Semiconductor package including image sensor and holder with transparent cover and adhesive stopper

1. A semiconductor package comprising: an image sensor device comprising: a substrate, an image sensor chip mounted on the substrate, an adhesive layer disposed between the substrate and the image sensor chip and configured to bond the image sensor chip and the substrate to each other, a holder disposed on the substrate and surrounding the image sensor chip, the holder having an inner surface facing the image sensor chip and an outer surface opposite to the inner surface, and wherein the holder includes a hole penetrating the holder from the inner surface to the outer surface, a transparent cover combined with the holder, the transparent cover spaced apart from and facing the substrate, wherein there is a space between the image sensor chip and the transparent cover, and an adhesive stopper disposed on the outer surface of the holder and sealing the hole closed; a package substrate disposed facing the image sensor device; and a plurality of bumps including a conductive material disposed between the image sensor device and the package substrate, wherein the image sensor device is electrically connected to the package substrate through the bumps.

2. The semiconductor package of claim 1 , wherein the adhesive stopper comprises an epoxy-based material or a polyimide-based material, and wherein the adhesive layer comprises at least one of a photosensitive polymer and a thermosetting polymer.

3. The semiconductor package of claim 1 , further comprising: a plurality of inner pads disposed on a first surface of the substrate; a plurality of outer pads disposed on a second surface of the substrate opposite to the first surface of the substrate and spaced apart from the inner pads; a plurality of through-via electrodes penetrating the substrate and configured to electrically connect the inner pads to the outer pads, a plurality of bonding wires configured to electrically connect the image sensor chip to the inner pads disposed on the substrate, a plurality of first pads disposed on a first surface of the package substrate, a plurality of second pads disposed on a second surface of the package substrate opposite to the first surface of the package substrate, a plurality of package through-via electrodes penetrating the package substrate and configured to electrically connect the first pads to the second pads, and a plurality of solder balls disposed on the second pads on the second surface of the package substrate.