A package includes a device die, and an encapsulating material encapsulating the device die therein. The encapsulating material has a top surface coplanar with a top surface of the device die. A coil extends from the top surface to a bottom surface of the encapsulating material, and the device die is in the region encircled by the coil. At least one dielectric layer is formed over the encapsulating material and the coil. A plurality of redistribution lines is in the at least one dielectric layer. The coil is electrically coupled to the device die through the plurality of redistribution lines.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A package comprising: a first device die; an encapsulating material encapsulating the first device die therein, wherein the encapsulating material has a top surface coplanar with a top surface of the first device die; a coil extending from the top surface to a bottom surface of the encapsulating material, wherein the first device die is in a region encircled by the coil; at least one dielectric layer over the encapsulating material and the coil; and a plurality of redistribution lines in the at least one dielectric layer, wherein the coil is electrically coupled to the first device die through the plurality of redistribution lines.
2. The package of claim 1 , wherein no device die is disposed outside of the coil.
3. The package of claim 1 , wherein the first device die is an AC-DC converter, and the AC-DC converter is configured to receive a power received by the coil and convert the power from AC to DC, and the package further comprises a second device die, wherein the second device die comprises a Bluetooth circuit.
4. The package of claim 1 , wherein the coil is a double-line coil including two conductors connected in parallel, and opposite ends of a first one of the two conductors are interconnected to respective opposite ends of a second one of the two conductors.
5. The package of claim 1 further comprising an Integrated Passive Device (IPD) over the plurality of redistribution lines, wherein the IPD is encircled by the coil in a top view of the package.
6. The package of claim 1 further comprising an additional Integrated Passive Device (IPD) encapsulated in the encapsulating material, wherein the additional IPD is encircled by the coil, and the additional IPD is separated from the first device die.
7. The package of claim 1 , wherein an axis of the coil is perpendicular to a major bottom surface of the first device die.
8. A package comprising: a coil extending to proximal all edges of the package; a first device die inside the coil; an encapsulating material encapsulating the first device die and the coil therein; at least one dielectric layer over the encapsulating material and the coil; and a plurality of redistribution lines in the at least one dielectric layer, wherein the plurality of redistribution lines is electrically coupled to the coil and the first device die.
9. The package of claim 8 , wherein a top surface of the first device die, a top end of the coil, and a top surface of the encapsulating material are coplanar with each other.
10. The package of claim 8 , wherein the coil penetrates through the encapsulating material, and the package further comprises a die-attach film attached to a back surface of the first device die, with a bottom surface of the die-attach film, a bottom surface of the encapsulating material, and a bottom end of the coil being are coplanar with each other.
11. The package of claim 8 , wherein no device die is outside of the coil.
12. The package of claim 8 , wherein the first device die is an AC-DC converter, and the AC-DC converter is configured to receive a power received by the coil and convert the power from AC to DC.
13. The package of claim 8 further comprising a second device die, wherein the second device die comprises a Bluetooth circuit.
14. The package of claim 8 , wherein an axis of the coil is perpendicular to a major bottom surface of the first device die.
15. The package of claim 14 further comprising an additional integrated passive device encapsulated in the encapsulating material, wherein the additional integrated passive device is encircled by the coil, and the additional integrated passive device is separated from device die.
16. A method comprising: forming a coil over a carrier; placing a first device die over the carrier, wherein the first device die is in a region encircled by the coil; encapsulating the first device die and the coil in an encapsulating material; planarizing a top surface of the first device die and a top end of the coil with a top surface of the encapsulating material; forming at least one dielectric layer over the encapsulating material, the coil, and the first device die; and forming a plurality of redistribution lines in the at least one dielectric layer, wherein the plurality of redistribution lines is electrically coupled to the first device die and the coil.
17. The method of claim 16 further comprising bonding an integrated passive device over and electrically coupling to the plurality of redistribution lines, wherein in a top view of the plurality of redistribution lines, the integrated passive device is encircled by the coil.
18. The method of claim 16 further comprising placing an additional integrated passive device over the carrier, with the additional integrated passive device encapsulated by the encapsulating material, wherein the additional integrated passive device is encircled by the coil.
19. The method of claim 16 further comprising performing a singulation to separate the coil and the first device die into a package separated from other packages, wherein after the singulation, no device die and passive device is outside of the coil.
20. The method of claim 16 , wherein an axis of the coil is perpendicular to a major bottom surface of the first device die.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
June 1, 2016
September 12, 2017
Browse 5M+ US patents with plain-English claim translations and AI-generated analysis.