A movable wafer probe may include: an immersion hood including a top body portion and a bottom foot portion, the top body portion having first inner sidewalls surrounding a top opening, the bottom foot portion having second inner sidewalls surrounding a bottom opening; a transducer disposed above the bottom opening and within the top opening, the transducer spaced apart from the first inner sidewalls of the top body portion by a first spacing, the first spacing forming a fluid exhaust port; and a fluid input port extending through the transducer, a bottom end of the fluid input port opening to the bottom opening.
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1. A movable wafer probe, comprising: an immersion hood comprising: a top body portion having first inner sidewalls surrounding a first opening, the first opening disposed in a lower-most portion of the top body portion; a bottom foot portion having second inner sidewalls surrounding a second opening, the second opening disposed in an upper-most portion of the bottom foot portion, the bottom foot portion having second outer sidewalls, wherein the second outer sidewalls are perpendicular to a bottom surface of the bottom foot portion, and the second inner sidewalls form a first oblique angle with the bottom surface of the bottom foot portion, and wherein the first inner sidewalls of the top body portion form a second oblique angle different from the first oblique angle with the bottom surface of the bottom foot portion; a transducer disposed within the first opening, the transducer comprising a bottom surface having a first diameter, the transducer further comprising a region above the bottom surface, the region above the bottom surface having a second diameter, the second diameter larger than the first diameter, the transducer spaced apart from the first inner sidewalls of the top body portion by a first spacing, the first spacing forming a fluid exhaust port; and a fluid input port extending through the transducer, a bottom end of the fluid input port opening to the second opening, the first inner sidewalls of the top body portion tapering away from the fluid input port.
A movable wafer probe for cleaning wafers has an immersion hood with a top and bottom part. The top part has inner walls forming a top opening, and the bottom part has inner and outer walls forming a bottom opening. The outer walls of the bottom part are perpendicular to its bottom surface. The inner walls of the top and bottom parts are angled differently relative to the bottom surface. A transducer sits within the top opening, spaced from the top part's inner walls to create a fluid exhaust port. The transducer has a bottom surface with a smaller diameter that widens higher up to make room for the exhaust port. A fluid input port runs through the transducer, opening into the bottom opening. The inner walls of the top part taper away from the fluid input.
2. The movable wafer probe of claim 1 , wherein a width of the second opening is larger than a width of the fluid input port.
The movable wafer probe described in Claim 1 has a bottom opening that's wider than the fluid input port running through the transducer. This ensures sufficient fluid flow and prevents clogging when directing cleaning fluid onto the wafer.
3. The movable wafer probe of claim 1 , wherein the first opening is disposed in a central portion of the top body portion of the immersion hood.
In the movable wafer probe described in Claim 1, the top opening within the immersion hood's top part is positioned in the center. This allows for even fluid distribution across the wafer surface during cleaning.
4. The movable wafer probe of claim 1 , wherein the fluid input port in disposed in a central portion of the transducer.
The movable wafer probe from Claim 1 has a fluid input port positioned in the center of the transducer. Centrally locating the input ensures uniform fluid delivery to the wafer's surface.
5. The movable wafer probe of claim 1 , wherein the transducer comprises a metal.
The movable wafer probe of Claim 1 uses a transducer constructed from metal. This metal transducer generates megasonic waves when excited, aiding in particle removal from the wafer surface.
6. The movable wafer probe of claim 1 , further comprising a coating lining the fluid exhaust port and the fluid input port.
The movable wafer probe of Claim 1 has a coating lining both the fluid exhaust port and the fluid input port. This coating protects the probe material from corrosion and contamination, while also ensuring smooth fluid flow.
7. An apparatus, comprising: a movable wafer probe, wherein the movable wafer probe is configured to be positioned over a wafer and wherein the movable wafer probe comprises: a top body portion having first inner sidewalls surrounding a first opening, the first opening disposed in a lower-most portion of the top body portion; a bottom foot portion having second inner sidewalls surrounding a second opening, the second opening disposed in an upper-most portion of the bottom foot portion, the bottom foot portion having second outer sidewalls, wherein the second outer sidewalls are perpendicular to a bottom surface of the bottom foot portion, and the second inner sidewalls form a first oblique angle with the bottom surface of the bottom foot portion, and wherein the first inner sidewalls of the top body portion form a second oblique angle different from the first oblique angle with the bottom surface of the bottom foot portion; a transducer disposed within the first opening, the transducer comprising a bottom surface having a first diameter, the transducer further comprising a region above the bottom surface, the region above the bottom surface having a second diameter, the second diameter larger than the first diameter, the transducer spaced apart from the first inner sidewalls of the top body portion by a first spacing, the first spacing forming a fluid exhaust port; and a fluid input port extending through the transducer, a bottom end of the fluid input port opening to the second opening, the first inner sidewalls of the top body portion tapering away from the fluid input port; a support structure disposed below the wafer, wherein a clearance separates a bottom surface of the wafer and an upper surface of the support structure; a spindle below and coupled to the support structures, the spindle comprising a second fluid input port therein, the second fluid input port opening to the clearance; and second fluid exhaust ports attached to a periphery of the support structure.
An apparatus for cleaning wafers includes a movable wafer probe positioned over a wafer. The probe has an immersion hood with a top and bottom part. The top part has inner walls forming a top opening, and the bottom part has inner and outer walls forming a bottom opening. The outer walls of the bottom part are perpendicular to its bottom surface. The inner walls of the top and bottom parts are angled differently. A transducer is inside the top opening, spaced from the inner walls to create a fluid exhaust. A fluid input runs through the transducer, opening into the bottom opening. A support structure sits below the wafer, separated by a clearance. A spindle below the support has a second fluid input port opening into the clearance. Second fluid exhaust ports are attached to the periphery of the support structure, enabling cleaning of the wafer's backside, too.
8. The apparatus of claim 7 , wherein the bottom foot portion contacts a surface of the wafer, and wherein the second opening is disposed over the wafer.
The apparatus in Claim 7 has a movable wafer probe where the bottom of the immersion hood makes contact with the wafer surface. The bottom opening of the probe is positioned directly over the wafer to precisely target the cleaning area.
9. The apparatus of claim 7 , further comprising a transport mechanism mechanically coupled to the movable wafer probe.
The apparatus described in Claim 7 also includes a transport mechanism mechanically connected to the movable wafer probe. This mechanism enables the probe to move across the wafer surface for complete cleaning.
10. The apparatus of claim 9 , wherein the transport mechanism comprises an arm coupled to the movable wafer probe and a motor mechanically coupled to the arm, the arm and the motor adapted to move the movable wafer probe rectilinearly across the wafer.
The apparatus of Claim 9 utilizes a transport mechanism comprising an arm connected to the movable wafer probe and a motor connected to the arm. This arrangement enables the probe to move back and forth in a straight line (rectilinearly) over the wafer surface.
11. An apparatus, comprising: a movable wafer probe, wherein the movable wafer probe is configured to be positioned over a first wafer surface of a wafer and wherein the movable wafer probe comprises: a top body portion having first inner sidewalls surrounding a first opening, the first opening disposed in a lower-most portion of the top body portion; a bottom foot portion having second inner sidewalls surrounding a second opening, the second opening disposed in an upper-most portion of the bottom foot portion, the bottom foot portion having second outer sidewalls, wherein the second outer sidewalls are perpendicular to a bottom surface of the bottom foot portion, and the second inner sidewalls form a first oblique angle with the bottom surface of the bottom foot portion, and wherein the first inner sidewalls of the top body portion form a second oblique angle different from the first oblique angle with the bottom surface of the bottom foot portion; a transducer disposed within the first opening, the transducer comprising a bottom surface having a first diameter, the transducer further comprising a region above the bottom surface, the region above the bottom surface having a second diameter, the second diameter larger than the first diameter, the transducer spaced apart from the first inner sidewalls of the top body portion by a first spacing, the first spacing forming a fluid exhaust port; and a fluid input port extending through the transducer, a bottom end of the fluid input port opening to the second opening, the first inner sidewalls of the top body portion tapering away from the fluid input port; a support structure configured to be disposed under the wafer; a second liquid input port in a spindle coupled to the support structure, the second liquid input port configured to deliver fluids to a second wafer surface of the wafer opposing the first wafer surface; and a second liquid exhaust port physically connected to a periphery of the support structure, the second liquid exhaust port configured to remove the fluids on the second wafer surface.
An apparatus for cleaning wafers has a movable wafer probe positioned over the wafer's top surface. The probe includes an immersion hood with top and bottom parts. The top has inner walls forming a top opening, and the bottom has inner and outer walls forming a bottom opening. The bottom part's outer walls are perpendicular to its bottom surface, and the inner walls of the top and bottom parts are angled differently. A transducer is inside the top opening, spaced to create a fluid exhaust port. A fluid input runs through the transducer and opens into the bottom opening. A support structure is positioned under the wafer. A second fluid input in a spindle below the support delivers fluid to the wafer's bottom surface. A second fluid exhaust is connected to the support's periphery to remove fluid from the bottom surface.
12. The apparatus of claim 11 , wherein the fluid input port of the movable wafer probe is disposed in a central portion of the transducer, wherein a direction of fluid flow through the fluid input port is substantially normal to a wafer surface.
In the apparatus described in Claim 11, the fluid input port of the movable wafer probe is located in the center of the transducer. The fluid flows straight down, perpendicular to the wafer surface, providing uniform cleaning.
13. The apparatus of claim 11 , wherein the transducer has a tapered vertical profile.
The apparatus described in Claim 11 includes a transducer with a tapered vertical profile. This shape optimizes the focusing of megasonic energy during cleaning.
14. The apparatus of claim 11 , further comprising a transport mechanism for moving the movable wafer probe.
The apparatus described in Claim 11 further includes a transport mechanism for moving the movable wafer probe across the wafer surface, ensuring complete and even cleaning.
15. The apparatus of claim 11 , wherein the bottom foot portion of the movable wafer probe comprises a non-resilient material comprising a metal or a Teflon-coated metal.
In the apparatus described in Claim 11, the bottom part (foot) of the movable wafer probe is constructed from a rigid material such as metal or Teflon-coated metal. This ensures consistent contact and prevents damage to the wafer.
16. The apparatus of claim 14 , wherein the transport mechanism moves the movable wafer probe in a linear fashion or at least in two directions.
The apparatus of Claim 14 has a transport mechanism that moves the movable wafer probe in a straight line (linear motion) or in at least two different directions across the wafer.
17. The apparatus of claim 14 , wherein the transport mechanism provides an adjustable scan speed for moving the movable wafer probe.
In the apparatus from Claim 14, the transport mechanism can adjust the speed at which the movable wafer probe moves across the wafer surface (adjustable scan speed).
18. The apparatus of claim 7 , wherein the second fluid exhaust ports are vertically arranged such that they are perpendicular to an upper surface of the support structure.
In the apparatus described in Claim 7, the second fluid exhaust ports (used for the wafer's underside) are positioned vertically, perpendicular to the top surface of the support structure.
19. The apparatus of claim 18 , wherein the movable wafer probe is configured to be stationary during a wafer cleaning process, and the support structure is configured to provide movement in a rotational direction and a linear direction during the wafer cleaning process.
In the apparatus of Claim 18, the movable wafer probe remains still during cleaning. The support structure moves the wafer in a circle (rotational direction) and back and forth (linear direction) for complete cleaning coverage.
20. The apparatus of claim 11 , wherein the support structure has a plurality of supports attached thereto, the plurality of supports configured to hold the wafer.
In the apparatus described in Claim 11, the support structure that holds the wafer includes several supporting elements attached to it. These supports hold the wafer securely during cleaning.
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December 23, 2014
September 19, 2017
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