An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.
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1. A lead frame for mounting a plurality of light emitting chips, wherein the plurality of light emitting chips comprises a first light emitting chip and a second light emitting chip thereon, comprising: a substrate; a bonding electrode embedded in the substrate and having a top surface, the bonding electrode comprises comprising a first bonding surface and a second bonding surface spaced apart from the first bonding surface; a first connecting electrode embedded in the substrate, and having a top surface, the first connecting electrode comprises a first connecting surface and a second connecting surface spaced apart from the first connecting surface; and a second connecting electrode embedded in the substrate and having a top surface, wherein the bonding electrode, the first connecting electrode, and the second connecting electrode are spaced from each other, and the top surfaces of the bonding electrode, the first connecting electrode, and the second connecting electrode are exposed out of the substrate, and a reflector located on the top surface of the substrate, and separated by a dam to define a first receiving portion and a second receiving portion, wherein the first bonding surface and the second bonding surface of the bonding electrode, the first connecting surface and the second connecting surface of the first connecting electrode, and the top surface of the second connecting electrode are coplanar.
A lead frame designed to hold two LEDs (a first and second LED) includes a substrate with three embedded electrodes: a bonding electrode, a first connecting electrode, and a second connecting electrode. The top surfaces of all three electrodes are exposed. The bonding electrode has two separate bonding surfaces, and the first connecting electrode also has two separate connecting surfaces. A reflector on the substrate's surface has a dam separating it into two sections (first and second receiving portions). The bonding electrode's two bonding surfaces, the first connecting electrode's two connecting surfaces, and the second connecting electrode's top surface all lie on the same plane.
2. The lead frame of claim 1 , wherein the first light emitting chip is received by the first receiving portion, and the second light emitting chip is received by the second receiving portion.
The lead frame described above, which holds two LEDs (a first and second LED) and includes a substrate with embedded and exposed bonding, first connecting, and second connecting electrodes, also features the first LED being placed within the reflector's first receiving portion and the second LED being placed within the reflector's second receiving portion. The reflector is separated by a dam into the two receiving portions to accommodate the LEDs.
3. The lead frame of claim 1 , wherein the dam is located at a central portion of the reflector, and a height of the dam is less than a height of a surrounding portion of the reflector.
The lead frame as described, which holds two LEDs (a first and second LED) and includes a substrate with embedded and exposed bonding, first connecting, and second connecting electrodes, also features a reflector with a dam located in the reflector's central area. The dam's height is shorter than the surrounding reflector area, creating a shallow dividing wall.
4. The lead frame of claim 3 , further comprising an encapsulation layer, the encapsulation layer covering the first and second light emitting chips therein.
The lead frame previously described, which holds two LEDs (a first and second LED) and includes a substrate with embedded and exposed bonding, first connecting, and second connecting electrodes, and also a reflector with a shorter dam in its central area, has an encapsulation layer that covers both the first and second LEDs, providing protection and environmental sealing. The encapsulation layer completely surrounds the LEDs.
5. The lead frame of claim 1 , wherein the first light emitting chip is mounted on the first bonding surface of the bonding electrode; and is electrically connected with the first connecting electrode and the bonding electrode, and the at least a second light emitting chip is mounted on the second bonding surface of the bonding electrode; and is electrically connected with first connecting electrode and the second connecting electrode.
The lead frame as described, which holds two LEDs (a first and second LED) and includes a substrate with embedded and exposed bonding, first connecting, and second connecting electrodes, also features the first LED mounted on the first bonding surface of the bonding electrode, electrically connected to the first connecting electrode and the bonding electrode itself. The second LED is mounted on the second bonding surface of the bonding electrode, electrically connected to the first connecting electrode and the second connecting electrode.
6. The lead frame of claim 1 , wherein the first light emitting chip is mounted on the first bonding surface of the bonding electrode; and electrically connected to the first bonding surface of the bonding electrode and the first connecting surface of the first connecting electrode, and the second light emitting chip is mounted on the second bonding surface of the bonding electrode; and electrically connected to the second connecting surface of the first connecting electrode and the top surface of the second connecting electrode.
The lead frame, which holds two LEDs (a first and second LED) and includes a substrate with embedded and exposed bonding, first connecting, and second connecting electrodes, features the first LED mounted on the first bonding surface of the bonding electrode, electrically connected to that first bonding surface and the first connecting surface of the first connecting electrode. The second LED is mounted on the second bonding surface of the bonding electrode, electrically connected to the second connecting surface of the first connecting electrode and the top surface of the second connecting electrode.
7. The lead frame of claim 6 , further comprising a zenzer diode, the zener diode being mounted on the first connecting electrode, and being electrically connected with the first connecting electrode and one of the first and second bonding surfaces of the bonding electrode.
The lead frame as described above, which holds two LEDs with the first LED mounted on the first bonding surface of the bonding electrode and connected to it and the first connecting surface of the first connecting electrode, and the second LED mounted on the second bonding surface of the bonding electrode and connected to the second connecting surface of the first connecting electrode and the top surface of the second connecting electrode, further includes a zener diode. This zener diode is mounted on the first connecting electrode and electrically connects to the first connecting electrode and one of the bonding electrode's bonding surfaces.
8. The lead frame of claim 6 , further comprising a zenzer diode, the zenzer diode being mounted on the second connecting electrode, and being electrically connected with the second connecting electrode and one of the first and second bonding surfaces of the bonding electrode.
The lead frame as described above, which holds two LEDs with the first LED mounted on the first bonding surface of the bonding electrode and connected to it and the first connecting surface of the first connecting electrode, and the second LED mounted on the second bonding surface of the bonding electrode and connected to the second connecting surface of the first connecting electrode and the top surface of the second connecting electrode, further includes a zener diode. This zener diode is mounted on the second connecting electrode and electrically connects to the second connecting electrode and one of the bonding electrode's bonding surfaces.
9. The lead frame of claim 1 , wherein the first light emitting chip is mounted on the first bonding surface of the bonding electrode, and electrically connects with the first bonding surface and one of the first and second connecting surfaces of the first connecting electrode, and the second light emitting chip is mounted on the second bonding surface of the bonding electrode, and electrically connects with the second bonding surface and one of the first and second connecting surfaces of the first connecting electrode, and one of the first and second connecting surfaces of the first connecting electrode electrically connects with the second connecting electrode by a wire.
The lead frame, which holds two LEDs (a first and second LED) and includes a substrate with embedded and exposed bonding, first connecting, and second connecting electrodes, also features the first LED mounted on the first bonding surface of the bonding electrode, electrically connecting to that surface and to one of the connecting surfaces of the first connecting electrode. The second LED is mounted on the second bonding surface of the bonding electrode, electrically connecting to that surface and one of the connecting surfaces of the first connecting electrode. One of the first connecting electrode's connecting surfaces is electrically connected to the second connecting electrode via a wire.
10. The lead frame of claim 9 , further comprising a zenzer diode, the zenzer diode being electrically connected with the first connecting electrode and the bonding electrode.
The lead frame as previously described, which holds two LEDs (a first and second LED) and includes a substrate with embedded and exposed bonding, first connecting, and second connecting electrodes, with LEDs wired on the electrode surfaces, further includes a zener diode. The zener diode is electrically connected between the first connecting electrode and the bonding electrode, providing voltage surge protection.
11. The lead frame of claim 10 , wherein the zenzer diode is mounted on one of the first and second connecting surfaces of the first connecting electrode, and electrically connects with the one of the first and second connecting surfaces and one of the first and second bonding surfaces of the bonding electrode.
The lead frame including two LEDs and electrodes electrically wired together, and which also includes a zener diode electrically connected between the first connecting and bonding electrodes, features the zener diode mounted on one of the first connecting electrode's connecting surfaces. It's electrically connected between that connecting surface and one of the bonding electrode's bonding surfaces.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
October 7, 2015
April 11, 2017
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