A microelectronic assembly or package can include first and second support elements and a microelectronic element between inwardly facing surfaces of the support elements. First connectors and second connectors such as solder balls, metal posts, stud bumps, or the like face inwardly from the respective support elements and are aligned with and electrically coupled with one another in columns. The first connectors, the second connectors or both may be partially encapsulated prior to electrically coupling respective pairs of first and second connectors in columns. A method may include arranging extremities of first connectors or second connectors in a temporary layer before forming the partial encapsulation.
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1. A microelectronic assembly, comprising: first and second support elements each having first and second oppositely facing surfaces, the second surface of the first support element oriented towards the second surface of the second support element; a microelectronic element mounted to the second surface of a support element of the first and second support elements; terminals at the first surface of the first support element; electrically conductive first connectors projecting above the second surface of the first support element; electrically conductive elements at the first surface of the second support element; electrically conductive second connectors projecting above the second surface of the second support element and coupled to the first connectors; and a monolithic first encapsulation contacting the second surface of a support element of the first and second support elements, and contacting at least one of: the second surface of another support element of the first and second support elements, or a monolithic second encapsulation which contacts the second surface of the another support element, wherein each of at least some of the terminals is electrically coupled with an electrically conductive element of the electrically conductive elements through a first connector of said first connectors and a second connector of said second connectors.
A microelectronic assembly includes two support elements with a microelectronic element between them. Electrically conductive connectors (like solder balls or posts) project from each support element and connect to form columns. Terminals on the outside of one support element are electrically connected to conductive elements on the outside of the other support element through these connector columns. A monolithic encapsulation material covers at least one of the support elements and either the other support element or another encapsulation layer covering that other support element.
2. The microelectronic assembly as claimed in claim 1 , wherein a standoff height between the second surfaces of the support elements is greater than a pitch of the first connectors in at least one direction parallel to the second surface of the first support element.
The microelectronic assembly as described above also has a "standoff height" (distance) between the two support elements that is greater than the spacing (pitch) of the connectors on at least one of the support elements. This means the assembly is taller than the connectors are spaced apart.
3. The microelectronic assembly as claimed in claim 1 , wherein the microelectronic element has a face facing away from the support element to which it is mounted, and the first encapsulation contacts at least one of: the face of the microelectronic element or a third encapsulation in contact with the face of the microelectronic element.
In the microelectronic assembly described initially, the microelectronic element has a face not attached to a support element. The encapsulation material touches either this face or another encapsulation layer on this face. This provides additional protection or support for the microelectronic element.
4. The microelectronic assembly as claimed in claim 1 , wherein the microelectronic assembly includes the second encapsulation and the first encapsulation contacts the second encapsulation.
In the microelectronic assembly described initially, there is a second encapsulation layer and the first encapsulation layer touches it. This indicates multiple layers of encapsulation for improved protection or structural integrity.
5. A system including the microelectronic assembly as claimed in claim 1 , further comprising one or more additional electronic components electrically coupled with the microelectronic assembly.
A system using the microelectronic assembly described initially, combined with other electronic components electrically connected to it. This describes a larger electronic system incorporating the described microelectronic assembly.
6. The microelectronic assembly as claimed in claim 1 , further comprising third connectors each aligned with an end of one of the first connectors and aligned with an end of one of the second connectors and being joined with one of the first connectors and one of the second connectors aligned therewith, wherein coupled first, second and third connectors are aligned in respective columns which are separated from one another and from the microelectronic element by material of the first encapsulation, and each of at least some of the terminals is electrically coupled with a corresponding electrically conductive element through one of the first connectors, one of the third connectors, and one of the second connectors.
The microelectronic assembly described initially also has a third connector aligned with and joining each pair of first and second connectors, forming aligned columns within the first encapsulation. The terminals are then connected to the conductive elements through these combined first, second, and third connectors. This provides a more robust electrical connection through the assembly.
7. The microelectronic assembly as claimed in claim 6 , wherein the first encapsulation separates and insulates individual third connectors from one another.
In the microelectronic assembly with the three-connector setup from the previous description, the first encapsulation material separates and insulates each individual third connector from other third connectors. This prevents electrical shorts between the third connectors.
8. A stacked multi-chip microelectronic assembly including the microelectronic assembly as claimed in claim 1 , and a microelectronic package overlying the first support element of the microelectronic assembly, the microelectronic package having terminals connected with the terminals of the microelectronic assembly.
This is a stacked multi-chip assembly. It includes the microelectronic assembly described initially and another microelectronic package stacked on top of the first support element. The second package has terminals connected to the terminals of the original microelectronic assembly.
9. The microelectronic assembly as claimed in claim 8 , wherein the first connectors are conductive metal masses projecting from pads at the second surface of the first support element and the second connectors include solid substantially rigid metal posts.
In the stacked microelectronic assembly from the previous description, the first connectors are conductive metal masses (like solder bumps) on pads, and the second connectors are solid, rigid metal posts.
10. The microelectronic assembly as claimed in claim 9 , wherein each of individual ones of the conductive metal masses is surrounded by the first encapsulation.
In the stacked assembly described with solder bumps and rigid posts, each individual solder bump is surrounded by the first encapsulation material.
11. The microelectronic assembly as claimed in claim 8 , wherein the second connectors are conductive metal masses projecting from pads at the second surface of the second support element, each of the conductive metal masses is surrounded by the first encapsulation, and the first connectors include solid substantially rigid metal posts.
In the stacked microelectronic assembly, the second connectors are conductive metal masses surrounded by the first encapsulation, and the first connectors are solid, rigid metal posts.
12. A microelectronic assembly, comprising: a first microelectronic subassembly having a first support element having first and second oppositely facing surfaces, a plurality of electrically conductive elements at the first surface, and a plurality of electrically conductive first connectors extending away from the second surface; a second microelectronic subassembly including a second support element having first and second oppositely facing surfaces, a plurality of terminals at the first surface, and electrically conductive second connectors projecting above the second surface of the second support element and coupled to ends of the first connectors, wherein at least one microelectronic element is mounted to a second surface of at least one of the first or second support elements; dielectric reinforcing collars surrounding portions of connectors of one or more of: the first connectors, or the second connectors, the dielectric collars configured to substantially prevent collapse of the connectors reinforced thereby when the connectors reinforced thereby are joined with other connectors in forming the assembly, such that the assembly has increased height, and connections between the first and second support elements have increased aspect ratio; and an encapsulation between the second surfaces of the first and second support elements and the reinforcing collars, wherein each of at least some of the terminals is electrically coupled with an electrically conductive element of the electrically conductive elements through a first connector of said first connectors and a second connector of said second connectors, and at least one of: the first connectors and second connectors are electrically conductive masses.
A microelectronic assembly includes two sub-assemblies. The first has a support element, conductive elements, and first connectors. The second has a support element, terminals, and second connectors. The connectors are joined. At least one sub-assembly has a microelectronic element. Dielectric reinforcing collars around the connectors prevent collapse during joining, increasing assembly height and connection aspect ratio. An encapsulation fills the space between the support elements and collars. Terminals connect to conductive elements through the connectors. At least one of the connector types are conductive masses.
13. The microelectronic assembly as claimed in claim 12 , wherein a standoff height between the second surfaces of the support elements is greater than a pitch of the first connectors in at least one direction parallel to the second surface of the first support element.
The microelectronic assembly with reinforcing collars, as described above, also has a "standoff height" (distance) between the two support elements that is greater than the spacing (pitch) of the connectors on at least one of the support elements.
14. The microelectronic assembly as claimed in claim 12 , wherein the microelectronic element has a face facing away from the support element to which it is mounted, and the encapsulation contacts at least one of: the face of the microelectronic element or a third encapsulation which contacts the face of the microelectronic element.
In the microelectronic assembly with reinforcing collars, the microelectronic element has a face not attached to a support element. The encapsulation material touches either this face or another encapsulation layer on this face.
15. The microelectronic assembly as claimed in claim 12 , further comprising third connectors coupled with the first and second connectors, each third connector aligned with one of the first connectors and aligned with one of the second connectors and being joined with the first and second connectors aligned therewith, wherein coupled sets of the first, second and third connectors are aligned in respective columns and are separated from one another and from the microelectronic element by material of the encapsulation, the assembly further including terminals at the first surface of the first support element, wherein each of at least some of the terminals is electrically coupled with a corresponding electrically conductive element through one of the first connectors, one of the third connectors, and one of the second connectors.
In the microelectronic assembly with reinforcing collars, third connectors join the first and second connectors in columns, separated by encapsulation. Terminals at the first surface connect to conductive elements through these combined first, second, and third connectors.
16. The microelectronic assembly as claimed in claim 15 , wherein the encapsulation separates individual third connectors from one another.
In the microelectronic assembly including the three-connector setup and reinforcing collars, the encapsulation separates individual third connectors from one another.
17. A method of fabricating a microelectronic assembly, comprising: joining first and second subassemblies to form an assembly, the assembly having terminals at a first outwardly facing surface of the assembly and electrically conductive elements at a second outwardly facing surface of the assembly opposite from the first surface, wherein at least one of the subassemblies has at least one microelectronic element mounted to an inwardly facing second surface thereof, the microelectronic element being electrically coupled to the at least one subassembly, the first subassembly including a first support element, and the second subassembly including a second support element, and the first and second subassemblies including first connectors and second connectors, respectively, projecting above the inwardly facing second surface of such support element towards the inwardly facing second surface of the other support element, and each of at least some of the terminals is electrically coupled with an electrically conductive element of the electrically conductive elements through a first connector of said first connectors and a second connector of said second connectors, and dielectric reinforcing collars surrounding portions of connectors of one or more of: the first connectors, or the second connectors, wherein during joining of the first and second subassemblies, first connectors are joined with second connectors and the dielectric collars substantially prevent collapse of the connectors reinforced thereby, such that the assembly has increased height and connections between the first and second support elements have increased aspect ratio; and flowing an encapsulant into a space between the first and second support elements to form an encapsulation, the encapsulation separating at least portions of individual pairs of an electrically coupled first and second connectors from one another.
A method for making a microelectronic assembly by joining two sub-assemblies, creating terminals on one side and conductive elements on the other. At least one sub-assembly has a microelectronic element electrically connected to it. The sub-assemblies have first and second connectors projecting towards each other. Dielectric collars around connectors prevent collapse when joining, increasing height and connection aspect ratio. Encapsulant flows between the support elements, separating coupled connectors.
18. The method as claimed in claim 17 , wherein the encapsulation is a first encapsulation, one of the first or second subassemblies includes a second encapsulation separating the connectors thereof from one another and the first encapsulation contacts the second encapsulation.
In the assembly method, the encapsulation is a first encapsulation, and one sub-assembly has a second encapsulation separating its connectors, with the first encapsulation touching the second.
19. The method as claimed in claim 17 , wherein the first connectors and the second connectors have ends at maximum heights above the second surface of the first and second support elements, respectively, and the ends of the first connectors are aligned with and joined directly to ends of the second connectors.
In the assembly method, the connectors have maximum heights above their support elements, and their ends are aligned and directly joined together.
20. A system including the microelectronic assembly as claimed in claim 12 , further comprising one or more additional electronic components electrically coupled with the microelectronic assembly.
A system using the microelectronic assembly with reinforcing collars combined with other electronic components electrically connected to it.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
January 14, 2016
April 25, 2017
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