An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A lead frame for mounting a plurality of light emitting chips, wherein the plurality of light emitting chips comprises a first light emitting chip and a second light emitting chip thereon, comprising: a substrate; a bonding electrode embedded in the substrate and having a top surface, the bonding electrode comprises comprising a first bonding surface and a second bonding surface spaced apart from the first bonding surface; a first connecting electrode embedded in the substrate, and having a top surface, the first connecting electrode comprises a first connecting surface and a second connecting surface spaced apart from the first connecting surface; and a second connecting electrode embedded in the substrate and having a top surface, wherein the bonding electrode, the first connecting electrode, and the second connecting electrode are spaced from each other, and the top surfaces of the bonding electrode, the first connecting electrode, and the second connecting electrode are exposed out of the substrate, and a reflector located on the top surface of the substrate, and separated by a dam to define a first receiving portion and a second receiving portion, wherein the first bonding surface and the second bonding surface of the bonding electrode, the first connecting surface and the second connecting surface of the first connecting electrode, and the top surface of the second connecting electrode are coplanar.
2. The lead frame of claim 1 , wherein the first light emitting chip is received by the first receiving portion, and the second light emitting chip is received by the second receiving portion.
3. The lead frame of claim 1 , wherein the dam is located at a central portion of the reflector, and a height of the dam is less than a height of a surrounding portion of the reflector.
4. The lead frame of claim 3 , further comprising an encapsulation layer, the encapsulation layer covering the first and second light emitting chips therein.
5. The lead frame of claim 1 , wherein the first light emitting chip is mounted on the first bonding surface of the bonding electrode; and is electrically connected with the first connecting electrode and the bonding electrode, and the at least a second light emitting chip is mounted on the second bonding surface of the bonding electrode; and is electrically connected with first connecting electrode and the second connecting electrode.
6. The lead frame of claim 1 , wherein the first light emitting chip is mounted on the first bonding surface of the bonding electrode; and electrically connected to the first bonding surface of the bonding electrode and the first connecting surface of the first connecting electrode, and the second light emitting chip is mounted on the second bonding surface of the bonding electrode; and electrically connected to the second connecting surface of the first connecting electrode and the top surface of the second connecting electrode.
7. The lead frame of claim 6 , further comprising a zenzer diode, the zener diode being mounted on the first connecting electrode, and being electrically connected with the first connecting electrode and one of the first and second bonding surfaces of the bonding electrode.
8. The lead frame of claim 6 , further comprising a zenzer diode, the zenzer diode being mounted on the second connecting electrode, and being electrically connected with the second connecting electrode and one of the first and second bonding surfaces of the bonding electrode.
9. The lead frame of claim 1 , wherein the first light emitting chip is mounted on the first bonding surface of the bonding electrode, and electrically connects with the first bonding surface and one of the first and second connecting surfaces of the first connecting electrode, and the second light emitting chip is mounted on the second bonding surface of the bonding electrode, and electrically connects with the second bonding surface and one of the first and second connecting surfaces of the first connecting electrode, and one of the first and second connecting surfaces of the first connecting electrode electrically connects with the second connecting electrode by a wire.
10. The lead frame of claim 9 , further comprising a zenzer diode, the zenzer diode being electrically connected with the first connecting electrode and the bonding electrode.
11. The lead frame of claim 10 , wherein the zenzer diode is mounted on one of the first and second connecting surfaces of the first connecting electrode, and electrically connects with the one of the first and second connecting surfaces and one of the first and second bonding surfaces of the bonding electrode.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
October 7, 2015
April 11, 2017
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