The present application relates to a light emitting device package. The light emitting device package includes a package substrate in which a via hole is formed. An electrode layer extends to both surfaces of the package substrate after passing through the via hole. A light emitting device is arranged on the package substrate and is connected to the electrode layer. A fluorescence film includes a first part that fills at least a part of an internal space of the via hole and a second part that covers at least a part of the light emitting device.
Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. A light emitting device package comprising: a package substrate; an electrode layer extending along both surfaces of the package substrate; a light emitting device arranged on the package substrate and connected to the electrode layer; and a fluorescence film conformably covering a top surface and a side surface of the light emitting device and having a stepped top surface contour corresponding to contours of structures disposed underneath of the fluorescence film, the fluorescence film including: a first part covering the top surface of the light emitting device and having a first thickness, and a second part that covering the side surface of the light emitting device and having a second thickness smaller than the first thickness.
A light emitting device (LED) package includes a substrate with an LED mounted on it. An electrode layer extends along both surfaces of the substrate to connect to the LED. A fluorescence film (phosphor layer) covers the top and sides of the LED. The film has a stepped or uneven top surface reflecting the structure underneath. This fluorescence film has two parts: a thicker portion covering the LED's top surface and a thinner portion covering the LED's side surface. The varying thickness of the film optimizes light emission and color uniformity.
2. The light emitting device package of claim 1 , wherein the fluorescence film is integrally connected from the first part to the second part.
The light emitting device package from the previous description has a fluorescence film (phosphor layer) that is a single, continuous piece, seamlessly connected from the thicker part covering the LED's top to the thinner part covering its sides. This one-piece construction simplifies manufacturing and improves structural integrity, preventing delamination between the two thickness sections.
3. The light emitting device package of claim 1 , further comprising: a reflective film interposed between the side surface of the light emitting device and the second part of the fluorescence film.
The light emitting device package from the description of the LED package with a fluorescence film, also includes a reflective film positioned between the side of the LED and the thinner side portion of the fluorescence film (phosphor layer). This reflective film bounces light emitted from the LED back outwards, increasing light extraction efficiency and overall brightness of the LED package.
4. The light emitting device package of claim 3 , wherein the reflective film covers a part of the electrode layer and the side surface of the light emitting device on the package substrate.
In the light emitting device package with the reflective film, the reflective film extends from covering a part of the electrode layer on the substrate up to covering the side surface of the LED. This ensures maximum light reflection and prevents light loss from the sides of the LED, improving overall efficiency.
5. The light emitting device package of claim 1 , wherein the second part of the fluorescence film directly contacts with the side surface of the light emitting device.
In the light emitting device package described previously, the thinner part of the fluorescence film (phosphor layer) directly touches the side surface of the LED. There are no intervening layers. This direct contact promotes efficient energy transfer from the LED to the phosphor, improving color conversion and light output.
6. The light emitting device package of claim 1 , further comprising: a lens unit covering the light emitting device and the fluorescence film.
The light emitting device package, as previously described with the substrate, LED, electrode, and fluorescence film, further includes a lens unit. This lens covers the LED and the fluorescence film (phosphor layer), shaping and directing the light emitted from the package to achieve a desired beam angle and light distribution.
7. The light emitting device package of claim 1 , wherein the fluorescence film includes: a phosphor of a first volume %, a polymer resin of a second volume % that is greater than the first volume %, and filler particles of a third volume % that is smaller than the first volume %.
In the light emitting device package with the fluorescence film (phosphor layer), the film's composition includes: a certain volume percentage of phosphor material, a larger volume percentage of polymer resin which acts as a binder, and a smaller volume percentage of filler particles. The resin holds the phosphor and filler together, while the filler particles influence the film's optical properties and mechanical strength.
8. The light emitting device package of claim 7 , wherein the filler particles are formed of at least one of TiO 2 , SiO 2 , Al 2 O 3 and AlN.
The light emitting device package, with the phosphor, resin, and filler particles in the fluorescence film, specifies that the filler particles are made of at least one of these materials: titanium dioxide (TiO2), silicon dioxide (SiO2), aluminum oxide (Al2O3), or aluminum nitride (AlN). These materials have high refractive indices and improve light scattering and extraction from the phosphor layer.
9. The light emitting device package of claim 1 , wherein the fluorescence film further includes a third part covering the electrode layer, the third part of the fluorescence film having a third thickness greater than the second thickness.
In addition to the thinner and thicker sections, the fluorescence film (phosphor layer) in the light emitting device package also includes a third part. This third part covers the electrode layer on the substrate and has a thickness greater than the thinner part covering the side of the LED, but not necessarily greater than the thickest part. This thicker section over the electrodes helps to provide more even light distribution.
10. The light emitting device package of claim 9 , wherein the fluorescence film is integrally connected from the first part via the second part to the third part.
The light emitting device package, which has the three-part fluorescence film (phosphor layer), is constructed such that the fluorescence film is a single, continuous piece, seamlessly connected from the thickest part covering the top of the LED, to the thinner part covering the side, to the third part covering the electrode layer. This one-piece design simplifies manufacturing and improves reliability.
11. A light emitting device package comprising: a package substrate including a mounting surface, a back surface opposite to the mounting surface, and a first via hole and a second via hole; a first electrode layer extending through the first via hole and along the mounting surface and the back surface; a second electrode layer extending through the second via hole and along the mounting surface and the back surface; a light emitting device arranged on at least one of the first electrode layer and the second electrode layer on the mounting surface of the package substrate; and a fluorescence film conformably covering a top surface and a side surface of the light emitting device and having a. stepped top surface contour corresponding to contours of structures disposed underneath of the fluorescence film the fluorescence film including: a first part covering the top surface of the light emitting device and having a first thickness, and a second part that covering the side surface of the light emitting device and having a second thickness smaller than the first thickness.
A light emitting device (LED) package includes a substrate with a mounting surface, back surface, and two via holes. First and second electrode layers extend through the via holes and along both surfaces. An LED is placed on the mounting surface, connected to at least one of the electrode layers. A fluorescence film (phosphor layer) covers the LED's top and sides, having a stepped top surface that mirrors the underlying structure. This film has a thicker portion on top and a thinner portion on the sides of the LED.
12. The light emitting device package of claim 11 , wherein the light emitting device is arranged at a location that is spaced apart from the first via hole and the second via hole on the mounting surface.
The invention relates to a light emitting device package designed to improve thermal management and electrical connectivity. The package includes a substrate with a mounting surface for a light emitting device, such as an LED. The substrate contains at least two via holes that extend through it, allowing electrical connections to be made from the mounting surface to the opposite side of the substrate. These via holes are spaced apart from each other and are positioned to avoid interference with the light emitting device. The device itself is mounted on the substrate at a location that is intentionally spaced apart from both via holes, ensuring that heat dissipation and electrical performance are optimized. The via holes may be filled with conductive material to facilitate electrical connections while maintaining structural integrity. This design helps prevent thermal buildup near the light emitting device, improving reliability and efficiency. The package may also include additional features, such as reflective surfaces or heat sinks, to further enhance performance. The invention addresses challenges in LED packaging, particularly in balancing electrical connectivity, thermal management, and compact design.
13. The light emitting device package of claim 11 , further comprising: a first conductive junction layer that is formed between the light emitting device and the first electrode layer; and a second conductive junction layer that is formed between the light emitting device and the second electrode layer.
The light emitting device package with the two electrode layers, also contains a first conductive junction layer between the LED and the first electrode layer, and a second conductive junction layer between the LED and the second electrode layer. These junction layers ensure a good electrical contact and low electrical resistance between the LED and the electrode layers, improving device performance.
14. The light emitting device package of claim 11 , further comprising: a conductive wire that is connected between at least one of the first electrode layer and the second electrode layer, and the light emitting device, wherein the fluorescence film further includes a third part covering at least a part of the conductive wire.
The light emitting device package, which has the first and second electrodes and vias, further includes a conductive wire connecting at least one of the electrode layers to the LED. The fluorescence film (phosphor layer) also covers part of this wire. Covering the wire with phosphor ensures that light generated by the LED and converted by the phosphor is evenly distributed, and minimizes light loss from the wire.
15. The light emitting device package of claim 11 , further comprising: a reflective film formed on the first and second electrode layers and interposed between the side surface of the light emitting device and the second part of the fluorescence film.
In the light emitting device package, with the dual electrodes and vias, a reflective film is placed on the first and second electrode layers and positioned between the side of the LED and the thinner side portion of the fluorescence film (phosphor layer). This reflective film reflects light outwards, increasing the overall efficiency and brightness of the LED package.
16. The light emitting device package of claim 11 , wherein the second part of the fluorescence film directly contacts with the side surface of the light emitting device.
In the light emitting device package, which has the two electrodes and vias, the thinner part of the fluorescence film (phosphor layer) directly touches the side surface of the LED. This direct contact ensures efficient energy transfer between the LED and the phosphor, improving color conversion and reducing energy loss.
17. A light dimming system comprising: a light emitting module; a power supply for receiving power and supplying the power to the light emitting module; and one or more light emitting device packages, each package including: a package substrate in which a via hole is formed; an electrode layer extending through the via hole and along both surfaces of the package substrate; a light emitting device arranged on the package substrate and connected to the electrode layer; and a fluorescence film conformably covering a top surface and a side surface of the light emitting device and having a stepped top surface contour corresponding to contours of structures disposed underneath of the fluorescence film, the fluorescence film including: a first part covering the top surface of the light emitting device and having a first thickness, and a second part that covering the side surface of the light emitting device and having a second thickness smaller than the first thickness.
A light dimming system consists of a light emitting module, a power supply, and one or more light emitting device (LED) packages. Each LED package includes a substrate with a via hole, an electrode layer extending through the via hole, an LED connected to the electrode, and a fluorescence film (phosphor layer) covering the LED's top and sides. The film has a stepped top surface and is thicker on top of the LED and thinner on the sides.
18. The system of claim 17 , wherein the fluorescence film is integrally connected from the first part to the second part.
The light dimming system using the LED packages with fluorescence film has a film that is a single, continuous piece, seamlessly connected from the thicker part covering the LED's top to the thinner part covering its sides. This simplifies manufacturing and improves structural integrity.
19. The system of claim 17 , further comprising: a reflective film interposed between the side surface of the light emitting device and the second part of the fluorescence film.
The light dimming system using the LED packages includes a reflective film positioned between the side of the LED and the thinner side portion of the fluorescence film (phosphor layer). This reflective film helps to improve light extraction and increase overall brightness.
20. The system of claim 17 , wherein the fluorescence film includes: a phosphor of a first volume %, a polymer resin of a second volume % that is greater than the first volume %, and filler particles of a third volume % that is smaller than the first volume %.
The light dimming system with the specific LED package fluorescence film has a film composed of a certain volume percentage of phosphor, a greater volume percentage of polymer resin (binder), and a smaller volume percentage of filler particles.
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May 19, 2015
June 27, 2017
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