Articles containing a matrix material and plurality of copper nanoparticles in the matrix material that have been at least partially fused together are described. The copper nanoparticles are less than about 20 nm in size. Copper nanoparticles of this size become fused together at temperatures and pressures that are much lower than that of bulk copper. In general, the fusion temperatures decrease with increasing applied pressure and lowering of the size of the copper nanoparticles. The size of the copper nanoparticles can be varied by adjusting reaction conditions including, for example, surfactant systems, addition rates, and temperatures. Copper nanoparticles that have been at least partially fused together can form a thermally conductive percolation pathway in the matrix material.
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1. A method comprising: providing a plurality of copper nanoparticles; wherein the plurality of copper nanoparticles are less than about 20 nm in size; mixing the plurality of copper nanoparticles with a matrix material; and applying pressure to at least partially fuse the plurality of copper nanoparticles together to form a nanoparticle network that remains disposed in the matrix material, wherein applying pressure comprises press molding a mixture of copper nanoparticles and the matrix material.
A method for creating a conductive material involves mixing copper nanoparticles (smaller than 20 nm) with a matrix material (e.g., polymer, rubber, glass, ceramic, or metal). Pressure is applied using press molding to fuse the nanoparticles together, forming a network within the matrix. This network creates a thermally conductive pathway, improving the material's ability to conduct heat. The nanoparticle size can be controlled by adjusting reaction conditions, for example, by changing surfactant systems, reagent addition rates, or temperatures.
2. The method of claim 1 , wherein the plurality of copper nanoparticles further comprise a surfactant system.
The method described above (mixing copper nanoparticles, matrix material, and applying pressure via press molding to fuse the nanoparticles) incorporates a surfactant system with the copper nanoparticles. The surfactant aids in dispersing and stabilizing the nanoparticles within the matrix material. The nanoparticles are less than 20 nm in size. The fusing process creates a nanoparticle network within the matrix.
3. The method of claim 2 , wherein the surfactant system comprises a bidentate diamine and one or more C6-C18 alkylamines.
The method of fusing copper nanoparticles (less than 20 nm) in a matrix using press molding, where the nanoparticles include a surfactant, specifies that the surfactant system comprises a bidentate diamine and one or more C6-C18 alkylamines. These components further stabilize and control the dispersion of the copper nanoparticles, facilitating their fusion and network formation within the matrix material.
4. The method of claim 1 , wherein the plurality of copper nanoparticles range between about 1 nm and about 10 nm in size.
In the method of fusing copper nanoparticles in a matrix using press molding, the size of the copper nanoparticles is further restricted to a range between 1 nm and 10 nm, still less than 20 nm. This more precise size range further optimizes the fusion process and the properties of the resulting nanoparticle network within the matrix material.
5. The method of claim 1 , wherein the plurality of copper nanoparticles range between about 1 nm and about 5 nm in size.
The method of using press molding to fuse copper nanoparticles with a matrix specifies that the copper nanoparticles are between 1 nm and 5 nm in size. The nanoparticles are mixed with the matrix material and pressure is applied to at least partially fuse them together. This small size range facilitates a robust and electrically conductive nanoparticle network within the matrix material.
6. The method of claim 1 , further comprising: curing the matrix material.
In the process of creating a conductive material using press molding to fuse copper nanoparticles (less than 20 nm) in a matrix, the method includes a step of curing the matrix material. This curing process hardens or sets the matrix, providing structural integrity and further embedding the fused copper nanoparticle network.
7. The method of claim 1 , wherein the matrix material is selected from the group consisting of a polymer matrix, a rubber matrix, a glass matrix, a ceramic matrix and a metal matrix.
The method of fusing copper nanoparticles using press molding specifies that the matrix material can be a polymer, a rubber, a glass, a ceramic, or a metal. These materials serve as the base into which the copper nanoparticles (smaller than 20 nm) are mixed, fused under pressure, and form a thermally conductive network.
8. The method of claim 1 , further comprising: applying heat to at least partially fuse the plurality of copper nanoparticles together to form the nanoparticle network.
The method involving press molding to fuse copper nanoparticles (smaller than 20 nm) in a matrix material includes an additional step of applying heat to further fuse the nanoparticles together, enhancing the formation of the nanoparticle network. This combination of pressure and heat optimizes the fusion process, creating a strong and conductive pathway.
9. The method of claim 1 , wherein the nanoparticle network defines an electrically conductive percolation pathway in the matrix material.
In the process of fusing copper nanoparticles in a matrix material using press molding, the formed nanoparticle network creates an electrically conductive pathway through the matrix. This pathway allows the material to conduct electricity, enhancing its electrical properties. The nanoparticles are less than 20 nm in size.
10. A method comprising: providing a plurality of copper nanoparticles; wherein the plurality of copper nanoparticles are less than about 20 nm in size; mixing the plurality of copper nanoparticles with a matrix material; and applying pressure to at least partially fuse the plurality of copper nanoparticles together to form a nanoparticle network; wherein applying pressure comprises extruding a mixture of copper nanoparticles and the matrix material.
A method involves mixing copper nanoparticles (smaller than 20 nm) with a matrix material and then applying pressure using extrusion to at least partially fuse the nanoparticles together, forming a network within the matrix. This network enhances the material's thermal conductivity. Nanoparticle size is adjusted by changing surfactant systems, reagent addition rates, or temperatures.
11. The method of claim 10 , wherein the plurality of copper nanoparticles further comprise a surfactant system.
The method (mixing copper nanoparticles, matrix material, and applying pressure using extrusion to fuse the nanoparticles) incorporates a surfactant system with the copper nanoparticles, which are less than 20 nm in size. The surfactant helps distribute and stabilize the nanoparticles within the matrix, and the fusing process creates a network within the matrix.
12. The method of claim 10 , wherein the surfactant system comprises a bidentate diamine and one or more C6-C18 alkylamines.
The method of fusing copper nanoparticles (less than 20 nm) in a matrix using extrusion, where the nanoparticles include a surfactant, specifies that the surfactant system comprises a bidentate diamine and one or more C6-C18 alkylamines. These components further stabilize and control the dispersion of the copper nanoparticles, facilitating their fusion and network formation within the matrix material.
13. The method of claim 10 , wherein the plurality of copper nanoparticles range between about 1 nm and about 10 nm in size.
In the method of fusing copper nanoparticles in a matrix using extrusion, the size of the copper nanoparticles is further restricted to a range between 1 nm and 10 nm, still less than 20 nm. This more precise size range further optimizes the fusion process and the properties of the resulting nanoparticle network within the matrix material.
14. The method of claim 10 , wherein the plurality of copper nanoparticles range between about 1 nm and about 5 nm in size.
The method of using extrusion to fuse copper nanoparticles with a matrix specifies that the copper nanoparticles are between 1 nm and 5 nm in size. The nanoparticles are mixed with the matrix material and pressure is applied to at least partially fuse them together. This small size range facilitates a robust and electrically conductive nanoparticle network within the matrix material.
15. The method of claim 10 , further comprising: curing the matrix material.
In the process of creating a conductive material using extrusion to fuse copper nanoparticles (less than 20 nm) in a matrix, the method includes a step of curing the matrix material. This curing process hardens or sets the matrix, providing structural integrity and further embedding the fused copper nanoparticle network.
16. The method of claim 10 , wherein the matrix material is selected from the group consisting of a polymer matrix, a rubber matrix, a glass matrix, a ceramic matrix and a metal matrix.
The method of fusing copper nanoparticles using extrusion specifies that the matrix material can be a polymer, a rubber, a glass, a ceramic, or a metal. These materials serve as the base into which the copper nanoparticles (smaller than 20 nm) are mixed, fused under pressure, and form a thermally conductive network.
17. The method of claim 10 , further comprising: applying heat to at least partially fuse the plurality of copper nanoparticles together to form the nanoparticle network.
The method involving extrusion to fuse copper nanoparticles (smaller than 20 nm) in a matrix material includes an additional step of applying heat to further fuse the nanoparticles together, enhancing the formation of the nanoparticle network. This combination of pressure and heat optimizes the fusion process, creating a strong and conductive pathway.
18. The method of claim 10 , wherein the nanoparticle network defines an electrically conductive percolation pathway in the matrix material.
In the process of fusing copper nanoparticles in a matrix material using extrusion, the formed nanoparticle network creates an electrically conductive pathway through the matrix. This pathway allows the material to conduct electricity, enhancing its electrical properties. The nanoparticles are less than 20 nm in size.
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April 20, 2015
October 24, 2017
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