An electronic component housing package and the like capable of reducing time of infrared heating operation are provided. An electronic component housing package includes an insulating substrate including a plurality of insulating layers stacked on top of each other, an upper surface of the insulating substrate being provided with an electronic component mounting section. The plurality of insulating layers each containing a first metal oxide as a major constituent. The insulating substrate further includes a first metal layer in frame-like form disposed on an upper surface of an uppermost one of the plurality of insulating layers. The first metal layer contains a second metal oxide which is higher in infrared absorptivity than the first metal oxide.
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1. An electronic component housing package, comprising: an insulating substrate including a plurality of insulating layers stacked on top of each other, an upper surface of the insulating substrate being provided with an electronic component mounting section; and a first absorbing layer disposed on a side surface or a lower surface of the insulating substrate, the plurality of insulating layers each containing a first metal oxide as a major constituent, the insulating substrate further including a first metal layer in frame-like form disposed on an upper surface of an uppermost one of the plurality of insulating layers, the first metal layer containing a second metal oxide which is higher in infrared absorptivity than the first metal oxide, the first absorbing layer containing a same insulating material as an insulating material contained in the plurality of insulating layers or a same metal material as a metal material contained in the first metal layer, the first absorbing layer containing the second metal oxide.
An electronic component housing package designed for faster infrared heating. It features an insulating substrate made of stacked insulating layers, each primarily composed of a first metal oxide. An electronic component mounting section is located on the substrate's upper surface. A frame-like first metal layer, containing a second metal oxide with higher infrared absorptivity than the first, is placed on the uppermost insulating layer's top surface. A first absorbing layer, containing either the same insulating material as the insulating layers or the same metal as the first metal layer, and also containing the second metal oxide, is located on the side or bottom surface of the substrate.
2. The electronic component housing package according to claim 1 , wherein the first absorbing layer contains a same metal material as the metal material contained in the first metal layer.
The electronic component housing package described previously, where the first absorbing layer, located on the side or bottom of the insulating substrate, uses the same metal material as the frame-like first metal layer on the substrate's top surface. Both layers also contain a second metal oxide which provides high infrared absorptivity. The insulating substrate is made of stacked insulating layers each primarily composed of a first metal oxide.
3. The electronic component housing package according to claim 1 , wherein a content of the second metal oxide in the first absorbing layer falls in a range of 5 to 20% by mass.
The electronic component housing package described previously, where the first absorbing layer, located on the side or bottom of the insulating substrate, contains between 5 and 20% by mass of the second metal oxide. The insulating substrate is made of stacked insulating layers each primarily composed of a first metal oxide. A frame-like first metal layer, containing a second metal oxide which provides high infrared absorptivity, is placed on the uppermost insulating layer's top surface.
4. The electronic component housing package according to claim 1 , further comprising a second absorbing layer disposed between the plurality of insulating layers, the second absorbing layer containing a same insulating material as an insulating material contained in the plurality of insulating layers or a same metal material as a metal material contained in the first metal layer, and further containing the second metal oxide.
The electronic component housing package described previously further includes a second absorbing layer positioned between the multiple insulating layers of the insulating substrate. This second absorbing layer consists of either the same insulating material as the insulating layers or the same metal material as the frame-like first metal layer, located on the substrate's top surface, and also contains the second metal oxide which provides high infrared absorptivity. The insulating substrate is made of stacked insulating layers each primarily composed of a first metal oxide.
5. The electronic component housing package according to claim 4 , wherein the second absorbing layer contains the first metal oxide.
The electronic component housing package described previously includes a second absorbing layer positioned between the multiple insulating layers of the insulating substrate. This second absorbing layer also contains the first metal oxide, which is the major constituent of the insulating layers. A frame-like first metal layer, containing a second metal oxide which provides high infrared absorptivity, is located on the substrate's top surface, and the second absorbing layer contains either the same insulating material as the insulating layers or the same metal material as the frame-like first metal layer, and also contains the second metal oxide.
6. The electronic component housing package according to claim 4 , wherein a content of the second metal oxide in the second absorbing layer falls in a range of 5 to 20% by mass.
The electronic component housing package described previously includes a second absorbing layer positioned between the multiple insulating layers of the insulating substrate. This second absorbing layer contains between 5 and 20% by mass of the second metal oxide. The insulating substrate is made of stacked insulating layers each primarily composed of a first metal oxide. A frame-like first metal layer, containing a second metal oxide which provides high infrared absorptivity, is located on the substrate's top surface, and the second absorbing layer contains either the same insulating material as the insulating layers or the same metal material as the frame-like first metal layer, and also contains the second metal oxide.
7. The electronic component housing package according to claim 1 , wherein the second metal oxide comprises one or more metal oxides selected from among magnesium oxide, zirconium oxide, titanium oxide, chromium oxide, copper oxide, manganese oxide, silicon oxide, nickel oxide, tungsten oxide, and zinc oxide.
In the electronic component housing package described previously, the second metal oxide, which has high infrared absorptivity, is one or more of the following: magnesium oxide, zirconium oxide, titanium oxide, chromium oxide, copper oxide, manganese oxide, silicon oxide, nickel oxide, tungsten oxide, and zinc oxide. The insulating substrate is made of stacked insulating layers each primarily composed of a first metal oxide. A frame-like first metal layer, containing a second metal oxide which provides high infrared absorptivity, is placed on the uppermost insulating layer's top surface and a first absorbing layer, containing either the same insulating material as the insulating layers or the same metal as the first metal layer, and also containing the second metal oxide, is located on the side or bottom surface of the substrate.
8. The electronic component housing package according to claim 1 , wherein a volume content of the second metal oxide in the first metal layer falls in a range of 5 to 50% by volume.
In the electronic component housing package described previously, the frame-like first metal layer contains between 5 and 50% by volume of the second metal oxide. The insulating substrate is made of stacked insulating layers each primarily composed of a first metal oxide. A frame-like first metal layer, containing a second metal oxide which provides high infrared absorptivity, is placed on the uppermost insulating layer's top surface and a first absorbing layer, containing either the same insulating material as the insulating layers or the same metal as the first metal layer, and also containing the second metal oxide, is located on the side or bottom surface of the substrate.
9. An electronic apparatus, comprising: the electronic component housing package according to claim 1 ; an electronic component mounted on the electronic component mounting section; and a lid body which is joined, at a lower surface thereof, to the first metal layer so as to cover over the electronic component mounting section.
An electronic apparatus consists of: the electronic component housing package described previously; an electronic component mounted on the component mounting section on the housing package's top surface; and a lid joined to the frame-like first metal layer on the housing package's top surface, covering the component mounting section. The insulating substrate is made of stacked insulating layers each primarily composed of a first metal oxide. A frame-like first metal layer, containing a second metal oxide which provides high infrared absorptivity, is placed on the uppermost insulating layer's top surface and a first absorbing layer, containing either the same insulating material as the insulating layers or the same metal as the first metal layer, and also containing the second metal oxide, is located on the side or bottom surface of the substrate.
10. An electronic component housing package, comprising: an insulating substrate including a plurality of insulating layers stacked on top of each other, an upper surface of the insulating substrate being provided with an electronic component mounting section; and a second absorbing layer disposed between the plurality of insulating layers, the plurality of insulating layers each containing a first metal oxide as a major constituent, the insulating substrate further including a first metal layer in frame-like form disposed on an upper surface of an uppermost one of the plurality of insulating layers, the first metal layer containing a second metal oxide which is higher in infrared absorptivity than the first metal oxide, the second absorbing layer containing a same insulating material as an insulating material contained in the plurality of insulating layers or a same metal material as a metal material contained in the first metal layer, and further containing the second metal oxide.
An electronic component housing package is made of an insulating substrate with stacked insulating layers, each mainly composed of a first metal oxide. An electronic component mounting area is on the substrate's top surface. A frame-shaped first metal layer, containing a second metal oxide with higher infrared absorption than the first, is on top. A second absorbing layer, containing either the same insulation as the insulating layers or the same metal as the first metal layer, and the second metal oxide, is between the insulating layers.
11. The electronic component housing package according to claim 10 , wherein the second absorbing layer contains the first metal oxide.
The electronic component housing package described previously includes a second absorbing layer positioned between the multiple insulating layers of the insulating substrate. This second absorbing layer also contains the first metal oxide, which is the major constituent of the insulating layers. A frame-like first metal layer, containing a second metal oxide which provides high infrared absorptivity, is located on the substrate's top surface, and the second absorbing layer contains either the same insulating material as the insulating layers or the same metal material as the frame-like first metal layer, and also contains the second metal oxide. The insulating substrate is made of stacked insulating layers each primarily composed of a first metal oxide.
12. The electronic component housing package according to claim 10 , wherein a content of the second metal oxide in the second absorbing layer falls in a range of 5 to 20% by mass.
The electronic component housing package described previously includes a second absorbing layer positioned between the multiple insulating layers of the insulating substrate. This second absorbing layer contains between 5 and 20% by mass of the second metal oxide. The insulating substrate is made of stacked insulating layers each primarily composed of a first metal oxide. A frame-like first metal layer, containing a second metal oxide which provides high infrared absorptivity, is located on the substrate's top surface, and the second absorbing layer contains either the same insulating material as the insulating layers or the same metal material as the frame-like first metal layer, and also contains the second metal oxide.
13. The electronic component housing package according to claim 10 , wherein the second metal oxide comprises one or more metal oxides selected from among magnesium oxide, zirconium oxide, titanium oxide, chromium oxide, copper oxide, manganese oxide, silicon oxide, nickel oxide, tungsten oxide, and zinc oxide.
In the electronic component housing package described previously, the second metal oxide, which has high infrared absorptivity, is one or more of the following: magnesium oxide, zirconium oxide, titanium oxide, chromium oxide, copper oxide, manganese oxide, silicon oxide, nickel oxide, tungsten oxide, and zinc oxide. The insulating substrate is made of stacked insulating layers each primarily composed of a first metal oxide. A frame-like first metal layer, containing a second metal oxide which provides high infrared absorptivity, is placed on the uppermost insulating layer's top surface and a second absorbing layer, containing either the same insulating material as the insulating layers or the same metal as the first metal layer, and also containing the second metal oxide, is located between the insulating layers.
14. The electronic component housing package according to claim 10 , wherein a volume content of the second metal oxide in the first metal layer falls in a range of 5 to 50% by volume.
In the electronic component housing package described previously, the frame-like first metal layer contains between 5 and 50% by volume of the second metal oxide. The insulating substrate is made of stacked insulating layers each primarily composed of a first metal oxide. A frame-like first metal layer, containing a second metal oxide which provides high infrared absorptivity, is placed on the uppermost insulating layer's top surface and a second absorbing layer, containing either the same insulating material as the insulating layers or the same metal as the first metal layer, and also containing the second metal oxide, is located between the insulating layers.
15. An electronic apparatus, comprising: the electronic component housing package according to claim 10 ; an electronic component mounted on the electronic component mounting section; and a lid body which is joined, at a lower surface thereof, to the first metal layer so as to cover over the electronic component mounting section.
An electronic apparatus consists of: the electronic component housing package described previously; an electronic component mounted on the component mounting section on the housing package's top surface; and a lid joined to the frame-like first metal layer on the housing package's top surface, covering the component mounting section. The insulating substrate is made of stacked insulating layers each primarily composed of a first metal oxide. A frame-like first metal layer, containing a second metal oxide which provides high infrared absorptivity, is placed on the uppermost insulating layer's top surface and a second absorbing layer, containing either the same insulating material as the insulating layers or the same metal as the first metal layer, and also containing the second metal oxide, is located between the insulating layers.
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November 18, 2014
December 19, 2017
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