A method of curing a thermosetting resin composition according to the present invention includes mixing a thermosetting resin containing a benzoxazine compound and a curing accelerator containing a triazine thiol compound to prepare a thermosetting resin composition, and heating this thermosetting resin composition to be cured.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method of curing a thermosetting resin composition, comprising: preparing a thermosetting resin composition comprising a thermosetting resin containing a benzoxazine compound and a curing accelerator containing a triazine thiol compound; and heating the thermosetting resin composition to be cured, wherein the thermosetting resin contains 0.4 or less equivalents of an epoxy resin relative to one equivalent of the benzoxazine compound.
2. The method of curing the thermosetting resin composition according to claim 1 , wherein the thermosetting resin composition is heated to 50° C. or more to be cured.
3. The method of curing the thermosetting resin composition according to claim 1 , wherein the triazine thiol compound includes a compound having three or more thiol groups in one molecule.
4. The method of curing the thermosetting resin composition according to claim 1 , wherein the triazine thiol compound includes a compound having a triazine ring and a thiol group directly bound to the triazine ring.
5. The method of curing the thermosetting resin composition according claim 1 , wherein a percentage of the triazine thiol compound to an entirety of the thermosetting resin composition is within a range of 0.1 to 30% by mass.
6. The method of curing the thermosetting resin composition according to claim 1 , wherein the curing accelerator further includes imidazole.
7. The method of curing the thermosetting resin composition according to claim 1 , wherein the thermosetting resin further includes an epoxy resin.
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February 3, 2014
May 2, 2017
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