A first printed circuit board on which a heatsink having a discrete semiconductor device attached to it and first capacitors for smoothing an electric current after a conversion from AC to DC are mounted is arranged in the horizontal direction of a bottom portion of a device casing. On the first printed circuit board, various electronic components such as a resistor, a diode, a capacitor, a coil, etc. are mounted in addition to the heatsink and the first capacitors. Further, in an in-device-casing vacant space in an upper portion of the heatsink mounted on the first printed circuit board, a second printed circuit board on which second capacitors for performing smoothing upon a conversion from AC to DC are mounted is arranged orthogonally to the first printed circuit board in the device spacing.
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1. A power source apparatus, comprising: a heatsink to which a discrete semiconductor device is attached; first capacitors and second capacitors made of electrolytic capacitors for DC smoothing; a cooling fan for forcibly air-cooling the heatsink and the first capacitors and second capacitors; and a first printed circuit board on which the heatsink and the first capacitors are mounted, and a second printed circuit board on which the second capacitors are mounted, wherein the first and second printed circuit boards are arranged orthogonally to each other in a device casing of the power source apparatus, and the first capacitors and second capacitors are arranged so as to define two walls of a wind channel from the cooling fan over the heatsink mounted on the first printed circuit board.
A power supply unit has a heatsink for cooling a semiconductor device. Electrolytic capacitors provide DC smoothing. A cooling fan forces air over the heatsink and capacitors. A first circuit board mounts the heatsink and a first set of capacitors. A second circuit board mounts a second set of capacitors. The two circuit boards are positioned at right angles inside the power supply casing. The capacitors are positioned to create a wind tunnel directing airflow from the fan across the heatsink.
2. The power source apparatus according to claim 1 , wherein the second printed circuit board is arranged in on the device casing on an upper portion of the first printed circuit board.
This power supply positions the second circuit board holding the second set of capacitors above the first circuit board inside the casing. The first circuit board mounts the heatsink and a first set of capacitors. The two circuit boards are positioned at right angles inside the power supply casing. The capacitors are positioned to create a wind tunnel directing airflow from the fan across the heatsink. The overall effect is a compact, vertically stacked design.
3. The power source apparatus according to claim 1 , wherein cooled wind suctioned by the fan so as to cool an electronic component mounted on the first printed circuit board is guided onto the first printed circuit board by using arc portions of cylindrical shapes of the first capacitors, electronic components mounted on the first printed circuit board are separated into high-heat-generating components on one side of the first capacitors and low-heat-generating components on an opposite side of the first capacitors; and the first capacitors are arranged on the first circuit board so that amounts of cooled wind from the cooling fan are provided to the high-heat-generating components and the low-heat-generating components in proportion to amounts of heat generated by the high-heat-generating components and the low-heat-generating components.
This power supply optimizes cooling by separating components on the first circuit board into high and low heat generating groups. Cylindrical capacitors direct fan airflow. The capacitors are positioned to channel more air to the high-heat components. Specifically, the curved surface of the cylindrical capacitors are used to guide the cooled air to both the high heat generating components and the low heat generating components, distributing the cool air based on the heat generated by each component. The high heat generating components are placed on one side of the capacitors, while the low heat generating components are placed on the other.
4. An arrangement method of a heat generating component in a power source apparatus that is provided with at least a heatsink to which a discrete semiconductor device is attached, first capacitors and second capacitors made of electrolytic capacitors for DC smoothing, and a cooling fan for forcibly air-cooling the heatsink and the first and second capacitors, and that comprises a first printed circuit board on which the heatsink and the first capacitors are mounted and a second printed circuit board on which the second capacitors are mounted, the method comprising: arranging the first and second printed circuit boards so that the first and second printed circuit boards are orthogonal in a device casing; arranging the second printed circuit board in the device casing on an upper portion of the first printed circuit board; and arranging the first capacitors and the second capacitors on the first circuit board and the second circuit board, respectively, so as to define two walls of a wind channel from the cooling fan over the heatsink mounted on the first printed circuit board.
A method for arranging heat-generating components within a power supply includes the following steps. The power supply includes a heatsink for a semiconductor device, electrolytic capacitors for DC smoothing, and a cooling fan. It also has a first circuit board mounting the heatsink and first capacitors, and a second circuit board mounting second capacitors. The method involves arranging the first and second circuit boards orthogonally within the power supply casing, placing the second circuit board above the first. Electrolytic capacitors on both boards are arranged to form a wind channel, directing airflow from the cooling fan across the heatsink.
5. An arrangement method of a heat generating component in a power source apparatus that is provided with at least a heatsink to which a discrete semiconductor device is attached, first capacitors and second capacitors made of electrolytic capacitors for DC smoothing, and a cooling fan for forcibly air-cooling the heatsink and the first and second capacitors, and that comprises a first printed circuit board on which the heatsink and the first capacitors are mounted and a second printed circuit board on which the second capacitors are mounted, the method comprising: separating electronic components to be mounted on the first printed circuit board into high-heat-generating components and low-heat-generating components so as to mount the high-heat-generating components on one side of the first capacitors and to mount the low-heat-generating components on an opposite side of the first capacitors; arranging the first capacitors on the first circuit board so that amounts of cooled wind supplied to the high-heat-generating components and the low-heat-generating components, respectively, is proportional to an amount of heat generated by the high-heat-generating components and the low-heat-generating components, respectively, wherein the first capacitors are arranged on the first circuit board such that the cooled wind generated by the fan is guided to the high-heat-generating components and the low-heat-generating components, respectively, by an arc portion of a cylindrical shape of one of the first capacitors.
A method for arranging heat-generating components within a power supply comprises the following steps. The power supply includes a heatsink for a semiconductor device, electrolytic capacitors for DC smoothing, and a cooling fan. It also has a first circuit board mounting the heatsink and first capacitors, and a second circuit board mounting second capacitors. The method separates electronic components on the first board into high and low heat categories, placing high-heat components on one side of the first capacitors and low-heat components on the other. The first capacitors are arranged to distribute cooling airflow proportionally to the heat generated by each component group. The arc of the cylindrical capacitors on the first circuit board directs the cooling fan airflow to both high and low heat generating components according to their heat output.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
September 27, 2016
October 24, 2017
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