A method for processing a semiconductor wafer where an opaque layer is located on a surface of a handling wafer is used so the surface of the handling wafer may be detected through optical sensors. The opaque layer may be modified, or oriented, to allow light to pass through unobstructed.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A semiconductor structure comprising: a support wafer, wherein the support wafer comprises a transparent wafer and an opaque surface on at least a portion of a surface of the transparent wafer; a semiconductor wafer bonded to the support wafer.
2. The structure of claim 1 , wherein the opaque surface covers an entire surface of the support wafer.
3. The structure of claim 2 , wherein the opaque surface is frosted glass.
4. The structure of claim 1 , wherein the opaque surface covers only an outer edge of a surface of the support wafer.
5. The structure of claim 4 , wherein the opaque surface comprises at least a metal, a metal nitride or a metal oxide.
6. The structure of claim 4 , wherein the opaque surface covers only an outer annular edge of a the surface of the support wafer.
7. The structure of claim 6 , wherein the transparent wafer and opaque surface are separate layers in direct contact with each other.
8. The structure of claim 7 , further comprising a clarifying layer on the opaque surface.
9. The structure of claim 8 , wherein the clarifying layer includes a similar refractive index as the opaque surface.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
October 28, 2014
August 8, 2017
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