A power semiconductor module arrangement includes a semiconductor module having a controllable power semiconductor component, a first printed circuit board (PCB) arranged outside the semiconductor module, and a control unit arranged outside the semiconductor module and having a second PCB. The control unit is configured to control the controllable power semiconductor component. The controllable power semiconductor component has a first load terminal and a second load terminal between which a load path of the power semiconductor component is formed, and also a control terminal for controlling the load path. The first PCB has a conductor track connected in series with the load path. The first and second PCBs are spaced apart from one another and electrically connected to one another by a pin.
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1. A power semiconductor module arrangement, comprising: a semiconductor module having a controllable power semiconductor component comprising a first load terminal and a second load terminal between which a load path of the power semiconductor component is formed, and a control terminal for controlling the load path; a first printed circuit board arranged outside the semiconductor module and having a conductor track connected in series with the load path; and a control unit arranged outside the semiconductor module and configured to control the controllable power semiconductor component, the control unit comprising a second printed circuit board, wherein the first printed circuit board and the second printed circuit board are spaced apart from one another, wherein the first printed circuit board and the second printed circuit board are electrically connected to one another by a pin.
A power semiconductor module setup has a semiconductor module containing a controllable power component. This component has two load terminals forming a current path and a control terminal to manage this path. A printed circuit board (PCB) sits outside the module, featuring a conductive track in series with the current path. A control unit, also outside the module and containing a second PCB, governs the power component. The two PCBs are separated but linked electrically via a pin.
2. The power semiconductor module arrangement of claim 1 , wherein the pin is not electrically connected to the semiconductor module or is electrically connected to the semiconductor module only indirectly via the first printed circuit board and/or via the second printed circuit board.
Building upon the power semiconductor module arrangement, the pin connecting the two PCBs is either completely isolated from the semiconductor module or only indirectly connected via the first PCB and/or the second PCB. This isolates the signal between the PCB's and the semiconductor module.
3. The power semiconductor module arrangement of claim 1 , wherein the semiconductor module has a terminal of a first type which electrically connects the semiconductor module to the first printed circuit board.
Expanding on the power semiconductor module arrangement, the semiconductor module features a specific terminal type designed for electrical connection to the first PCB. This connection allows for signal or power transfer between the module and the first PCB.
4. The power semiconductor module arrangement of claim 3 , wherein the terminal of the first type is not electrically connected to the second printed circuit board or is electrically connected to the second printed circuit board only indirectly via the first printed circuit board and/or via the semiconductor module.
In the power semiconductor module arrangement incorporating a special terminal to connect the semiconductor module to the first PCB, this terminal remains isolated from the second PCB. Any electrical connection to the second PCB occurs indirectly via the first PCB and/or via the semiconductor module, maintaining signal path control.
5. The power semiconductor module arrangement of claim 3 , wherein the terminal of the first type is a press-fit contact.
Using the power semiconductor module arrangement with the special terminal connecting the semiconductor module to the first PCB, this specific terminal employs a press-fit contact. This creates a secure and reliable electrical connection using pressure instead of solder.
6. The power semiconductor module arrangement of claim 1 , wherein the semiconductor module comprises a terminal of a second type which electrically connects the semiconductor module to the second printed circuit board.
Expanding the design of the power semiconductor module arrangement, the semiconductor module also has a second type of terminal specifically designed to electrically connect the module to the second PCB for control or communication purposes.
7. The power semiconductor module arrangement of claim 6 , wherein the terminal of the second type is not electrically connected to the first printed circuit board or is electrically connected to the first printed circuit board only indirectly via the second printed circuit board and/or via the semiconductor module.
In the power semiconductor module arrangement with the second terminal connecting the semiconductor module to the second PCB, this terminal is isolated from the first PCB. Any connection to the first PCB is indirect, happening only through the second PCB and/or the semiconductor module itself. This maintains separate signal paths.
8. The power semiconductor module arrangement of claim 6 , wherein the terminal of the second type is a press-fit contact.
In the power semiconductor module arrangement which features a specific terminal connecting the semiconductor module to the second PCB, that terminal uses a press-fit contact, ensuring a secure and reliable electrical connection via pressure, not solder.
9. The power semiconductor module arrangement of claim 1 , wherein the first printed circuit board is arranged between the semiconductor module and the second printed circuit board.
In this power semiconductor module arrangement, the first PCB is physically situated between the semiconductor module and the second PCB, creating a layered structure with the first PCB acting as an intermediary.
10. The power semiconductor module arrangement of claim 1 , wherein the second printed circuit board is arranged between the semiconductor module and the first printed circuit board.
In the power semiconductor module arrangement, the second PCB is located between the semiconductor module and the first PCB, creating a sandwich structure where the second PCB acts as an intermediary.
11. The power semiconductor module arrangement of claim 10 , wherein the semiconductor module comprises a housing having a depression, and wherein the first printed circuit board extends across the depression and/or the second printed circuit board is arranged in the depression.
Building on the arrangement where the second PCB is between the semiconductor module and first PCB, the module's housing has a recess or depression. The first PCB either spans across this depression or the second PCB resides within it, optimizing space and integration.
12. The power semiconductor module arrangement of claim 1 , wherein the first printed circuit board is populated with a capacitor or with a plurality of capacitors which are electrically connected in parallel by conductor tracks of the first printed circuit board.
In this power semiconductor module arrangement, the first PCB is populated with either a single capacitor or multiple capacitors electrically linked in parallel using conductive tracks on the PCB, providing a combined capacitance for circuit stability or filtering.
13. The power semiconductor module arrangement of claim 1 , wherein the first printed circuit board and the second printed circuit board are arranged parallel to one another.
In this power semiconductor module setup, the first PCB and the second PCB are aligned parallel to each other. This arrangement facilitates efficient signal routing and heat dissipation due to uniform airflow.
14. The power semiconductor module arrangement of claim 1 , wherein the control unit comprises a first input and a second input, wherein a section of a conductor track of the first printed circuit board is electrically connected between the first input and the second input.
In this power semiconductor module configuration, the control unit contains a first input and a second input. A section of a conductive track on the first PCB is wired electrically between these two inputs, connecting the circuit on the PCB to the control unit.
15. The power semiconductor module arrangement of claim 14 , wherein a series connection, in which the section of the conductor track is connected in series with an electrical connection between the first printed circuit board and the second printed circuit board, is electrically connected between the first input and the second input.
Building on the control unit with two inputs connected via a conductor track, the circuit between the two inputs includes a series connection. The track is connected in series with an electrical link between the first and second PCBs and this series connection is between the two inputs.
16. The power semiconductor module arrangement of claim 15 , wherein the electrical connection is a plug and/or press-fit connection.
Within the power semiconductor module arrangement where a conductor track and PCB link are in series between two control unit inputs, the electrical connection between the PCBs is a plug and/or press-fit connection. This enables easy assembly and reliable contact.
17. The power semiconductor module arrangement of claim 1 , wherein the semiconductor module comprises: a plurality of first terminal pins which project from a module housing at a top side and which each have a first contact end in electrical contact with the first printed circuit board; and a plurality of second terminal pins which project from the module housing at the top side and which each have a second contact end in electrical contact with the second printed circuit board; wherein the first contact ends and the second contact ends extend away from the top side and the module housing in one direction such that the second contact ends project beyond the first contact ends.
The semiconductor module features multiple first terminal pins protruding from the top of its housing, making electrical contact with the first PCB. It also has multiple second terminal pins projecting from the housing top, contacting the second PCB. The second terminal pins extend further than the first pins, allowing them to protrude beyond the first PCB to connect to the second.
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January 25, 2016
May 23, 2017
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