the electronic apparatus.
Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. An electronic apparatus, comprising: a case; a panel that includes an outer surface facing outwards from the case, and an inner surface, the case and the panel forming a housing; a board that is disposed in the case; a plurality of components that are disposed on the board, the plurality of components having a plurality of heights; and a gap reduction member comprising a plurality of steps that are disposed so as to face the plurality of components, the plurality of steps having heights corresponding to the heights of the plurality of components, wherein the gap reduction member is disposed in a space between the panel and the board, the space formed in part due to a difference between the heights of the plurality of components in a direction perpendicular to the board.
An electronic device consists of a case and a panel forming an outer housing. Inside, a circuit board holds multiple electronic components of varying heights. A "gap reduction member," shaped with steps corresponding to these component heights, sits between the board and panel. This stepped structure fills the uneven space created by the height differences of the components. This reduces the risk of the panel breaking from pressure against the taller components, providing support and distributing force evenly across the panel's inner surface.
2. The electronic apparatus according to claim 1 , wherein the gap reduction member has a heat transfer coefficient greater than the heat transfer coefficient of the air.
The electronic apparatus described previously, which has a case, panel forming a housing, a board, multiple components of varying heights, and a gap reduction member with steps corresponding to component heights positioned between the panel and board, now includes a specific characteristic. The gap reduction member is made from a material with high thermal conductivity. This means it transfers heat away from the components better than air, acting as a heat spreader to improve thermal management within the device.
3. The electronic apparatus according to claim 1 , wherein the gap reduction member has electric conductivity and is electrically connected to a ground level.
The electronic apparatus with a case, panel (forming a housing), board, components of varying heights, and a gap reduction member featuring steps matched to component heights, further includes a gap reduction member that is electrically conductive. This conductive gap reduction member is electrically connected to ground. This grounding helps to dissipate electrostatic discharge (ESD) or electromagnetic interference (EMI), improving the device's electromagnetic compatibility and protecting sensitive components.
4. The electronic apparatus according to claim 1 , wherein the plurality of components are disposed on the surface of the board on a panel side that faces the panel, and the gap reduction member is disposed between the panel and the board.
In the electronic apparatus with a case, panel (forming a housing), board, components of varying heights, and a stepped gap reduction member, the components are specifically mounted on the side of the board facing the panel. The gap reduction member is then positioned directly between this component-populated side of the board and the inner surface of the panel. This arrangement ensures direct contact between the gap reduction member and the components, optimizing its ability to provide both physical support and thermal management for the panel.
5. The electronic apparatus according to claim 1 , further comprising: a battery that is disposed to be adjacent to the board.
The electronic apparatus described previously, including a case, panel forming the housing, a board, multiple components with varying heights, and a gap reduction member featuring steps matched to component heights, now includes a battery. The battery is positioned next to the board inside the device.
6. The electronic apparatus according to claim 1 , wherein the plurality of components are disposed on a top surface of the board and on a rear surface of the board, wherein the gap reduction member comprises a first gap reduction member disposed between the panel and the board, and a second gap reduction member disposed between the board and a rear surface of the case.
The electronic apparatus with the case, panel (forming a housing), board, components of varying heights, and the gap reduction member, has components mounted on both the top and bottom sides of the board. To address this, the gap reduction member is implemented in two parts: a first gap reduction member between the panel and the top of the board, and a second gap reduction member between the bottom of the board and the rear surface of the case. This provides support and gap filling on both sides of the circuit board.
7. The electronic apparatus according to claim 1 , wherein a top surface of the gap reduction member comprises members to provide a heat sink for the board.
The electronic apparatus including the case, panel forming a housing, board, components of varying heights, and gap reduction member has a gap reduction member where the top surface, which faces the components and panel, incorporates features that act as a heat sink for the board. This means the gap reduction member is designed to dissipate heat generated by the components, improving thermal performance of the electronic apparatus.
8. The electronic apparatus according to claim 1 , wherein the gap reduction member extends beyond the board to provide support to the panel in areas of the housing that have gaps between components.
The electronic apparatus with a case, panel (forming a housing), board, components of varying heights, and a gap reduction member, the gap reduction member extends beyond the edges of the board. This extension provides additional support to the panel in areas of the housing where there are gaps between the components or where the board itself does not fully support the panel. This prevents panel flexing or breakage in these weaker areas.
9. The electronic device of claim 1 , wherein the gap reduction member extends beyond the circuit board to provide support to the panel in areas of the housing that have gaps between components.
The electronic device including a housing, a top panel, a circuit board with components of varying heights, and a gap reduction member disposed between the panel and the circuit board where the gap reduction member extends beyond the circuit board edges. This extension provides additional support to the panel in areas of the housing where there are gaps between the components or where the circuit board itself does not fully support the panel.
10. An electronic device comprising: a housing; a panel on a top surface of the housing; a circuit board within the housing comprising a plurality of components with varying heights; a gap reduction member disposed between the panel and the circuit board and having a first surface to match the varying heights of the plurality of components, wherein the gap reduction member is disposed in a space between the panel and the circuit board, the space formed in part due to a difference between the heights of the plurality of components in a direction perpendicular to the circuit board.
An electronic device has a housing with a panel on its top surface. Inside, a circuit board holds multiple electronic components of varying heights. A "gap reduction member," shaped with a surface to match these component heights, sits between the board and panel. This shaped structure fills the uneven space created by the height differences of the components.
11. The electronic device of claim 10 , wherein the gap reduction member has a heat transfer coefficient greater than the heat transfer coefficient of the air.
The electronic device with a housing, top panel, circuit board with components of varying heights, and a gap reduction member between the panel and the circuit board is made from a material with high thermal conductivity. This means it transfers heat away from the components better than air, acting as a heat spreader to improve thermal management within the device.
12. The electronic device of claim 10 , wherein the gap reduction member has electric conductivity and is electrically connected to a ground level.
The electronic device having a housing, top panel, circuit board with components of varying heights, and a gap reduction member, where that gap reduction member is electrically conductive. This conductive gap reduction member is electrically connected to ground. This grounding helps to dissipate electrostatic discharge (ESD) or electromagnetic interference (EMI), improving the device's electromagnetic compatibility and protecting sensitive components.
13. The electronic device of claim 10 , wherein the plurality of components of the circuit board are on a panel side that faces the panel, and the gap reduction member is disposed between the panel and the circuit board.
In the electronic device including a housing, a top panel, a circuit board with components of varying heights, and a gap reduction member positioned between the panel and circuit board, the components are specifically mounted on the side of the circuit board facing the panel. The gap reduction member is then positioned directly between this component-populated side of the board and the inner surface of the panel.
14. The electronic device of claim 10 , further comprising: a battery that is adjacent to the circuit board.
The electronic device with a housing, top panel, circuit board populated with components of varying heights, and a gap reduction member has a battery. The battery is located close to the circuit board.
15. The electronic device of claim 10 , wherein the plurality of components are disposed on a top surface of the circuit board and on a rear surface of the circuit board, wherein the gap reduction member comprises a first gap reduction member disposed between the panel and the circuit board, and a second gap reduction member disposed between the circuit board and a rear surface of the housing.
The electronic device, having a housing, top panel, a circuit board with components of varying heights, and a gap reduction member between the top panel and circuit board has components mounted on both the top and bottom sides of the board. To address this, the gap reduction member is implemented in two parts: a first gap reduction member between the panel and the top of the board, and a second gap reduction member between the bottom of the board and the rear surface of the housing. This provides support and gap filling on both sides of the circuit board.
16. The electronic device of claim 10 , wherein a top surface of the gap reduction member comprises members to provide a heat sink for the circuit board.
The electronic device that has a housing, top panel, a circuit board holding components of varying heights, a gap reduction member positioned between the panel and the circuit board where a top surface of the gap reduction member incorporates features that act as a heat sink for the circuit board. This means the gap reduction member is designed to dissipate heat generated by the components, improving thermal performance of the electronic apparatus.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
April 8, 2016
March 14, 2017
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