Provided is a gas sensor package, including: a first substrate including a gas inflow hole; and a gas sensing element mounted to the first substrate and including a gas sensing portion disposed to correspond to the gas inflow hole.
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1. A gas sensor package, comprising: a first substrate including a gas inflow hole and metal patterns; a gas sensing element mounted to the first substrate and including a gas sensing portion provided to correspond to the gas inflow hole and bonded to the metal patterns; metal filling portions connected to respective metal patterns of the first substrate, each of the metal filling portions protruding from a surface of the first substrate and passing through the first substrate; a second substrate, wherein each of the metal filling portions contacts the second substrate to connect the second substrate to the first substrate; and an output change portion mounted on the first substrate to change an output mode of the gas sensing element.
A gas sensor package has a first substrate with a gas inflow hole and metal patterns on it. A gas sensing element, containing the actual gas sensor, sits on the first substrate, aligned so the sensing part is over the hole. The sensing element is electrically connected to the metal patterns. Metal fillings, like pins, connect to the substrate's metal patterns, stick out of the first substrate, and go through it. A second substrate connects to the first substrate by contacting these metal fillings. An output change element, like a resistor, is on the first substrate to change the electrical signal from the gas sensor.
2. The gas sensor package of claim 1 , wherein the gas inflow hole passes through the first substrate, wherein the output change portion is a fixed resistance element or an NTC (Negative Temperature Coefficient) thermistor.
This gas sensor package is the same as the package with a first and second substrate, metal fillings, a gas sensing element, metal patterns, a gas inflow hole, and an output changing element. The gas inflow hole goes all the way through the first substrate. The output change portion is specifically a fixed resistor or an NTC (Negative Temperature Coefficient) thermistor, a type of resistor that changes resistance with temperature.
3. The gas sensor package of claim 1 , further comprising a gas inflow portion formed between the first substrate and the second substrate to communicate with the gas inflow hole.
This gas sensor package is the same as the package with a first and second substrate, metal fillings, a gas sensing element, metal patterns, a gas inflow hole, and an output changing element. Additionally, there is a gas inflow area or channel between the first and second substrates. This channel connects to the gas inflow hole, creating a path for the gas to reach the sensor.
4. The gas sensor package of claim 1 , further comprising a molding portion formed on the gas sensing element, wherein the molding portion is applied to a side of the gas sensing element and the first substrate so as to enable the gas sensing element to he fixed to the first substrate.
This gas sensor package is the same as the package with a first and second substrate, metal fillings, a gas sensing element, metal patterns, a gas inflow hole, and an output changing element. In addition, the gas sensing element has a molding around it. This molding is applied to the side of the gas sensing element and the first substrate, holding the gas sensing element securely in place on the first substrate.
5. The gas sensor package of claim 1 , wherein the gas sensing element includes: a body in which a cavity portion is formed such that an upper part of the body is open; and a protective portion bonded to the gas sensing element to cover the upper part of the body of the gas sensing element.
This gas sensor package is the same as the package with a first and second substrate, metal fillings, a gas sensing element, metal patterns, a gas inflow hole, and an output changing element. The gas sensing element consists of a body with a cavity that's open on top. A protective cover is attached to the gas sensing element, sealing the top opening of the cavity.
6. The gas sensor package of claim 5 , wherein at least a part of the side of the protective portion is open so that gas can move.
This gas sensor package is the same as the package with a first and second substrate, metal fillings, a gas sensing element having a body with a cavity and protective portion, metal patterns, a gas inflow hole, and an output changing element. The side of the protective cover has at least one opening. This opening allows gas to enter and reach the gas sensing portion inside the cavity.
7. A gas sensor package, comprising: a first substrate including a gas inflow hole; a gas sensing element mounted to the first substrate and including a gas sensing portion provided to correspond to the gas inflow hole; and an output change portion mounted on the first substrate to change an output mode of the gas sensing element.
A gas sensor package has a first substrate with a gas inflow hole. A gas sensing element, which contains the actual gas sensor, sits on the first substrate, aligned so the sensing part is over the hole. An output change element, like a resistor, is on the first substrate to change the electrical signal from the gas sensor.
8. The gas sensor package of claim 7 , wherein the output change portion is a fixed resistance element or an NTC (Negative Temperature Coefficient) thermistor.
This gas sensor package is the same as the package with a first substrate, a gas sensing element with a sensing portion, a gas inflow hole, and an output changing element. The output change portion is specifically a fixed resistor or an NTC (Negative Temperature Coefficient) thermistor, a type of resistor that changes resistance with temperature.
9. A gas sensor package, comprising: a first substrate including a gas inflow hole; a gas sensing element mounted to the first substrate and including a gas sensing portion provided to correspond to the gas inflow hole; and a molding portion formed on the gas sensing element, wherein the molding portion is formed to bury the gas sensing element and an upper surface of the first substrate.
A gas sensor package has a first substrate with a gas inflow hole. A gas sensing element, which contains the actual gas sensor, sits on the first substrate, aligned so the sensing part is over the hole. A molding surrounds the gas sensing element, burying both the gas sensing element and the top surface of the first substrate under the molding material.
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October 1, 2014
April 11, 2017
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