Patentable/Patents/US-9791753
US-9791753

Circuit substrate structure and method for manufacturing thereof

PublishedOctober 17, 2017
Assigneenot available in USPTO data we have
Inventorsnot available in USPTO data we have
Technical Abstract

The invention provides a circuit substrate structure and a method for manufacturing thereof. The circuit substrate structure includes a substrate, a pixel array layer, a display unit, a peripheral circuit layer, at least one integrated circuit chip, a flexible printed circuit board, at least one flattening material layer and a passivation layer. In the circuit substrate structure, the flattening material layer is positioned on the peripheral circuit layer, and possesses at least one opening corresponded to and around the integrated circuit chip. By positioning the flattening material layer, the circuit substrate structure possesses a flat surface, and prevents producing air bubbles, so as to enhance the reliability of the display device.

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Patent Metadata

Filing Date

December 31, 2013

Publication Date

October 17, 2017

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