The present disclosure describes proximity sensor modules that include a time-of-flight (TOF) sensor. The module can include a plurality of chambers corresponding, respectively, to a light emission channel and a light detection channel. The channels can be optically separated from one another such that light from a light emitter element in the light emission chamber does not impinge directly on light sensitive elements of the TOF sensor in the light detection chamber. To achieve a module with a relatively small footprint, some parts of the TOF sensor can be located within the light emission chamber.
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1. A proximity sensor module comprising: a light emitter element to generate light, at least some of which is directed out of the module; and a time-of-flight sensor including spatially distributed light sensitive elements and including circuitry to read and process signals from the light sensitive elements; and the module having a plurality of chambers, wherein the light emitter and a first group of the light sensitive elements are in a first one of the chambers, and wherein a second group of the light sensitive elements is in a second one of the chambers, wherein the first and second chambers are optically separated from one another such that light from the light emitter does not impinge directly from the light emitter onto the second group of light sensitive elements in the second chamber.
A proximity sensor module includes a light emitter that sends light outwards. It also contains a time-of-flight (TOF) sensor with light-sensitive elements (pixels) and circuits to process their signals. The module has multiple chambers. The light emitter and some pixels are in the first chamber, while the remaining pixels are in a second chamber. These chambers are optically separated to prevent direct light from the emitter reaching the pixels in the second chamber. This design miniaturizes the module by placing sensor parts within the emitter chamber while preventing light interference.
2. The proximity sensor module of claim 1 including an interior wall to separate the first and second chambers, wherein the interior wall has a bridge portion extending over a surface of the time-of-flight sensor.
A proximity sensor module includes a light emitter that sends light outwards and a time-of-flight (TOF) sensor. The TOF sensor contains light-sensitive elements (pixels) and circuits to process their signals. The module has multiple chambers, with the light emitter and some pixels in a first chamber, and the remaining pixels in a second chamber. An interior wall separates the chambers to prevent direct light interference from the emitter. The interior wall has a bridge portion that extends over the surface of the TOF sensor. This bridge allows separation while maintaining a compact design.
3. The proximity sensor module of claim 1 wherein the second group of light sensitive elements includes detection pixels arranged to provide signals for determining a proximity of an object outside the module.
A proximity sensor module includes a light emitter that sends light outwards and a time-of-flight (TOF) sensor. The TOF sensor contains light-sensitive elements (pixels) and circuits to process their signals. The module has multiple chambers, with the light emitter and some pixels in a first chamber, and the remaining pixels in a second chamber. These chambers are optically separated to prevent direct light from the emitter. The pixels in the second chamber are detection pixels. They measure reflected light and provide signals to determine the proximity of an object outside the module.
4. The proximity sensor module of claim 3 wherein the first group of light sensitive elements includes reference pixels arranged to provide signals for compensating for drift or to provide a zero distance measurement.
A proximity sensor module includes a light emitter that sends light outwards and a time-of-flight (TOF) sensor. The TOF sensor contains light-sensitive elements (pixels) and circuits to process their signals. The module has multiple chambers, with the light emitter and some pixels in a first chamber, and the remaining pixels in a second chamber. These chambers are optically separated. The pixels in the second chamber are detection pixels used for proximity measurements. The pixels in the first chamber are reference pixels. They generate signals to compensate for sensor drift or to provide a zero-distance measurement.
5. The proximity sensor module of claim 3 further including pixels arranged to provide signals to correct for a spurious reflection.
A proximity sensor module includes a light emitter that sends light outwards, a time-of-flight (TOF) sensor with pixels and signal processing circuits, and multiple chambers. The light emitter and some pixels are in a first chamber, with remaining pixels in a second chamber, separated to avoid direct light. The pixels in the second chamber are detection pixels for proximity sensing. The module also includes pixels arranged to provide signals for correcting spurious reflections, thus improving accuracy.
6. The proximity sensor module of claim 1 further including a respective optical filter coating over each of the first and second chambers.
A proximity sensor module includes a light emitter, a time-of-flight sensor with pixels and signal processing circuits, and multiple separated chambers. The light emitter and some pixels are in the first chamber, with remaining pixels in the second chamber, to avoid direct light interference. It also has an optical filter coating over each of the first and second chambers. The coatings filter specific wavelengths of light, enhancing the signal-to-noise ratio for proximity detection.
7. A proximity sensor module comprising: a light emitter element to generate light, at least some of which is directed out of the module; a time-of-flight sensor including spatially distributed light sensitive elements and including circuitry to read and process signals from the light sensitive elements, wherein some of the light sensitive elements are arranged to provide reference signals based on light from the light emitter element, and wherein other ones of the light sensitive elements are arranged to provide detection signals in response to light entering the module; the module having a plurality of chambers, a first one of the chambers including the light emitter and including the light sensitive elements arranged to provide the reference signals, and a second one of the chambers including the light sensitive elements arranged to provide the detection signals, wherein the first and second chambers are optically separated from one another by an interior wall such that light from the light emitter does not impinge directly on the light sensitive elements arranged to provide the detection signals.
A proximity sensor module uses a light emitter that generates light directed outwards, and a time-of-flight (TOF) sensor containing light-sensitive elements (pixels) with circuitry to process signals. Some pixels generate reference signals based on light from the emitter, while others provide detection signals based on incoming light. The module uses multiple chambers. The first chamber contains the light emitter and reference-signal pixels. The second chamber houses the detection-signal pixels. An interior wall optically separates the two chambers, blocking direct emitter light from reaching the detection pixels, thus isolating the reflected signal.
8. The proximity sensor module of claim 7 wherein the interior wall includes a bridge portion extending over a surface of the time-of-flight sensor.
A proximity sensor module has a light emitter, a time-of-flight (TOF) sensor with pixels and processing circuits, and multiple chambers. Some pixels generate reference signals from the emitter light, others generate detection signals from incoming light. The first chamber holds the emitter and reference pixels, while the second chamber holds the detection pixels. An interior wall separates the chambers to block direct light interference from the emitter. The interior wall also includes a bridge portion extending over the surface of the TOF sensor for structural support or to minimize space.
9. The proximity sensor module of claim 7 wherein some of the light sensitive elements in the time-of-flight sensor further are arranged to provide signals for correction of optical cross-talk.
A proximity sensor module features a light emitter, a TOF sensor with pixels and processing circuits, and multiple chambers. Reference pixels use emitter light, and detection pixels use incoming light. An interior wall separates the first chamber (emitter and reference pixels) from the second chamber (detection pixels). Some TOF sensor pixels are also arranged to provide signals for correcting optical cross-talk, which is unwanted light interference between pixels. This increases detection accuracy.
10. The proximity sensor module of claim 7 the light emitter element and the time-of-flight sensor are mounted on a first surface of a printed circuit board, and wherein an integrated circuit is mounted in a cavity on the opposite surface of the printed circuit board.
A proximity sensor module has a light emitter, a TOF sensor with pixels and processing circuits, and multiple chambers, with reference and detection pixels. These components are mounted on one side of a printed circuit board (PCB). An integrated circuit (IC) is mounted in a cavity on the opposite side of the PCB. This arrangement allows for a compact design, placing the control electronics directly behind the sensing elements.
11. The proximity sensor module of claim 7 wherein the time-of-flight sensor is at an angle with respect to an edge of a printed circuit board on which the light emitter element is mounted.
A proximity sensor module has a light emitter, a time-of-flight (TOF) sensor with pixels and processing circuits, and multiple separated chambers. The module is mounted on a printed circuit board (PCB). The TOF sensor is positioned at an angle with respect to an edge of the PCB. This angled placement may be used to optimize the field of view or reduce the module's overall footprint.
12. The proximity sensor module of claim 7 further including a first beam shaping member arranged to direct light from the light emitter element out of the module, and a second beam shaping element arranged to direct light received from outside the module to the light sensitive elements that serve as the detection signals.
A proximity sensor module has a light emitter and a TOF sensor with light sensitive elements and processing. Some of the light sensitive elements provide reference signals while others provide detection signals. It has multiple chambers. A first beam shaping element directs light from the emitter out of the module. A second beam shaping element directs incoming light to the detection light sensitive elements. This allows for precise control over the emitted and received light paths.
13. The proximity sensor module of claim 12 including a spacer separating a printed circuit board on which the light emitter element is mounted from an optics assembly including the first and second beam shaping elements.
A proximity sensor module uses a light emitter, a time-of-flight (TOF) sensor with pixels, and beam shaping optics to direct light. The light emitter is mounted on a printed circuit board (PCB). A spacer separates the PCB from an optics assembly, which includes first and second beam shaping elements for directing emitted and received light, respectively. The spacer provides precise alignment and distance control between the emitter and the optics.
14. The proximity sensor module of claim 7 further including a reflector to reflect some light from the light emitter element to the light sensitive elements that provide the reference signals.
A proximity sensor module includes a light emitter, a time-of-flight (TOF) sensor containing light-sensitive elements that provide reference signals and detection signals, and a reflector. The reflector redirects some light from the light emitter towards the light-sensitive elements that provide reference signals. This configuration enhances the reference signal strength, improving the accuracy of the proximity measurements.
15. The proximity sensor module of claim 14 wherein the reflector is formed as a unitary piece with a spacer that separates a printed circuit board on which the light emitter element is mounted from an optics assembly including the first and second beam shaping elements.
A proximity sensor module has a light emitter, a time-of-flight sensor, beam-shaping optics, and a printed circuit board. A spacer separates the PCB from the optics assembly. A reflector, which reflects light from the emitter to reference pixels, is a unitary piece with the spacer. This simplifies manufacturing and ensures consistent alignment of the reflector and spacer.
16. The proximity sensor module of claim 15 wherein the reflector is composed of a same material as the spacer.
A proximity sensor module includes a light emitter, a time-of-flight sensor, a printed circuit board, a spacer, and beam-shaping optics. A reflector directs emitter light to reference pixels. The reflector is a unitary piece with the spacer and is composed of the same material as the spacer. This simplifies manufacturing and material sourcing.
17. The proximity sensor module of claim 16 wherein the reflector is composed of a material that is non-transparent to a wavelength of light emitted by the light emitter element.
A proximity sensor module includes a light emitter, a time-of-flight sensor, a printed circuit board, a spacer, and beam-shaping optics. A reflector, made of the same material as the spacer, directs light from the emitter to the reference pixels. The reflector is composed of a material that is non-transparent to the wavelength of light emitted by the light emitter. This ensures effective reflection of light to the reference pixels.
18. The proximity sensor module of claim 12 further including a baffle laterally surrounding the first and second beam shaping elements.
A proximity sensor module uses a light emitter, a TOF sensor, and first and second beam shaping elements to direct light. A baffle laterally surrounds the first and second beam shaping elements. The baffle reduces stray light and improves the signal-to-noise ratio.
19. The proximity sensor module of claim 7 wherein the spatially distributed light sensitive elements are pixels, wherein some of the pixels are dedicated to provide the reference signals based on light from the light emitter element, and wherein other ones of the pixels are dedicated to provide the detection signals in response to light entering the module.
A proximity sensor module comprises a light emitter, a time-of-flight sensor including spatially distributed pixels, and circuitry to process signals. Some pixels are dedicated to providing reference signals based on light from the emitter. Other pixels are dedicated to providing detection signals in response to incoming light. Having dedicated pixels improves signal clarity.
20. A method of fabricating a proximity sensor module, the method comprising: providing a printed circuit board having a surface on which are mounted a light emitter element and a flight-of-time sensor, wherein the time-of-flight sensor includes spatially distributed light sensitive elements and includes circuitry to read and process signals from the light sensitive elements, wherein some of the light sensitive elements are to provide reference signals based on light from the light emitter element, and wherein other ones of the light sensitive elements are to provide detection signals in response to light entering the module; attaching a spacer to the surface of the printed circuit board such that the spacer laterally surrounds the light emitter element and the time-of-flight sensor, the spacer including first and second partial interior wall extensions separated from one another by the flight-of-time sensor; forming a bridge extension over the time-of-flight sensor, the bridge extension connecting the first and second partial interior wall extensions to one another, wherein the light emitter element and the light sensitive elements to provide the reference signals are disposed to one side of the bridge extension, and wherein the light sensitive elements to provide the detection signals are disposed to another side of the bridge extension; and attaching an optics member over the spacer, wherein the optics member includes beam shaping elements arranged, respectively, to direct light from the light emitter element out of the module and to direct incoming light to the light sensitive elements arranged to provide the detection signals.
A method for fabricating a proximity sensor module involves mounting a light emitter and a time-of-flight sensor on a printed circuit board. The TOF sensor has pixels for reference and detection signals. A spacer is attached to surround the emitter and sensor, featuring partial interior wall extensions separated by the sensor. A bridge extension connects the wall extensions over the sensor, placing the emitter/reference pixels on one side and detection pixels on the other. An optics member with beam shaping elements is attached over the spacer to direct emitted and received light.
21. The method of claim 20 wherein forming the bridge extension includes dispensing a non-transparent epoxy material that connects the partial interior wall extensions.
A method for fabricating a proximity sensor module involves mounting a light emitter and a time-of-flight sensor with reference and detection pixels on a printed circuit board. A spacer with partial interior wall extensions is attached. A bridge extension connects the wall extensions over the sensor. The bridge extension is formed by dispensing a non-transparent epoxy material that connects the partial interior wall extensions, ensuring optical isolation. An optics member with beam shaping elements is attached over the spacer.
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July 23, 2015
August 29, 2017
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