Reusable phase-change thermal interface structures

1. An electronic system, comprising: a chassis having a pair of side walls, each said side wall defines a receptor, wherein each said receptor has a first surface and a second surface facing the first surface; a heat frame disposed in the chassis, extending between the pair of side walls such that a portion of the heat frame is disposed in the receptor defined in one side wall of the pair of side walls and another portion of the heat frame is disposed in the receptor defined in other side wall of the pair of side walls, wherein the heat frame is disposed in the chassis in a slidable manner; a circuit card assembly operatively coupled to the heat frame, wherein the circuit card assembly comprises: a printed circuit board; and at least one electronic component mounted on the printed circuit board; a reusable phase-change thermal interface structure disposed between the portion of the heat frame and the first surface of the receptor, wherein the heat frame is configured to facilitate exchange of heat between the circuit card assembly and the chassis via the reusable phase-change thermal interface structure; and wherein the reusable phase-change thermal interface structure comprises: a metal based foam; and a fusible metal based alloy disposed at least in a portion of the metal based foam, wherein the fusible metal based alloy is configured to be in solid phase at an assembling temperature and in liquid phase at an operating temperature, and a wedge lock structure disposed in the receptor between the portion of the heat frame and the second surface of the receptor.

2. The electronic system of claim 1 , wherein a thickness of the reusable phase-change thermal interface structure during operation is in a range from 10 microns to 1000 microns.

3. The electronic system of claim 1 , wherein the first surface has a surface roughness equal to or greater than 25 microns.

4. The electronic system of claim 1 , wherein the reusable phase-change thermal interface structure experiences a pressure in a range from 35 k Pa (5 psi) to 6900 k Pa (1000 psi) at the operating temperature.

5. The electronic system of claim 1 , wherein the at least one electronic component is a processor.

6. The electronic system of claim 1 , wherein the metal based foam comprises interconnected pores.

7. The electronic system of claim 1 , wherein the metal based foam comprises porous structures or an interconnected network of solid struts.

8. The electronic system of claim 1 , wherein the metal based foam comprises aluminum, tantalum, titanium, copper, or alloys or composites thereof.

9. The electronic system of claim 1 , wherein the fusible metal based alloy comprises indium, bismuth, tin, gallium, lead or alloys, or combinations thereof.

10. The electronic system of claim 1 , wherein the fusible metal based alloy is configured to be pumped out of one or more pores of the metal based foam in the liquid phase of the fusible metal based alloy.

11. The electronic system of claim 1 , wherein the fusible metal based alloy is configured to retract in the metal based foam prior to conversion from the liquid phase to the solid phase.

12. The electronic system of claim 1 , wherein the assembling temperature of the reusable phase-change thermal interface structure is less than 85° C.

13. The electronic system of claim 1 , wherein the operating temperature of the reusable phase-change thermal interface structure is greater than 30° C.

14. The electronic system of claim 1 , wherein the fusible metal based alloy is configured to exist in the liquid phase at a temperature in a range from 40° C. to 220° C.

15. The electronic system of claim 1 , wherein the reusable phase-change thermal interface structure has a thermal conductivity equal to or more than 1 W/m K.