In one embodiment, an integrated circuit package includes a package substrate, a printed circuit board, an interposer structure and a transmission line bridge interconnect within the interposer. The interposer structure, which includes multiple interposer layers, may be formed on a top surface of the package substrate. The printed circuit board may be coupled to the package substrate through the transmission line bridge interconnect. The transmission line may be formed on at least one of the interposer layers. The transmission line may be utilized to convey signals between the package substrate and the printed circuit board. The transmission line may be a stripline transmission line or a micro-strip transmission line. The transmission line may have a low parasitic inductance and implementation of the transmission line does not introduce large dimensional discontinuity throughout that signal pathway. The integrated circuit package may be part of a circuit system that includes external circuits.
Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. An integrated circuit package, comprising: a package substrate; an interposer structure formed over a top surface of the package substrate and a top surface of a printed circuit board, wherein the interposer structure comprises a plurality of interposer layers; and a first transmission line formed on at least one of the plurality of interposer layers, wherein the first transmission line conveys signals between the package substrate and the printed circuit board; and a second transmission line formed on the printed circuit board, wherein the first transmission line partially overlaps the second transmission line and the signals are transmitted between the first transmission line and the second transmission line.
An integrated circuit package includes a package substrate, an interposer structure, and a printed circuit board. The interposer, having multiple layers, sits on top of both the package substrate and the printed circuit board. A first transmission line is built on at least one of the interposer layers and conveys signals between the package substrate and the printed circuit board. A second transmission line is located on the printed circuit board. These two transmission lines partially overlap each other, allowing signals to transfer between them.
2. The integrated circuit package defined in claim 1 , wherein the transmission line comprises a transmission line selected from the group consisting of: a micro-strip transmission line and a stripline transmission line.
The integrated circuit package described above uses a transmission line that is either a micro-strip transmission line or a stripline transmission line to carry the signals between the package substrate and the printed circuit board. The interposer structure with its transmission line and overlapping printed circuit board transmission line design is maintained.
3. The integrated circuit package defined in claim 1 , further comprising: an additional transmission line formed on the at least one of the plurality of interposer layers, wherein the transmission line transmits a first signal from the package substrate to the printed circuit board and wherein the additional transmission line transmits a second signal from the printed circuit board to the package substrate.
In addition to the core design of an integrated circuit package including a package substrate, interposer with multiple layers, printed circuit board, and the first transmission line that conveys signals between the substrate and the board, there is also an *additional* transmission line built into at least one of the interposer layers. The first transmission line carries a signal from the package substrate to the printed circuit board, while the additional transmission line sends a *second* signal in the opposite direction, from the printed circuit board back to the package substrate.
4. The integrated circuit package defined in claim 3 , wherein the first signal transmitted from the package substrate comprises a signal selected from the group consisting of: a single-ended signal and a differential signal.
The integrated circuit package uses transmission lines to send signals between a package substrate and a printed circuit board. The signal sent from the package substrate, as described previously, can be either a single-ended signal or a differential signal. The interposer structure houses these transmission lines.
5. The integrated circuit package defined in claim 1 , wherein a characteristic impedance of the transmission line is at least 50 Ohm.
The transmission line within the integrated circuit package has a characteristic impedance of at least 50 Ohms. The integrated circuit package includes a package substrate, an interposer structure with multiple layers, and a printed circuit board, where a first transmission line conveys signals between the package substrate and printed circuit board. The first and second transmission lines (the second on the printed circuit board) also partially overlap.
6. The integrated circuit package defined in claim 1 , wherein the interposer structure has an edge with a plurality of steps, wherein a respective transmission line is formed on each of the steps of the plurality of steps.
The interposer structure of the integrated circuit package has a stepped edge. A transmission line is formed on each of these steps. This provides multiple transmission paths between the package substrate and the printed circuit board. The overall integrated circuit package includes the package substrate and the printed circuit board. The first and second transmission lines (the second on the printed circuit board) also partially overlap.
7. The integrated circuit package defined in claim 1 , wherein the signals comprise signals selected from the group consisting of: input-output signals, radio-frequency data signals, power signals, and ground signals.
The signals that are transmitted between the package substrate and the printed circuit board over the transmission lines can be any of the following types: input-output signals, radio-frequency data signals, power signals, or ground signals. The integrated circuit package includes a package substrate, an interposer structure with multiple layers, and a printed circuit board, where a first transmission line conveys signals between the package substrate and printed circuit board. The first and second transmission lines (the second on the printed circuit board) also partially overlap.
8. The integrated circuit package defined in claim 1 , further comprising: an integrated circuit die formed on the package substrate, wherein the interposer structure surrounds the integrated circuit die.
An integrated circuit die is placed on the package substrate. The interposer structure surrounds this integrated circuit die. Transmission lines within the interposer facilitate signal transfer to the printed circuit board. The integrated circuit package includes a package substrate, an interposer structure with multiple layers, and a printed circuit board, where a first transmission line conveys signals between the package substrate and printed circuit board. The first and second transmission lines (the second on the printed circuit board) also partially overlap.
9. The integrated circuit package defined in claim 1 , wherein the transmission line is a first transmission line, the package substrate includes a second transmission line, the printed circuit board includes a third transmission line, and the first transmission line is coupled between the second transmission line and the third transmission line.
In this design, the transmission line within the interposer is specifically a *first* transmission line. The package substrate *also* contains a *second* transmission line, and the printed circuit board contains a *third* transmission line. The *first* transmission line acts as a bridge, connecting the second transmission line on the package substrate to the third transmission line on the printed circuit board. The integrated circuit package also includes an interposer structure with multiple layers.
10. The integrated circuit package defined in claim 1 , wherein the transmission line bridges a gap between the package substrate and the printed circuit board.
The transmission line in the interposer bridges a physical gap between the package substrate and the printed circuit board. This allows for signal transmission across the discontinuity. The integrated circuit package includes a package substrate, an interposer structure with multiple layers, and a printed circuit board, where a first transmission line conveys signals between the package substrate and printed circuit board. The first and second transmission lines (the second on the printed circuit board) also partially overlap.
11. A system, comprising: an integrated circuit die; a substrate, wherein the integrated circuit die is mounted on a top surface of the substrate; an interposer formed above the substrate that at least partially surrounds the integrated circuit die; a printed circuit board, the printed circuit board comprising a cavity, wherein the substrate is formed within the cavity; and a transmission line formed within the interposer, wherein the transmission line transmits a signal between the integrated circuit die and the printed circuit board, the printed circuit board further comprises an additional transmission line at a surface of the printed circuit board that faces the interposer, and the transmission line on the interposer partially overlaps the additional transmission line on the printed circuit board so that the signal is transmitted between the additional transmission line on the printed circuit board and the transmission line on the interposer.
A system includes an integrated circuit die mounted on a substrate. An interposer is formed above the substrate, partially surrounding the die. The printed circuit board has a cavity holding the substrate. A transmission line within the interposer transmits signals between the die and the printed circuit board. The printed circuit board also has an additional transmission line on its surface facing the interposer. The two transmission lines partially overlap so the signal is transferred between them.
12. The system defined in claim 11 , wherein the transmission line comprises a transmission line selected from the group consisting of: a micro-strip transmission line and a stripline transmission line.
The transmission line within the interposer, used for transmitting signals between the die and the printed circuit board (as part of the larger system), can be either a micro-strip transmission line or a stripline transmission line. The integrated circuit die is mounted on a substrate, which sits in a cavity in the printed circuit board with the interposer surrounding the die. The printed circuit board has an additional overlapping transmission line.
13. The system defined in claim 11 , wherein the transmission line is a first transmission line and the additional transmission line is a second transmission line, the system further comprising: a third transmission line formed within the interposer, wherein the third transmission line transmits an additional signal between the integrated circuit die and the printed circuit board and the first transmission line is formed in a first plane within the interposer and the third transmission line is formed in a second plane that is different from the first plane within the interposer.
The system uses a *first* transmission line in the interposer and an *additional* transmission line (a *second* transmission line) on the printed circuit board for signal transfer. A *third* transmission line is *also* formed within the interposer. This third line carries an *additional* signal between the integrated circuit die and the printed circuit board. The first transmission line exists on one plane within the interposer, while the third transmission line exists on a *different* plane inside the interposer. The integrated circuit die is mounted on a substrate, which sits in a cavity in the printed circuit board with the interposer surrounding the die.
14. The system defined in claim 11 , wherein the signal transmitted by the transmission line comprises a signal selected from the group consisting of: a single-ended signal and a differential signal.
The signal transmitted by the transmission line between the integrated circuit die and the printed circuit board, via the interposer structure, can be either a single-ended signal or a differential signal. The integrated circuit die is mounted on a substrate, which sits in a cavity in the printed circuit board with the interposer surrounding the die. The printed circuit board has an additional overlapping transmission line.
15. The system defined in claim 11 , wherein edges of the substrate and edges of the interposer each comprise a plurality of step-shaped structures, wherein each of the step-shaped structures includes at least one corresponding transmission line.
The edges of both the substrate and the interposer have a series of step-shaped structures. Each of these steps includes at least one corresponding transmission line. This stepped design provides multiple signal paths. The integrated circuit die is mounted on a substrate, which sits in a cavity in the printed circuit board with the interposer surrounding the die. The printed circuit board has an additional overlapping transmission line.
16. An apparatus, comprising: a printed circuit board having a cavity and a first top surface; a package substrate formed within the cavity of the printed circuit board, wherein the package substrate is soldered to the printed circuit board and the package substrate has a second top surface; an interposer having a first portion that overlaps the second top surface without overlapping the first top surface and a second portion that overlaps the first top surface without overlapping the second top surface and a conductive line formed at the first top that conveys signals between the package substrate and the printed circuit board.
An apparatus has a printed circuit board with a cavity and a top surface. A package substrate sits inside this cavity and is soldered to the printed circuit board. The package substrate also has a top surface. An interposer has two portions: one overlapping the package substrate's top surface, and the other overlapping the printed circuit board's top surface. Critically, a conductive line is formed on the interposer's top surface that sends signals between the package substrate and the printed circuit board.
17. The apparatus defined in claim 16 , further comprising: an integrated circuit die mounted to the second top surface, wherein the conductive line formed at the first top surface conveys the signals between the integrated circuit die and the printed circuit board.
This apparatus also includes an integrated circuit die mounted on the package substrate's top surface. The conductive line on the interposer's top surface then carries signals between this integrated circuit die and the printed circuit board. The overall structure features a printed circuit board with a cavity housing a package substrate, and an interposer bridging them with a conductive line.
18. The apparatus defined in claim 17 , further comprising: an additional conductive line formed at a bottom surface of the interposer, wherein the bottom surface of the interposer is formed adjacent to the first top surface and the second top surface and the conductive line and the additional conductive line convey the signals between the integrated circuit die and the printed circuit board.
In addition to the conductive line on the *top* of the interposer, there's an *additional* conductive line formed on the *bottom* surface of the interposer. This bottom surface is adjacent to both the top surfaces of the printed circuit board and the package substrate. Both the conductive line and this additional conductive line work together to carry signals between the integrated circuit die and the printed circuit board. The overall structure features a printed circuit board with a cavity housing a package substrate.
19. The apparatus defined in claim 18 , wherein the conductive line comprises a first radio-frequency transmission line and the additional conductive line comprises a second radio-frequency transmission line.
The conductive line on the top of the interposer is a first radio-frequency transmission line, and the additional conductive line on the bottom of the interposer is a second radio-frequency transmission line. These RF transmission lines facilitate high-speed signal transfer. The overall structure features a printed circuit board with a cavity housing a package substrate.
20. The apparatus defined in claim 17 , wherein the integrated circuit die transmits signals to the printed circuit board over the conductive line at a data rate greater than 25 gigabits per second.
The integrated circuit die transmits signals to the printed circuit board over the conductive line at a data rate greater than 25 gigabits per second. This describes a high-speed communication link. The conductive line resides on an interposer spanning the package substrate and printed circuit board. The overall structure features a printed circuit board with a cavity housing a package substrate.
21. The apparatus defined in claim 18 , wherein a first end of the additional conductive line is electrically coupled to a first conductive pad on the second top surface and a second end of the additional conductive line is coupled to a second conductive pad on the first top surface.
One end of the additional conductive line (on the interposer's bottom) is electrically connected to a first conductive pad on the package substrate's top surface. The other end of this additional conductive line is connected to a second conductive pad on the printed circuit board's top surface. This specifies the connection points for the bottom-side conductive line. The interposer spans the gap between the boards.
22. The apparatus defined in claim 16 , further comprising: an additional conductive line formed adjacent to the conductive line formed at the first top surface, wherein the conductive line and the additional conductive line comprise transmission lines that transmit differential signals.
This invention relates to electronic circuitry, specifically to an apparatus for transmitting differential signals using conductive lines. The problem addressed is the need for improved signal transmission in integrated circuits, particularly for differential signaling which requires precise alignment and shielding to minimize interference and signal degradation. The apparatus includes a conductive line formed at a first top surface of a substrate, where this conductive line is part of a transmission line system. The invention further includes an additional conductive line formed adjacent to the first conductive line, with both lines configured to transmit differential signals. Differential signaling involves sending two complementary signals to reduce noise and improve signal integrity. The adjacent placement of the conductive lines ensures that the signals are transmitted in a balanced manner, with one line carrying the true signal and the other carrying the inverted signal. This configuration helps cancel out common-mode noise and enhances signal quality. The apparatus may also include additional features such as shielding structures or insulating layers to further improve signal integrity. The conductive lines are typically formed using semiconductor fabrication techniques, ensuring precise alignment and consistent performance. This design is particularly useful in high-speed digital circuits where signal integrity is critical, such as in data communication systems, processors, and memory interfaces. The invention provides a robust solution for differential signal transmission, addressing challenges related to noise, crosstalk, and signal distortion in integrated circuits.
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September 21, 2015
December 12, 2017
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