As a display device has a higher definition, the number of pixels, gate lines, and signal lines are increased. When the number of the gate lines and the signal lines are increased, a problem of higher manufacturing cost, because it is difficult to mount an IC chip including a driver circuit for driving of the gate and signal lines by bonding or the like. A pixel portion and a driver circuit for driving the pixel portion are provided over the same substrate, and at least part of the driver circuit includes a thin film transistor using an oxide semiconductor interposed between gate electrodes provided above and below the oxide semiconductor. Therefore, when the pixel portion and the driver portion are provided over the same substrate, manufacturing cost can be reduced.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method for manufacturing a semiconductor device, comprising: forming a first conductive film that serves as a gate electrode of a transistor; forming a first insulating film over the first conductive film; forming an oxide semiconductor layer that comprises a channel formation region over the first insulating film; forming a second insulating film over the oxide semiconductor layer; and forming a transparent film over the second insulating film by a sputtering method, wherein the first conductive film and the transparent film overlap each other with the oxide semiconductor layer therebetween, and wherein the transparent film has a larger width than the oxide semiconductor layer in a channel width direction of the transistor.
2. The method according to claim 1 , wherein the transparent film has a larger width than the oxide semiconductor layer in a channel length direction of the transistor.
3. The method according to claim 1 , further comprising: forming a source electrode and a drain electrode by patterning a second conductive film formed over the oxide semiconductor layer, whereby a top surface of a first region of the oxide semiconductor layer that is located between the source electrode and the drain electrode is partially etched to have a smaller thickness than a second region of the oxide semiconductor layer that is below the source electrode or the drain electrode.
4. The method according to claim 1 , wherein the oxide semiconductor layer includes indium, zinc, and a metal different from indium and zinc.
5. The method according to claim 1 , wherein the transparent film is a conductive film.
6. The method according to claim 1 , further comprising: performing a heat treatment on the oxide semiconductor layer.
7. The method according to claim 1 , wherein the second insulating film is an oxide insulating film.
8. The method according to claim 1 , wherein the second insulating film is in contact with the oxide semiconductor layer and the transparent film.
9. The method according to claim 1 , wherein the transparent film includes indium.
10. The method according to claim 1 , wherein the transparent film includes zinc.
11. A method for manufacturing a semiconductor device, comprising: forming a first conductive film that serves as a first gate electrode of a transistor; forming a first insulating film over the first conductive film; forming an oxide semiconductor layer that comprises a channel formation region over the first insulating film; forming a source electrode and a drain electrode by patterning a second conductive film formed over the oxide semiconductor layer, whereby a top surface of a first region of the oxide semiconductor layer that is located between the source electrode and the drain electrode is etched to have a smaller thickness than a second region of the oxide semiconductor layer that is below the source electrode or the drain electrode; forming a second insulating film over the oxide semiconductor layer, the source electrode, and the drain electrode; and forming a transparent film over the second insulating film by a sputtering method.
12. The method according to claim 11 , wherein the oxide semiconductor layer includes indium, zinc, and a metal different from indium and zinc.
13. The method according to claim 11 , wherein the transparent film is a conductive film.
14. The method according to claim 11 , further comprising: performing a heat treatment on the oxide semiconductor layer.
15. The method according to claim 11 , wherein the second insulating film is in contact with the oxide semiconductor layer and the transparent film.
16. The method according to claim 11 , wherein the transparent film includes indium.
17. The method according to claim 11 , wherein the transparent film includes zinc.
18. A method for manufacturing a semiconductor device, comprising: forming a first conductive film that serves as a first gate electrode of a transistor; forming a first insulating film over the first conductive film; forming an oxide semiconductor layer that comprises a channel formation region over the first insulating film; forming a source electrode and a drain electrode by patterning a second conductive film formed over the oxide semiconductor layer, whereby a top surface of a first region of the oxide semiconductor layer that is located between the source electrode and the drain electrode is etched to have a smaller thickness than a second region of the oxide semiconductor layer that is below the source electrode or the drain electrode; forming a second insulating film over the oxide semiconductor layer, the source electrode, and the drain electrode; and forming a transparent film over the second insulating film by a sputtering method, wherein the second insulating film is an oxide insulating film.
19. The method according to claim 18 , wherein the oxide semiconductor layer includes indium, zinc, and a metal different from indium and zinc.
20. The method according to claim 18 , wherein the transparent film is a conductive film.
21. The method according to claim 18 , further comprising: performing a heat treatment on the oxide semiconductor layer.
22. The method according to claim 18 , wherein the second insulating film is in contact with the oxide semiconductor layer and the transparent film.
23. The method according to claim 18 , wherein the transparent film includes indium.
24. The method according to claim 18 , wherein the transparent film includes zinc.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
March 16, 2016
March 21, 2017
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