A package includes a device die, and an encapsulating material encapsulating the device die therein. The encapsulating material has a top surface coplanar with a top surface of the device die. A coil extends from the top surface to a bottom surface of the encapsulating material, and the device die is in the region encircled by the coil. At least one dielectric layer is formed over the encapsulating material and the coil. A plurality of redistribution lines is in the at least one dielectric layer. The coil is electrically coupled to the device die through the plurality of redistribution lines.
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1. A package comprising: a first device die; an encapsulating material encapsulating the first device die therein, wherein the encapsulating material has a top surface coplanar with a top surface of the first device die; a coil extending from the top surface to a bottom surface of the encapsulating material, wherein the first device die is in a region encircled by the coil; at least one dielectric layer over the encapsulating material and the coil; and a plurality of redistribution lines in the at least one dielectric layer, wherein the coil is electrically coupled to the first device die through the plurality of redistribution lines.
A wireless charging package includes a chip (device die) encased in a material where the chip's top is level with the encapsulating material's top. A coil of wire extends from the top to the bottom of this package, with the chip positioned inside the coil's loop. A dielectric (insulating) layer covers the entire structure (encapsulating material and coil). Wires (redistribution lines) within the dielectric layer connect the coil to the chip, allowing power received by the coil to be transferred to the chip.
2. The package of claim 1 , wherein no device die is disposed outside of the coil.
The wireless charging package as described previously, where a chip (device die) is encased in a material with a coil of wire extending from the top to the bottom, and wires connect the coil to the chip, is designed so that no other chips are placed outside the area enclosed by the coil. Everything is contained within the coil's boundaries.
3. The package of claim 1 , wherein the first device die is an AC-DC converter, and the AC-DC converter is configured to receive a power received by the coil and convert the power from AC to DC, and the package further comprises a second device die, wherein the second device die comprises a Bluetooth circuit.
The wireless charging package as described previously, where a chip (device die) is encased in a material with a coil of wire extending from the top to the bottom, and wires connect the coil to the chip, has the chip configured as an AC-DC converter. This converter takes the AC power received by the coil and changes it to DC power. The package also includes a second chip that contains a Bluetooth circuit for wireless communication.
4. The package of claim 1 , wherein the coil is a double-line coil including two conductors connected in parallel, and opposite ends of a first one of the two conductors are interconnected to respective opposite ends of a second one of the two conductors.
The wireless charging package as described previously, where a chip (device die) is encased in a material with a coil of wire extending from the top to the bottom, and wires connect the coil to the chip, uses a coil made of two parallel wires. The ends of one wire are connected to the corresponding ends of the other wire, effectively creating a double-wire coil.
5. The package of claim 1 further comprising an Integrated Passive Device (IPD) over the plurality of redistribution lines, wherein the IPD is encircled by the coil in a top view of the package.
The wireless charging package as described previously, where a chip (device die) is encased in a material with a coil of wire extending from the top to the bottom, wires connect the coil to the chip, and the wires are in a dielectric layer, also includes an Integrated Passive Device (IPD) placed on top of these connecting wires. When viewed from above, this IPD is located inside the loop of the coil.
6. The package of claim 1 further comprising an additional Integrated Passive Device (IPD) encapsulated in the encapsulating material, wherein the additional IPD is encircled by the coil, and the additional IPD is separated from the first device die.
The wireless charging package as described previously, where a chip (device die) is encased in a material with a coil of wire extending from the top to the bottom, and wires connect the coil to the chip, also contains an additional Integrated Passive Device (IPD) that is embedded within the encapsulating material. This extra IPD is located inside the coil's loop and is separate from the primary chip.
7. The package of claim 1 , wherein an axis of the coil is perpendicular to a major bottom surface of the first device die.
The wireless charging package as described previously, where a chip (device die) is encased in a material with a coil of wire extending from the top to the bottom, and wires connect the coil to the chip, is constructed so that the coil is oriented with its central axis perpendicular to the main bottom surface of the chip.
8. A package comprising: a coil extending to proximal all edges of the package; a first device die inside the coil; an encapsulating material encapsulating the first device die and the coil therein; at least one dielectric layer over the encapsulating material and the coil; and a plurality of redistribution lines in the at least one dielectric layer, wherein the plurality of redistribution lines is electrically coupled to the coil and the first device die.
A wireless charging package consists of a coil of wire that extends almost to the edges of the package. Inside the coil is a chip (device die), and both the chip and the coil are encased in a material. A dielectric (insulating) layer covers the encapsulating material and the coil. Wires (redistribution lines) within the dielectric layer connect the coil and the chip, allowing power transfer.
9. The package of claim 8 , wherein a top surface of the first device die, a top end of the coil, and a top surface of the encapsulating material are coplanar with each other.
The wireless charging package as described previously, where a coil extends to the edges of the package with a chip inside and both are encased in a material, has the top surface of the chip, the top of the coil, and the top surface of the encapsulating material all aligned on the same plane (coplanar).
10. The package of claim 8 , wherein the coil penetrates through the encapsulating material, and the package further comprises a die-attach film attached to a back surface of the first device die, with a bottom surface of the die-attach film, a bottom surface of the encapsulating material, and a bottom end of the coil being are coplanar with each other.
The wireless charging package as described previously, where a coil extends to the edges of the package with a chip inside and both are encased in a material, features the coil passing through the encapsulating material from top to bottom. A thin adhesive film (die-attach film) is attached to the back of the chip, and the bottom of this film, the bottom of the encapsulating material, and the bottom of the coil are all on the same plane (coplanar).
11. The package of claim 8 , wherein no device die is outside of the coil.
The wireless charging package as described previously, where a coil extends to the edges of the package with a chip inside and both are encased in a material, is designed so that no other chips are located outside the area enclosed by the coil.
12. The package of claim 8 , wherein the first device die is an AC-DC converter, and the AC-DC converter is configured to receive a power received by the coil and convert the power from AC to DC.
The wireless charging package as described previously, where a coil extends to the edges of the package with a chip inside and both are encased in a material, has the chip configured as an AC-DC converter. This converter takes the AC power received by the coil and changes it to DC power.
13. The package of claim 8 further comprising a second device die, wherein the second device die comprises a Bluetooth circuit.
The wireless charging package as described previously, where a coil extends to the edges of the package with a chip inside and both are encased in a material, also contains a second chip that includes a Bluetooth circuit for wireless communication.
14. The package of claim 8 , wherein an axis of the coil is perpendicular to a major bottom surface of the first device die.
The wireless charging package as described previously, where a coil extends to the edges of the package with a chip inside and both are encased in a material, is constructed so that the coil is oriented with its central axis perpendicular to the main bottom surface of the chip.
15. The package of claim 14 further comprising an additional integrated passive device encapsulated in the encapsulating material, wherein the additional integrated passive device is encircled by the coil, and the additional integrated passive device is separated from device die.
The wireless charging package, which has a coil extending to its edges, a chip inside the coil, both encased in a material, and with the coil's axis perpendicular to the chip's bottom surface, further includes an additional integrated passive device embedded within the encapsulating material. This passive device is located inside the loop of the coil and is separate from the primary chip.
16. A method comprising: forming a coil over a carrier; placing a first device die over the carrier, wherein the first device die is in a region encircled by the coil; encapsulating the first device die and the coil in an encapsulating material; planarizing a top surface of the first device die and a top end of the coil with a top surface of the encapsulating material; forming at least one dielectric layer over the encapsulating material, the coil, and the first device die; and forming a plurality of redistribution lines in the at least one dielectric layer, wherein the plurality of redistribution lines is electrically coupled to the first device die and the coil.
A method for creating a wireless charging package involves first creating a coil on a base (carrier). Then, a chip (device die) is placed on the base, inside the loop of the coil. The chip and coil are then encased in a material. The top of the chip, the top of the coil, and the top surface of the encapsulating material are then flattened to be on the same level. Next, an insulating (dielectric) layer is formed over everything. Finally, wires (redistribution lines) are created within the dielectric layer to connect the chip and the coil.
17. The method of claim 16 further comprising bonding an integrated passive device over and electrically coupling to the plurality of redistribution lines, wherein in a top view of the plurality of redistribution lines, the integrated passive device is encircled by the coil.
The method for creating a wireless charging package as described previously, where a coil and chip are encased and connected, further includes attaching an Integrated Passive Device (IPD) on top of the connecting wires and electrically connecting them. When viewed from above, the IPD is located inside the loop of the coil.
18. The method of claim 16 further comprising placing an additional integrated passive device over the carrier, with the additional integrated passive device encapsulated by the encapsulating material, wherein the additional integrated passive device is encircled by the coil.
The method for creating a wireless charging package as described previously, where a coil and chip are encased and connected, further includes placing an additional Integrated Passive Device (IPD) on the base before encapsulation. This extra IPD is embedded within the encapsulating material and is located inside the coil's loop.
19. The method of claim 16 further comprising performing a singulation to separate the coil and the first device die into a package separated from other packages, wherein after the singulation, no device die and passive device is outside of the coil.
The method for creating a wireless charging package as described previously, where a coil and chip are encased and connected, involves cutting the larger structure (singulation) to separate individual packages. After this cutting process, no chips or passive devices are located outside the area defined by the coil in each finished package.
20. The method of claim 16 , wherein an axis of the coil is perpendicular to a major bottom surface of the first device die.
The method for creating a wireless charging package as described previously, where a coil and chip are encased and connected, involves orienting the coil so that its central axis is perpendicular to the main bottom surface of the chip.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
June 1, 2016
September 12, 2017
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