Production of a holding apparatus (100) for electrostatically holding a component, e.g., silicon wafer (1), includes connecting plate-type first holding element (11, 12) and plate-type core element (13), first holding element (11, 12) having first electrode device (20) and spanning support surface for receiving component (1), and the connecting includes the steps: providing liquid adhesive to at least one of the mutually facing surfaces of first holding element (11, 12) and core element (13), aligning first holding element (11, 12) with first forming tool (40) such that support surface is matched to predetermined master surface (41) of first forming tool (40), and curing the adhesive, wherein first adhesive connecting layer (15) is formed, which has thickness variations constituted by form deviations between support surface and at least one of the mutually facing surfaces. Also described is a holding apparatus (100) configured to electrostatically hold a component, e.g., silicon wafer (1).
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1. A method for producing a holding apparatus adapted to electrostatically hold a component, comprising the step: connecting a plate-type first holding element and a plate-type core element, wherein the first holding element comprises a first electrode device and spans a support surface for receiving the component, wherein the connecting step comprises: providing a liquid adhesive to at least one of mutually facing surfaces of the first holding element and of the core element, aligning the first holding element with a first forming tool in such a manner that the support surface is matched to a predetermined master surface of the first forming tool, said master surface determining a desired planar or curved form laterally extending along the support surface, and curing the adhesive, wherein a first adhesive connecting layer is formed, which has thickness variations that are constituted by form deviations between a form of the support surface and surface forms of at least one of the mutually facing surfaces of the first holding element and of the core element along lateral extensions thereof.
A method for manufacturing an electrostatic chuck (a holding apparatus) involves bonding a plate-like holding element to a plate-like core element using liquid adhesive. The holding element has an electrode and a support surface for holding a component like a silicon wafer. The process includes applying liquid adhesive to the joining surfaces, aligning the holding element against a forming tool so the support surface matches the tool's master surface (which defines a flat or curved shape). Curing the adhesive creates a connecting layer with variable thickness, compensating for any deviations between the support surface and the joining surfaces of the holding element and core element.
2. The method according to claim 1 , wherein the aligning of the first holding element comprises pressing the first holding element on to the core element by use of the first forming tool, in such a manner that the first adhesive connecting layer has a thickness of less than 100 μm.
In the electrostatic chuck manufacturing method, as described in claim 1, the holding element is pressed onto the core element using the forming tool during alignment. This ensures the adhesive connecting layer is very thin, less than 100 micrometers, creating a strong, precise bond. This provides good thermal and electrical contact between the holding element and the core element, necessary for efficient electrostatic clamping.
3. The method according to claim 1 , wherein the aligning of the first holding element comprises stress-free mounting of the first holding element and of the core element on a dimensionally stable platform.
In the electrostatic chuck manufacturing method, as described in claim 1, the holding element and the core element are mounted on a dimensionally stable platform to ensure stress-free alignment. This prevents warping or distortion during adhesive curing, maintaining the flatness or curvature of the support surface defined by the forming tool. This ensures accurate and reliable electrostatic holding of components.
4. The method according to claim 1 , wherein during the curing of the adhesive, the first holding element is positively connected to the first forming tool.
This invention relates to a method for manufacturing a composite component, particularly for aerospace applications, where precise alignment and bonding of composite layers are critical. The method addresses challenges in maintaining accurate positioning of composite layers during the curing process, where thermal expansion and adhesive flow can cause misalignment, leading to structural weaknesses. The method involves using a first forming tool to shape a first composite layer and a first holding element to secure the layer in place. During the curing of the adhesive, the first holding element is positively connected to the first forming tool, ensuring that the composite layer remains precisely aligned. Positive connection, such as mechanical interlocking or clamping, prevents relative movement between the holding element and the forming tool, maintaining dimensional stability. This connection compensates for thermal expansion and adhesive flow, ensuring the composite layers bond correctly without shifting. The method may also include additional forming tools and holding elements for multi-layer composites, where each layer is sequentially aligned and bonded. The result is a composite component with improved structural integrity and dimensional accuracy, suitable for high-performance applications.
5. The method according to claim 1 , wherein the master surface of the first forming tool is planar, or curved in such a manner that the support surface of the first holding element is planar following a shrinkage of the adhesive.
In the electrostatic chuck manufacturing method, as described in claim 1, the forming tool's master surface is either flat or curved in a specific way to compensate for adhesive shrinkage during curing. This ensures that after the adhesive cures and shrinks, the holding element's support surface achieves the desired flatness or curvature. This ensures the component makes full contact with the electrostatic chuck's surface.
6. The method according to claim 1 , wherein the first holding element has a multiplicity of projecting first burls, whose free ends span the support surface for receiving the component and bear against the master surface of the first forming tool during the aligning of the first holding element and the curing of the adhesive.
In the electrostatic chuck manufacturing method, as described in claim 1, the holding element has many small, raised bumps (burls) that define the support surface. During alignment and curing, these burls press against the forming tool's master surface. This defines the precise plane or curvature of the holding surface to match the shape of components to be held.
7. The method according to claim 1 , wherein following the connecting of the first holding element and the core element, structuring of the first holding element is effected in such a manner that a multiplicity of projecting first burls are formed, whose free ends span the support surface for receiving the component.
In the electrostatic chuck manufacturing method, as described in claim 1, small, raised bumps (burls) are created on the holding element *after* it has been bonded to the core element. These burls define the support surface for the component. The burls provide a defined contact area for electrostatic clamping, improving the holding force and stability of the component.
8. The method according to claim 1 , further comprising the step connecting a plate-type second holding element and the core element, wherein the second holding element has a second electrode device and spans a carrier surface for carrying the holding apparatus on a platform, and the connecting of the second holding element and the core element comprises: providing the adhesive on at least one of the mutually facing surfaces of the second holding element and of the core element, aligning the second holding element with a second forming tool in such a manner that the carrier surface is matched to a predetermined master surface of the second forming tool, and curing the adhesive, wherein a second adhesive connecting layer is formed, which has thickness variations that are constituted by form deviations between the carrier surface and at least one of the mutually facing surfaces of the second holding element and of the core element.
The electrostatic chuck manufacturing method also includes bonding a second plate-like holding element to the *opposite* side of the core element. This second holding element includes another electrode and a carrier surface for mounting the apparatus to a platform. Adhesive is applied between the second holding element and the core element. The second holding element is aligned using a second forming tool so the carrier surface matches the tool's master surface. Curing the adhesive forms a connecting layer, which compensates for deviations between the carrier surface and the joining surfaces.
9. The method according to claim 8 , wherein the connecting of the first holding element and of the core element, and the connecting of the second holding element and of the core element, are effected simultaneously, wherein the aligning of the first holding element and of the second holding element comprises setting a working distance between the first forming tool and the second forming tool.
In the electrostatic chuck manufacturing method described in claim 8, the bonding of the *first* holding element (component support) and the *second* holding element (platform carrier) to the core element happens simultaneously. The alignment step involves setting a specific distance between the two forming tools. This allows for parallel manufacturing and accurate thickness control of the core element.
10. The method according to claim 8 , wherein the connecting of the first holding element and of the core element, and the connecting of the second holding element and of the core element, are effected sequentially.
In the electrostatic chuck manufacturing method described in claim 8, the bonding of the *first* holding element (component support) and the *second* holding element (platform carrier) to the core element happens one after the other. This sequential approach may be preferable for specific material combinations or manufacturing constraints.
11. The method according to claim 8 , including at least one of the features of the aligning of the second holding element comprises pressing the second holding element on to the core element by use of the second forming tool in such a manner that the second adhesive connecting layer has a thickness of less than 100 μm, during the curing of the adhesive, the second holding element is positively connected to the second forming tool, and the master surface of the second forming tool is planar, or curved in such a manner that the carrier surface of the second holding element is planar following a shrinkage of the adhesive.
In the electrostatic chuck manufacturing method described in claim 8, the *second* holding element (platform carrier) bonding process shares similar features to the first: The second holding element is pressed onto the core element using the second forming tool to ensure the adhesive layer is less than 100 μm thick. The second holding element is positively connected to the forming tool during curing. The master surface of the second forming tool is shaped (planar or curved) to compensate for adhesive shrinkage, ensuring the carrier surface achieves the desired shape.
12. The method according to claim 8 , wherein the second holding element has a multiplicity of projecting second burls, whose free ends span the carrier surface for carrying the holding apparatus on the platform and bear against the master surface of the second forming tool during the aligning of the second holding element and the curing of the adhesive.
In the electrostatic chuck manufacturing method described in claim 8, the *second* holding element (platform carrier) has many small, raised bumps (burls) on its carrier surface. During alignment and adhesive curing, these burls press against the forming tool's master surface. This defines the precise shape of the carrier surface for mounting the apparatus.
13. The method according to claim 8 , wherein following the connecting of the second holding element and the core element, structuring of the second holding element is effected in such a manner that a multiplicity of projecting first burls are formed, whose free ends span the carrier surface for carrying the holding apparatus on the platform.
In the electrostatic chuck manufacturing method described in claim 8, small, raised bumps (burls) are created on the *second* holding element (platform carrier) *after* bonding it to the core element. The bumps define the carrier surface for mounting the electrostatic chuck to a platform. The burls ensure stable contact between the chuck and the platform.
14. The method according to claim 1 , wherein the adhesive has at least one of the features the adhesive has a viscosity of less than 1000 cPs, and the adhesive has a curing volume shrinkage of less than 5%.
In the electrostatic chuck manufacturing method, as described in claim 1, the liquid adhesive has specific properties: a low viscosity (less than 1000 centipoise) for easy application and thin layer formation, and low volume shrinkage during curing (less than 5%) to minimize distortion of the holding element's support surface.
15. A holding apparatus adapted to electrostatically hold a component, comprising: a basic body, which comprises a plate-type first holding element and a plate-type core element, wherein the first holding element comprises a multiplicity of projecting first burls, whose free ends span a support surface for receiving the component, said support surface having a planar or curved form laterally extending along the support surface, and a first electrode device, wherein mutually facing surfaces of the first holding element and of the core element are connected to each other via a first adhesive connecting layer, and the first adhesive connecting layer comprises thickness variations that are constituted by form deviations between the form of the support surface and surface forms of at least one of the mutually facing surfaces of the first holding element and of the core element along lateral extensions thereof.
An electrostatic chuck for holding components comprises a base. The base consists of a plate-like first holding element bonded to a plate-like core element. The first holding element includes numerous projecting bumps (burls) that define a planar or curved support surface for the component. An electrode is included within the holding element. The holding element and core element are bonded with an adhesive layer that has thickness variations, to compensate for any shape differences between the support surface and the joining surfaces of the holding element and core element.
16. The holding apparatus according to claim 15 , wherein the basic body further comprises a plate-type second holding element, which is connected to the core element, opposite the first holding element, the second holding element comprising a multiplicity of projecting second burls, whose free ends span a carrier surface for carrying the holding apparatus on a platform, and a second electrode device, mutually facing surfaces of the second holding element and of the core element are connected to each other via a second adhesive connecting layer, and the second adhesive connecting layer comprises thickness variations that are constituted by form deviations between the carrier surface and at least one of the mutually facing surfaces of the second holding element and of the core element.
The electrostatic chuck contains a base consisting of a first holding element, a core element, and a second holding element. The first holding element contains burls to create a component holding surface, and an electrode. The second holding element is connected to the opposite side of the core, with bumps on its surface for mounting to a platform, and a second electrode. The joining surfaces of the second holding element and core element are bonded using a second adhesive layer, with thickness variations that account for any shape differences between the carrier surface and the joining surfaces.
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May 28, 2015
August 8, 2017
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