Electronic device case and material layer details of the same

Notice: More than one reissue application has been filed for the reissue of U.S. Pat. No. 10,153,799. The reissue applications are the present application and U.S. Reissue patent application Ser. Nos. 17/119,907 and 18/078,003.The present application isrelated to anda reissue of U.S. Pat. No. 10,153,799, and is a continuation of U.S. Reissue patent application Ser. No. 18/078,003, which is a continuation of U.S. Reissue patent application Ser. No. 17/119,907, filed Dec. 11, 2020, which are also applications for reissue of U.S. Pat. No. 10,153,799, whichclaimsthe benefit under 35 U.S.C. § 119(a) of apriority toKoreanpatent applicationPatent Application Ser. No. 10-2015-0144327,filed on Oct. 15, 2015 in the Korean Intellectual Property Officeand assigned Serial number 10-2015-0144327,,theentire disclosuredisclosuresof whichisarehereby incorporated by reference.

The present disclosure relates to a case of an electronic device; and more specifically, to a case that includes an area thereof as an antenna, and can provide waterproof, dustproof, and insulation qualities to protect an electronic device.

When a metallic case is applied to a portable terminal, such as a smartphone or a tablet, which performs wireless communications, an area of the metallic case may be utilized as an antenna. The area used as the antenna may be electrically separated from the remaining parts.

In the electronic device that uses an area of a case as an antenna according to the related art, dust or moisture may be introduced between the area of the case and the remaining parts.

To address the above-discussed deficiencies, it is a primary object to provide a case that can provide waterproof, dustproof, and insulation effects by properly arranging an aperture of an electronic device that uses an area of the case as an antenna, and an electronic device including the same.

In accordance with an embodiment of the present disclosure, a portable terminal is provided. The portable terminal may include a front cover that is arranged on a front surface of the portable terminal, a rear part that is arranged on a rear surface of the portable terminal, a side member that is formed (or disposed) integrally with or separately from the rear part while surrounding a space defined by the front cover and the rear part. Additionally, according to an embodiment of the disclosure, the portable device may further include a display device that is arranged in the space and at least a screen area of which is exposed through the front cover. Further, a communication circuit may be provided in the space and the communication circuit may be electrically connected to the side member and a processor, such that the processor is electrically connected to the communication circuit. In an embodiment, the side member of the portable device may include a first elongated metallic member that comprises a first metal and a second elongated metallic member that comprises the first metal. Also, the side member may be electrically separated from the first metallic member while a gap of a specific size is interposed between the first metallic member and the second metallic member. In an embodiment, a first polymer member may fill in the gap and a first organic material layer may be inserted between a first surface of the first polymer member and one surface of the first metallic member. Moreover, in an embodiment, the first organic material may contact the first surface of the first polymer member and the one surface of the first metallic member. Additionally, the first organic material may contact a second organic material layer that is inserted between a second surface of the first polymer member and one surface of the second metallic member; and therefore to face an opposite side of the first surface and contact the second surface of the first polymer member and the one surface of the second metallic member, wherein the first organic material layer and the second organic material layer may include the same material, the one surface of the first metallic member and the one surface of the second metallic member may include recesses of repeated or random patterns, and wherein the first organic material layer and the second organic material layer are formed to conform to the recesses.

In accordance with various embodiments of the present disclosure, an electronic device may include a front cover that defines a front surface of the electronic device, a rear part that defines a rear surface of the electronic device, a side member that is formed integrally with or separately from the rear part while surrounding a space defined by the front cover and the rear part. A display device may be disposed in the space and comprises a screen area exposed through the front cover. A communication circuit may also be disposed in the space and is electrically connected to the side member as well as to a processor. In various embodiments of the disclosure, a side member may include at least one hole area, a polymer member that is arranged on an inner wall of the hall area and a first organic material layer that is inserted between one surface of the polymer member and the inner wall of the hole area. Further, one surface of the hole area may include recesses of repeated or random patterns, and the organic material layer may be formed to conform to the recesses.

In accordance with another embodiment of the present disclosure, a case of an electronic device may include a body part that comprises a main body at least a portion of which is formed of a metallic material, and at least one auxiliary body including a first auxiliary body arranged adjacent to the main body formed of the metallic material. In an embodiment, at least a portion of the first auxiliary body may be used as an antenna and be configured to transmit and receive signals. Additionally, an insulation member may be disposed between the at least a portion of the first auxiliary body and the main body, and a bonding layer may be disposed in one of various places. These various places include at least one of an area between the insulation member and at least one area of the main body, or at least one area between the insulation member and the auxiliary body.

In accordance with another embodiment of the present disclosure, an electronic device may include a body part that comprises a main body at least a portion of which is formed of a metallic material, and at least one auxiliary body arranged adjacent to the main body formed of the metallic material and at least a portion of which is used as an antenna related to transmission and reception of signals, an insulation member that is arranged between the at least a portion of the auxiliary body and the main body, a bonding layer that is arranged at at least one of an area between the insulation member and at least one area of the main body or at least one area between the insulation member and the auxiliary body, a communication circuit electrically connected to the antenna and a printed circuit board on which the communication circuit is mounted.

Other embodiments and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses various embodiments of the present disclosure.

Before undertaking the DETAILED DESCRIPTION below, it may be advantageous to set forth definitions of certain words and phrases used throughout this patent document: the terms “include” and “comprise,” as well as derivatives thereof, mean inclusion without limitation; the term “or,” is inclusive, meaning and/or; the phrases “associated with” and “associated therewith,” as well as derivatives thereof, may mean to include, be included within, interconnect with, contain, be contained within, connect to or with, couple to or with, be communicable with, cooperate with, interleave, juxtapose, be proximate to, be bound to or with, have, have a property of, or the like; and the term “controller” means any device, system or part thereof that controls at least one operation, such a device may be implemented in hardware, firmware or software, or some combination of at least two of the same. It should be noted that the functionality associated with any particular controller may be centralized or distributed, whether locally or remotely. Definitions for certain words and phrases are provided throughout this patent document, those of ordinary skill in the art should understand that in many, if not most instances, such definitions apply to prior, as well as future uses of such defined words and phrases.

1 13 FIGS.through , discussed below, and the various embodiments used to describe the principles of the present disclosure in this patent document are by way of illustration only and should not be construed in any way to limit the scope of the disclosure. Those skilled in the art will understand that the principles of the present disclosure may be implemented in any suitably arranged electronic device and corresponding case for the electronic device.

Various embodiments of the present disclosure may be described with reference to accompanying drawings. Accordingly, those of ordinary skill in the art will recognize that modification, equivalent, and/or alternative on the various embodiments described herein can be variously made without departing from the scope and spirit of the present disclosure. With regard to description of drawings, similar elements may be marked by similar reference numerals.

In the disclosure disclosed herein, the expressions “have”, “may have”, “include” and “comprise”, or “may include” and “may comprise” used herein indicate existence of corresponding features (e.g., elements such as numeric values, functions, operations, or components) but do not exclude presence of additional features.

In the disclosure disclosed herein, the expressions “A or B”, “at least one of A or/and B”, or “one or more of A or/and B”, and the like used herein may include any and all combinations of one or more of the associated listed items. For example, the term “A or B”, “at least one of A and B”, or “at least one of A or B” may refer to all of the case (1) where at least one A is included, the case (2) where at least one B is included, or the case (3) where both of at least one A and at least one B are included.

The terms, such as “first”, “second”, and the like used herein may refer to various elements of various embodiments, but do not limit the elements. Furthermore, such terms may be used to distinguish one element from another element. For example, “a first user device” and “a second user device” may indicate different user devices regardless of the order or priority thereof. For example, “a first user device” and “a second user device” indicate different user devices.

It will be understood that when an element (e.g., a first element) is referred to as being “(operatively or communicatively) coupled with/to” or “connected to” another element (e.g., a second element), it may be directly coupled with/to or connected to the other element or an intervening element (e.g., a third element) may be present. In contrast, when an element (e.g., a first element) is referred to as being “directly coupled with/to” or “directly connected to” another element (e.g., a second element), it should be understood that there are no intervening element (e.g., a third element).

According to the situation, the expression “configured to” used herein may be used as, for example, the expression “suitable for”, “having the capacity to”, “designed to”, “adapted to”, “made to”, or “capable of”. The term “configured to” must not mean only “specifically designed to” in hardware. Instead, the expression “a device configured to” may mean that the device is “capable of” operating together with another device or other components. CPU, for example, a “processor configured to perform A, B, and C” may mean a dedicated processor (e.g., an embedded processor) for performing a corresponding operation or a generic-purpose processor (e.g., a central processing unit (CPU) or an application processor) which may perform corresponding operations by executing one or more software programs which are stored in a memory device.

Terms used in the present disclosure are used to describe specified embodiments and are not intended to limit the scope of the present disclosure. The terms of a singular form may include plural forms unless otherwise specified. Unless otherwise defined herein, all the terms used herein, which include technical or scientific terms, may have the same meaning that is generally understood by a person skilled in the art. It will be further understood that terms, which are defined in a dictionary and commonly used, should also be interpreted as is customary in the relevant related art and not in an idealized or overly formal detect unless expressly so defined herein in various embodiments of the present disclosure. In some cases, even if terms are terms which are defined in the specification, they may not be interpreted to exclude embodiments of the present disclosure.

An electronic device according to various embodiments of the present disclosure may include at least one of smartphones, tablet personal computers (PCs), mobile phones, video telephones, e-book readers, desktop PCs, laptop PCs, netbook computers, workstations, servers, personal digital assistants (PDAs), portable multimedia players (PMPs), Motion Picture Experts Group (MPEG-1 or MPEG-2) Audio Layer 3 (MP3) players, mobile medical devices, cameras, wearable devices (e.g., head-mounted-devices (HMDs), such as electronic glasses), an electronic apparel, electronic bracelets, electronic necklaces, electronic appcessories, electronic tattoos, smart watches, and the like.

According to another embodiment of the present disclosure, the electronic devices may be home appliances. The home appliances may include at least one of, for example, televisions (TVs), digital versatile disc (DVD) players, audios, refrigerators, air conditioners, cleaners, ovens, microwave ovens, washing machines, air cleaners, set-top boxes, home automation control panels, security control panels, TV boxes (e.g., Samsung HomeSync®, Apple TV®, or Google TV®), game consoles (e.g., Xbox® or PlayStation®), electronic dictionaries, electronic keys, camcorders, electronic picture frames, or the like.

According to another embodiment of the present disclosure, the photographing apparatus may include at least one of medical devices (e.g., various portable medical measurement devices (e.g., a blood glucose monitoring device, a heartbeat measuring device, a blood pressure measuring device, a body temperature measuring device, and the like)), a magnetic resonance angiography (MRA), a magnetic resonance imaging (MRI), a computed tomography (CT), scanners, and ultrasonic devices), navigation devices, global positioning system (GPS) receivers, event data recorders (EDRs), flight data recorders (FDRs), vehicle infotainment devices, electronic equipment for vessels (e.g., navigation systems and gyrocompasses), avionics, security devices, head units for vehicles, industrial or home robots, automatic teller's machines (ATMs), points of sales (POSs), or internet of things (e.g., light bulbs, various sensors, electric or gas meters, sprinkler devices, fire alarms, thermostats, street lamps, toasters, exercise equipment, hot water tanks, heaters, boilers, and the like).

According to another embodiment of the present disclosure, the electronic devices may include at least one of parts of furniture or buildings/structures, electronic boards, electronic signature receiving devices, projectors, or various measuring instruments (e.g., water meters, electricity meters, gas meters, or wave meters, and the like). In the various embodiments of the present disclosure, the electronic device may be one of the above-described various devices or a combination thereof. An electronic device according to an embodiment may be a flexible device. Furthermore, an electronic device according to an embodiment of the present disclosure may not be limited to the above-described electronic devices and may include other electronic devices and new electronic devices according to the development of technologies.

Hereinafter, an electronic device according to the various embodiments of the present disclosure may be described with reference to the accompanying drawings. The term “user” used herein may refer to a person who uses an electronic device or may refer to a device (e.g., an artificial intelligence electronic device) that uses an electronic device.

1 1 FIGS.A toF 1 FIG.A 1 FIG.B illustrate each of six sides of an electronic device according to various embodiments of the present disclosure.illustrates a left side of an electronic device, such that a user holding the electronic device and viewing the left side, as shown, would understand a front side of the electronic device is facing to the left, and a rear side of the electronic device is facing to the user's right. When the electronic device is rolled over, 90 degrees to the right, as shown in, the front side of the electronic device is now facing up.

1 FIG.C 1 1 FIGS.A andB 1 FIG.D illustrates a right side of the electronic device, as if the same device ofwas turned over once more, 90 degrees to the right. Another 90 degree turn in the same direction would make the electronic device appear as in, with the back side facing up.

1 FIG.E If the electronic device was turned on end, viewing a top side of the device such that the elongated sides extend toward and away from a user, the electronic device would be as that illustrated in.

1 FIG.E Finally, flipping the electronic device 180 degrees away from the user, would allow the user to see a bottom side of the electronic device, as illustrated in.

1 1 FIGS.A toF 100 110 120 130 100 110 100 Referring to, an electronic device will be described using the figures together, since each figure indeed represents the same electronic device, merely turned a different direction or a different amount of degrees, and each of these figures includes the same components, though not all components will be seen in every perspective view of the electronic device. The electronic device, for example, may include a front surface, a rear surface, and a case. According to various embodiments of the present disclosure, the electronic devicemay include a processor related to management of a display arranged on the front surface, a memory that stores data related to management of the processor, a communication circuit related to support of a communication function of the electronic device, and a printed circuit board on which the processor, the memory, and the communication circuit are mounted.

110 110 The front surfacemay include a front cover and a display unit. A home button and the like may be arranged on the front surface.

120 120 120 The rear surfacemay include a rear cover. A camera may be arranged on the rear surface. A battery may be arranged inside the rear surface.

130 110 120 130 110 120 130 130 130 110 120 140 130 140 130 131 132 133 134 135 136 131 132 133 134 135 136 131 132 133 134 135 136 140 110 For example, at least a portion of the casemay be arranged between the front surfaceand the rear surface, and the casemay include at least one surface (for example, a side member) that is exposed to the outside between the front surfaceand the rear surface. According to an embodiment, at least a portion of the casemay be formed of a metallic material. The entire casemay be formed of a metallic material, the entire periphery of the case, which is exposed to the outside between the front surfaceand the rear surface, may be formed of a metallic material, or at least a portion of a surface of the case, which is exposed to the outside, may be formed of a metallic material. At least one segmentation part(or an insulation layer (an insulation member and a bonding layer)) may be partially arranged at a periphery of the case. Depending on arrangement of the at least one segmentation part, the casemay include a body part that has a main body and one or more auxiliary bodies,,,,, and. At least some of the main body and the auxiliary bodies,,,,, andmay be formed of a metallic material. The main body and the auxiliary bodies,,,,, andmay be electrically or physically separated by the segmentation part. At least a portion of the main body may be covered by the front surface.

140 130 130 130 130 130 130 131 132 133 141 142 131 132 131 133 142 132 133 131 130 132 133 141 142 141 142 131 131 132 133 132 133 131 132 133 141 142 According to various embodiments of the disclosure, as illustrated, the segmentation partmay be arranged on at least one of a first side surfacea, a second side surfaceb, a third side surfacec, or a fourth side surfaced of the case. The first side surfacea (for example, an upper side surface), for example, may include a first auxiliary body, a second auxiliary body, a third auxiliary body, a first segmentation part, and a second segmentation part. The first auxiliary bodyand the second auxiliary body, for example, may be electrically separated from each other, and the first auxiliary bodyand the third auxiliary body, for example, may be electrically separated from each other through the second segmentation part. According to various embodiments, the second auxiliary bodyand the third auxiliary bodymay be integrally formed with the main body. In this case, the first auxiliary bodymay be electrically separated from the main body (for example, the caseincluding the second auxiliary bodyand the third auxiliary body) through the first segmentation partand the second segmentation part. According to various embodiments, the first segmentation partand the second segmentation partmay be connected to each other between surfaces of the first auxiliary bodyand the main body, which face each other, to form one structure. Accordingly, the first auxiliary bodymay be arranged in an island form that is electrically separated from the second auxiliary bodyand the third auxiliary body, which are connected to the main body, between the second auxiliary bodyand the third auxiliary body. The first auxiliary body, the second auxiliary body, the third auxiliary body, the first segmentation part, and the second segmentation partmay be arranged to have a rounded shape, from which a step is removed for smooth formation of an external appearance thereof.

143 130 144 130 145 146 130 141 142 143 144 145 146 131 132 133 134 135 136 According to various embodiments, a third segmentation partmay be arranged on the second side surfaceb, a fourth segmentation partmay be arranged on the third side surfacec, and a fifth segmentation partand a sixth segmentation partmay be arranged on the fourth side surfaced (for example, a lower side surface). The segmentation parts,,,,, and, for example, may be arranged to electrically separate a first auxiliary body, a second auxiliary body, a third auxiliary body, a fourth auxiliary body, a fifth auxiliary body, and a sixth auxiliary body.

130 143 133 134 130 144 132 135 130 145 134 136 146 135 136 131 132 133 134 135 136 100 100 131 132 133 134 135 136 For example, in consideration of the second side surfaceb, the third segmentation partmay be arranged to electrically separate the upper third auxiliary bodyand the lower fourth auxiliary body. Further, in consideration of the third side surfacec, the fourth segmentation partmay be arranged to electrically separate the upper second auxiliary bodyand the lower fifth auxiliary bodyFurther, in consideration of the fourth side surfaced, the fifth segmentation partmay be arranged to electrically separate the fourth auxiliary bodyand the sixth auxiliary body, and the sixth segmentation bodymay be arranged to electrically separate the fifth auxiliary bodyand the sixth auxiliary body. At least one of the above-mentioned auxiliary bodies,,,,, andmay be electrically connected to the communication circuit of the electronic deviceto be used as an antenna. In this regard, the electronic devicemay include a printed circuit board on which the communication circuit is mounted, and a connector (for example, a clip) that electrically connects at least the auxiliary bodies,,,,, and.

160 130 160 130 160 160 130 170 180 170 180 A SIM insertion part, for example, may be arranged on the first side surfacea. The SIM insertion part, for example, may have a shape that is stepped from the first side surfacea, and may have a shape of a through-hole that extends inwards. For example, a bonding layer and an insulation member having specific thicknesses may be formed (or disposed) on an inner surface of the SIM insertion partsuch that the inserted SIM and the SIM insertion partat least a portion of which is formed of a metallic material are electrically insulated from each other. According to various embodiments of the present disclosure, the fourth side surfaced, for example, may include an ear jackand a USB connector. The bonding layer and the insulation member, which have been described above, may be formed around the ear jackand the USB connectorto have specific thicknesses.

100 131 130 Meanwhile, various embodiments are not limited to the above-described structure. For example, the electronic devicemay include segmentation parts, the number of which is larger or smaller than that of the above-mentioned segmentation parts. Accordingly, some of the above-mentioned auxiliary bodies may be electrically connected to the main body and may be integrally formed. Accordingly, it may be understood that the auxiliary body described in various embodiments may include at least one segmentation part to be electrically separated from the main body and at least one segmentation part may be arranged in the electronic device. Hereinafter, an arrangement relationship between an auxiliary body and a main body (or between an auxiliary body and another auxiliary body) will be described with reference to the first auxiliary bodyand the main body that are arranged on the first surfacea.

2 FIG. is a view illustrating a case according to an embodiment of the present disclosure.

2 FIG. 230 230 230 231 131 239 239 239 132 239 239 133 239 239 Referring to, the case(for example, at least a portion of the side member), for example, may be at least one of the above-mentioned side surfaces, or a portion of the at least one side surface. At least one of an SIM connector, the USB connector, or an ear jack may be additionally arranged on one side of the case. The caseof an embodiment, which will be described below, exemplifies a shape of a portion of the body part that has an auxiliary body(for example, the first auxiliary body) and a main body. The main body, for example, may include a first main bodyb (for example, a form in which the second auxiliary bodyis connected to a central main bodya), a second main bodyc (for example, a form in which the third auxiliary bodyis connected to the central main bodya), and a central main bodya.

239 239 1 239 2 110 239 3 230 230 239 3 110 239 3 1 FIG. The central main bodya, for example, may include a camera hole-in which a camera is arranged, and a seating part-in which the front surfaceofis arranged. According to an embodiment, side walls-that extend farther than the inside of the caseby a predetermined distance may be arranged at a periphery of the case. The side walls-may be arranged to surround a periphery of the front surfacethat is seated on the side walls-.

230 240 140 239 231 240 240 240 239 231 240 239 231 230 240 239 231 240 240 240 240 240 231 239 231 239 239 231 239 240 240 230 The casemay include a bonding insulation layer(for example, the segmentation part) that is arranged between the main bodyand the auxiliary body. The bonding insulation layermay include an insulation member and a bonding layer that is arranged at at least a portion of the insulation member. The bonding layer may be arranged on pattern recesses or convexo-concave surfaces that are formed on one surface of the auxiliary body or the main body, together with an insulation member having a fluidity index of a specific value. According to an embodiment, the bonding insulation layermay include a first bonding insulation layera that is arranged between the main bodyb and the auxiliary body, and a second bonding insulation layerb that is arranged between the second main bodyc and the auxiliary body. The casemay include a third bonding insulation layerc that is arranged between the main bodya and the auxiliary body. For example, an insulation member and a bonding layer may be formed in the third insulation layerc, and according to an embodiment, only an insulation member may be included in the third insulation layerc while the bonding layer is removed. The first bonding insulation layera, the second bonding insulation layerb, and the third insulation layerc may be physically connected to each other to function to fix the auxiliary bodyto the main bodywhile electrically separating the auxiliary bodyand the main body. According to various embodiments, as the first main bodyb, the auxiliary body, and the second main bodyc are firmly bonded to each other, the first bonding insulation layera and the second bonding insulation layerb may perform a dustproof, dust minimizing, or dust reducing affect and also a water proof, water minimizing, water reducing, or water resistant function of preventing, minimizing, or reducing an introduction of dust or moisture into the casefrom the outside.

250 239 230 250 According to various embodiments of the present disclosure, an insulator applying layeris formed on one side of the central main bodya of the case. The insulator applying layer, for example, may perform a function of interrupting electrical connection to the printed circuit board that is seated thereon, or interrupting electrical connection to an antenna that is seated thereon.

3 FIG. is a view illustrating a part of a section of a case bonding structure according to an embodiment of the present disclosure.

3 FIG. 2 FIG. 331 131 231 340 140 240 331 339 239 239 340 Referring to, the case bonding structure (for example, A-A′ of) may include an auxiliary body(for example, the auxiliary bodiesand) that performs a function of an antenna of a communication circuit, a bonding insulation layer(for example, the segmentation partor the bonding insulation layer) that is connected and bonded to the auxiliary body, and a main body(for example, the main bodyor the second main bodyc) that is connected to the bonding insulation layer.

340 341 343 342 341 331 343 331 343 342 343 339 339 343 331 341 331 331 339 342 339 339 331 The bonding insulation layer, for example, may include a first bonding layer, an insulation member, and a second bonding layer. The first bonding layer, for example, may be arranged between the auxiliary bodyand the insulation memberto firmly bond the auxiliary bodyand the insulation member. The second bonding layermay be arranged between the insulation memberand the main bodyto firmly bond the main bodyand the insulation member. In this regard, one surface of the auxiliary body, which faces the first bonding layer, or all the surfaces of the auxiliary bodymay be provided to have recesses of a specific pattern or convexo-concaves. The pattern recesses or convexo-concaves formed on the at least one surface of the auxiliary bodymay have a specific roughness. In this regard, one surface of the main body, which faces the second bonding layer, or all the surfaces of the main bodymay be provided to have recesses of a specific pattern or convexo-concaves. The pattern recesses or convexo-concaves formed on the at least one surface of the main bodymay have a roughness that is the same as or similar to the roughness of the auxiliary body. The roughness, for example, may be Ra 0.1 to 1.5 μm. Further, the roughness may be Rz 0.5 to 5 μm.

341 342 341 342 The first bonding layer(or the second bonding layer), for example, may include an organic bonding layer material. The organic bonding layer material may be triazine thiol, dibutyl amino, dithio pirymidine, or a silane-based composition. According to various embodiments, a thickness of the first bonding layer(or the second bonding layer) may be 0.1 to 0.3 m.

343 343 The insulation member, for example, may include a polymer resin (or a polymer member). The polymer resin may be poly phenylene sulfide (PPS), poly butylene terephthalate (PBT), polyimide (PI), or polycarbonate (PC), and may include inorganic particles (ceramic, glass fibers, or the like) that are suitable for reinforcing mechanical properties. The thickness of the insulation member, for example, may be 0.5 to 2.5 mm.

4 FIG. is a view illustrating a case bonding structure according to an embodiment of the present disclosure.

4 FIG. 4 FIG. 3 FIG. 431 431 131 231 331 439 439 239 339 439 Referring to, according to various embodiments, recesses of a specific pattern may be formed in at least an area of a surface of a first auxiliary areaa of the auxiliary body(for example, the auxiliary bodies,, and). The recesses may have a first roughness. Further, recesses of a specific pattern or convexo-recesses may be formed in at least an area of a surface of a first main areaa of the main body(for example, the main bodiesand). The roughness of the recesses or convexo-concaves of the main bodymay have a second roughness. The roughness described inmay correspond to the first roughness (for example, Ra 0.1 to 1.5 μm, Rz 0.5 to 5 μm) described in. The second roughness may be the same as or similar to the first roughness.

431 431 439 439 A surface of the second auxiliary areab of the auxiliary bodymay have a third roughness. Further, a surface of the second main areab of the main bodymay have a fourth roughness. The third roughness (or the fourth roughness), for example, may have a relatively rough state value as compared with the first roughness (or the second roughness). For example, the third roughness may have a value of Ra 1.5 μm or more or Rz 5 μm or more. According to various embodiments, when the first roughness (or the second roughness) is Ra 0.1 μm or Rz 0.5 μm, the third roughness (or the fourth roughness) may be a value (for example, Ra 1.5 μm or Rz 5 μm) that exceeds Ra 0.1 μm (or Rz 0.5 μm).

110 120 130 341 342 According to an embodiment of the present disclosure, a portable terminal (or portable electronic device) may include a front cover(e.g., at least part of the front surface) that is arranged on a front surface of the portable terminal, a rear part (e.g., at least part of the rear surface) that is arranged on a rear surface of the portable terminal, a side member(e.g., at least part of the case) that is formed integrally with or separately from the rear part while surrounding a space defined by the front cover and the rear part, a display device that is arranged in the space and at least a screen area of which is exposed through the front cover, a communication circuit that is provided in the space and is electrically connected to the side member and a processor electrically connected to the communication circuit, wherein the side member may include a first elongated metallic member (e.g., at least part of the main body) that comprises a first metal, a second elongated metallic member (e.g., at least part of the auxiliary body) that comprises the first metal and is electrically separated from the first metallic member while a gap of a specific size is interposed between the first metallic member and the second metallic member, a first polymer member that is filled in the gap, a first organic material layer (e.g., the first bonding layer) that is inserted between a first surface of the first polymer member and one surface of the first metallic member to contact the first surface of the first polymer member and the one surface of the first metallic member and a second organic material layer (e.g., the second bonding layer) that is inserted between a second surface of the first polymer member and one surface of the second metallic member to face an opposite side of the first surface and contact the second surface of the first polymer member and the one surface of the second metallic member, wherein the first organic material layer and the second organic material layer may include the same material, the one surface of the first metallic member and the one surface of the second metallic member may include recesses of repeated or random patterns, and wherein the first organic material layer and the second organic material layer are formed to conform to the recesses.

According to various embodiments of the present disclosure, a roughness of the one surface of the first metallic member and a roughness of the one surface of the second metallic member are Ra 0.1 to 1.5 μm.

110 130 240 According to an embodiment of the present disclosure, an electronic device is provided. The electronic device may include a front cover (e.g., glass cover)(e.g., at least part of the front surface) that defines a front surface of the electronic device, a rear part that defines a rear surface of the electronic device, a side member (e.g., the case) that is formed integrally with or separately from the rear part while surrounding a space defined by the front cover and the rear part, a display device that is provided in the space and comprises a screen area exposed through the front cover, a communication circuit that is provided in the space and is electrically connected to the side member and a processor electrically connected to the communication circuit, wherein the side member may include at least one hole area, a polymer member (e.g., at least part of the segmentation part, at least part of the insulation layer, at least part of an insulation member of the bonding insulation layer, or a polymer resin) that is arranged on an inner wall of the hall area and a first organic material layer (e.g., the bonding layer) that is inserted between one surface of the polymer member and the inner wall of the hole area, wherein one surface of the hole area may include recesses of repeated or random patterns, and the organic material layer is formed to conform to the recesses.

According to various embodiments, the hole area may include at least one of an area into which an ear jack is inserted, an area into which a USB is inserted, or an area into which a SIM card is inserted.

5 FIG. 6 FIG. is a flow chart that illustrates a method for manufacturing a case according to an embodiment of the present disclosure.is a view illustrating a shape of a case in a case manufacturing process according to an embodiment of the present disclosure.

5 6 FIGS.and 501 503 505 507 509 507 509 Referring to, the method for manufacturing a case, for example, may include a preform preparing operation, an adhesive coating operation, an insert injection-molding operation, a bonding layer washing and removing operation, and a final machining and surface-processing operation. The bonding layer washing and removing operationmay be omitted depending on a condition of the manufacturing process. Further, the bonding layer washing and removing operation may be included in the surface-processing operation.

501 100 501 501 343 501 The preform preparing operation, for example, may be an operation of preparing a preform that will be utilized as a case of an electronic device. In the preform preparing operation, a preform, at least a portion of which is metallic, may be provided. The preform preparing operation, for example, may include a process of machining a metal that will be used as a case. The metal machining process may be a process of machining a mold into a specific form by inserting a metallic preform into an injection-molding mold of a specific size, and may include a processing operation of forming a space into which an insulation member (for example, the insulation member) (for example, a polymer resin) may be inserted. The preform preparing operationmay include at least one process of casting, rolling, extrusion, forging, full CNC, pressing, or a combination thereof.

501 131 231 331 431 239 339 439 501 501 110 The preform preparing operation, for example, may include a machining process of forming an auxiliary body (for example, the auxiliary bodies,,, and) (for example, an antenna) and a main body (for example, the main bodies,, and) such that the surface roughness of the auxiliary body and the surface roughness of the main body are Ra (average roughness) 0.001 to 1.5 μm or Rz (maximum roughness) 0.005 to 5 μm. Further, the preform preparing operationmay include a machining process of differently forming the roughness of the auxiliary body and the roughness of the main body depending on the locations of the facing surfaces of the auxiliary body and the main body. For example, the preform preparing operationmay include a metal machining process of making the roughness of an area that is covered by a front surface (for example, the front surface) larger than the roughness of an area exposed to the outside, in the facing surfaces of the auxiliary body and the main body. Through this, various embodiments may improve a support strength by increasing an area in which a bonding layer and an insulation member are arranged in areas (having large Ra and Rz values) having relatively rough surfaces, and may couple the bonding layer and the insulation member to the auxiliary body or the main body firmer to show waterproof, dustproof, and insulation effects in areas (having small Ra or Rz values) having relatively uniform surfaces.

503 503 The adhesive coating operationmay include a pre-processing process for removing metallic impurities, oil stains, and cutting oil that are stuck to a coating target (for example, the facing surfaces of the auxiliary body and the main body and an area of the main body). The pre-processing process, for example, may include a process of removing impurities on a surface of the coating target by complexly using a surfactant degreasing solution, an alkali degreasing solution, an acid degreasing solution, or the like. According to an embodiment, in the case of aluminum, the pre-processing process may include a surfactant processing process, an alkali processing process, and an acid processing process. The adhesive coating operationmay include a process of electro-depositing a material for a bonding layer while an electric current (0.5 to 5 A/dm2) to a surface of the coating target. The material used for the bonding layer, for example, may include an organic bonding material. The organic bonding layer material may be triazine thiol, dibuty amino, dithio pirymidine, or a silane-based composition, and a thickness of the coating layer may be 0.1 to 3 m.

503 503 503 Further, the bonding layer may be attached to various electrified surfaces so that it may be formed even after the coating target is plated or an anodizing layer that is thin enough to be electrified is formed. Accordingly, the adhesive coating operationmay include a surface processing process such as plating or anodizing according to a purpose of the coating. Further, the adhesive coating operationmay include a process of forming an anodizing layer and a bonding layer at the same time. For example, the adhesive coating operationmay include a process of forming an anodizing oxidation layer and a complex substance film of an adhesive at the same time.

505 505 505 343 The insert injection-molding operationmay include a process of inserting a polymer resin into a bonding layer area on which the adhesive is coated. Through this, the insert injection-molding operationmay be a process of electrically separating an antenna part (for example, the auxiliary body) and other metallic housing (for example, the main body) from the case. The antenna part may be utilized as an antenna of a specific communication module of an electronic device or an auxiliary antenna of a specific communication module to improve the efficiency of the antenna. During the insert injection-molding operation, the temperature of the mold and the temperature of an insert material (for example, the polymer resin) may be maintained at 130 C or more such that the polymer resin (for example, the insulation member) and the bonding layer substance sufficiently react with each other. The thickness of the insulation member layer, for example, may be 0.5 to 2.5 mm. The insulation member may be poly phenylene sulfide (PPS), poly butylene terephthalate (PBT), polyimide (PI), or polycarbonate (PC), and may include inorganic particles (ceramic, glass fibers, or the like) that are suitable for reinforcing mechanical properties. According to an embodiment of the present disclosure, the insulation member may be a resin a fluidity index of which is 24 to 30 g/10 min.

507 507 507 507 507 507 The bonding layer washing and removing operationmay be applied or omitted according to occasions or a process environment. The bonding layer washing and removing operationmay include a process of removing an adhesive layer (or a bonding layer attached to the outside of a metal) that does not react to be left in the adhesive coating operation. In this process, the bonding layer washing and removing operationmay include a flushing process of washing the bonding layer with water. The temperature of water in the flushing process may be about 40 to 60° C. The bonding layer washing and removing operationmay include a process of removing water left on a surface of a target object after the flushing process by using an air gun or an air shower facility. Further, the bonding layer washing and removing stepmay include a process of drying moisture to completely remove the moisture. The drying temperature may be about 60 to 100° C. The bonding layer washing and removing operationmay be a process of ensuring electrical connection of an electrically connected part of the electronic device and attachment forces of components during surface processing and removing stain errors, and may be selectively managed.

507 507 According to various embodiments of the present disclosure, the bonding layer washing and removing operationmay include an alkali cleaning process and an acid cleaning process. In the case of an aluminum material, the bonding layer washing and removing operationmay be performed during an anodizing pre-processing process.

509 509 509 6 FIG. The final machining and surface-processing operationmay be a process that is performed after the process of removing the bonding layer, and may be an operation in which manufacturing of the case is finished. The final processing and surface-processing operation, for example, may include a metal machining operation or an injection-molding operation. As illustrated in operationof, only an area that will be used as the case of the electronic device is left through a periphery machining operation and a battery area machining operation.

The aluminum metal member may be an Al—Mg alloy, an Al—Zn—Mg alloy, or an arbitrary aluminum alloy as well as pure aluminum. The above-mentioned polymer resin, for example, may include a thermoplastic resin. The thermoplastic resin may include polyethylene, polypropylene, polyvinyl chloride, polyvinyl acetate, polyacrylate ester, polymetaacrylate ester, unsaturated polyester, polyester, polyamide, polyether, polyurethane elastomer, polystyrene, polyarylsulfone, polyarylate, polyacetal, polyethylene terephthalate, polycarbonate, polyphenylene ether, polyphenylene Bauxite, polyphenylene sulfides, polybutadiene, polybutylene terephthalate, polymetalpanel, and a liquid crystal polymer alloy. Further, the thermoplastic resin may contain a glass filler, a carbon filler, metal whisker, calcium carbonate, a filer or a pigment and a stabilizer.

In addition to the above-mentioned case manufacturing process, various methods of arranging a bonding layer and an insulation member that connect an auxiliary body operated as an antenna of various embodiments of the present disclosure, and a main body may be applied. For example, at least a portion of the case includes an aluminum metal member, and a resin metal combiner that combines a thermoplastic resin member with the aluminum metal member, a membrane of the thermoplastic resin member formed in the aluminum metal member is an anode oxidized film having a thickness of 70 to 1500 nm, the thermoplastic resin member is brought into contact with the aluminum metal member by the anode oxidized film that allows triazine thiol in the interior of and at an upper portion of the thermoplastic resin member, and an infrared ray absorption spectrum peak strength of the anode oxidized film in a specific inspection environment may be 0.0001 to 0.16 nm.

Further, at least a portion of the case may be formed through an anode oxidizing process of taking an aluminum metal member as an anode, using an acid solution of 35 to 90 degrees, performing electrolysis at a current density of not less than 0.02 A/dm2 and less than 2.5 A/dm2, and forming an anode oxidized film having a film thickness of 70 to 1500 nm on the aluminum metal member, a flushing process of washing the aluminum metal member, by which the anode oxidized film is formed, with water of a temperature of not less than 5 degrees and less than 60 degrees, and a process of insert injection-molding a thermoplastic resin in the aluminum metal member in which the anode oxidized film is formed, after the flushing process.

According to various embodiments of the present disclosure, at least a portion of the case may be formed through an anode oxidizing process of taking an aluminum metal member as an anode, using an acid solution of 35 to 90 degrees, performing electrolysis at a current density of not less than 0.02 A/dm2 and less than 2.5 A/dm2, and forming an anode oxidized film having a film thickness of 70 to 1500 nm on the aluminum metal member, an electrolytic polymerizing process of taking the aluminum metal member, by which the anode oxidized film is formed, as an anode, electrolyzing the aluminum metal member in a water solution containing a triazine thiol derivative, and allowing the triazine thiol derivative in the interior of and at an upper portion of the anode oxidized film, a flushing process of washing the aluminum metal member, by which the anode oxidized film is formed, with water of a temperature of not less than 5 degrees and less than 60 degrees, and a process of insert injection-molding a thermoplastic resin in the aluminum metal member in which the anode oxidized film is formed, after the flushing process.

According to various embodiments of the present disclosure, at least a portion of the case may be formed through a process of taking an aluminum metal member as an anode, electrolyzing the aluminum metal member in an acid solution of 35 to 90 degrees containing a triazine thiol derivative at a current density of not less than 0.02 A/dm2 and less than 2.5 A/dm2, and forming an anode oxidized film having a film thickness of 70 to 1500 nm and having a thiol derivative in the interior of and at an upper portion thereof, on the aluminum metal member, a flushing process of washing the aluminum metal member in which the anode oxidized film containing the triazine thiol is formed, with water of not less than 5 degrees and less than 60 degrees and a process of insert injection-molding a thermoplastic resin in the aluminum metal member in which the anode oxidized film is formed, after the flushing process.

According to various embodiments of the present disclosure, at least a portion of the case may be formed through an anode oxidizing process of taking an aluminum metal member as an anode, using an acid solution of 35 to 90 degrees, performing electrolysis at a current density of not less than 0.02 A/dm2 and less than 2.5 A/dm2, and forming an anode oxidized film having a film thickness of 70 to 1500 nm on the aluminum metal member, an immersion process of immersing the aluminum metal member in which the anode oxidized film is formed in a solution containing a triazine thiol derivative to generate a triazine thiol derivative in the interior of and at an upper portion of the anode oxidized film, a flushing process of washing the aluminum metal member, by which the anode oxidized film is formed, with water of a temperature of not less than 5 degrees and less than 60 degrees, and a process of insert injection-molding a thermoplastic resin in the aluminum metal member in which the anode oxidized film is formed, after the flushing process.

According to various embodiments, the electronic device, for example, may include a metallic antenna (for example, the auxiliary body) in which at least a portion of the case is used as an antenna, a contact part of the metallic antenna, a contact part that is grounded to the metallic antenna, and PCBs. Here, the case of the electronic device according to various embodiments may include a metallic antenna, a metallic housing (for example, the main body) except for the metallic antenna, a polymer resin (for example, the insulation member) that connects the metallic antenna and the metallic housing, and a bonding layer (or an organic bonding layer) that fills the gaps between the metallic antenna and the metallic housing, and the polymer resin and maintains bonding force.

According to various embodiments of the present disclosure, a bonding insulation layer that performs at least one of a waterproof or water resistant function, a dustproof or dust resistant function, or an insulation function may be formed between the metal housing and the metal antenna that is a part of the metal housing used as an antenna. For example, various embodiments may provide a waterproof or water resistant affect by preventing, minimizing, or reducing an amount of water from penetrating into a gap between an external antenna part (for example, the auxiliary body) and the injection-molded joint part (for example, the bonding insulation layer) when the metallic case is applied to a wireless terminal (for example, the electronic device). The case of the electronic device according to various embodiments of the present disclosure may include a polymer resin material that connects the metallic antenna part and the metallic housing, and an organic adhesive layer that fills a gap between the polymer resin and the metallic antenna part or a gap between the polymer resin and the metallic housing and maintains a joining state thereof.

7 7 FIGS.A andB illustrate a left side and a right side, respectively, of a shape of a case surrounding an electronic device that is disposed between a front cover and a rear side of the case according to an embodiment of the present disclosure.

7 7 FIGS.A andB 1 FIG. 730 731 732 733 734 735 736 739 740 140 240 340 731 732 733 734 735 736 731 732 731 733 734 735 736 734 735 731 732 733 734 735 736 739 Referring to, the casemay include a body part that has one or more auxiliary bodies,,,,, andthat are electrically separated from the main bodyby one or more segmentation parts(for example, the segmentation partand the bonding insulation layersand). For example, as described above with reference toand the like, the auxiliary bodies,,,,, andmay include at least one of a first auxiliary bodythat is arranged a lateral side of an upper end of the body part, second auxiliary bodiesthat are arranged on the left and right sides of the first auxiliary body, a third auxiliary body, a fourth auxiliary bodythat is arranged on the left side of a lower end of the body part, a fifth auxiliary bodythat is arranged on the right side of the lower end of the body part, and a sixth auxiliary bodythat is arranged between the fourth auxiliary bodyand the fifth auxiliary body. Further, at least one of the above-mentioned auxiliary bodies,,,,, andmay be designed to be electrically or physically connected to the main bodyaccording to the design purpose thereof.

738 739 738 739 738 Contact partsmay be arranged in at least an area of the main body. The contact partsrelate to antenna performance, and may be arranged at at least a portion of the main body. The locations and number of the contact partsmay vary depending on the number of the communication modules applied to the electronic device and frequency band characteristics of the communication modules.

8 8 FIGS.A andB 8 FIG.A 8 FIG.B 8 FIG.A 8 FIG.B illustrate a configuration of an electronic device according to an embodiment of the present disclosure. In particular,illustrates a skewed view of the configuration, allowing a 3-dimensional perspective, highlighting the positioning of the components therein and allowing the viewer to understand where and how insertion of a printed circuit board (PCB) into the device with the case may be according to various embodiments of the present disclosure.illustrates the same device shown infrom a viewpoint looking straight on, such that no depth is illustrated. Indeed, the illustration ofappears as if the components of the device were all 2-dimensional.

8 FIG. 100 830 880 880 880 881 880 110 120 830 880 830 880 830 881 880 830 880 830 881 880 881 831 830 840 Referring to, the electronic device, for example, may include a caseand a printed circuit board. The printed circuit board (PCB), for example, may include at least one communication circuit that is operated based on at least one frequency band, a processor, and a memory. According to various embodiments of the present disclosure, the printed circuit boardmay include a contact part. As illustrated, the printed circuit boardmay be arranged on a front part (for example, the front part) (or the rear part) of the case. Further, if necessary, the case may be fixed to one side of the front part. For example, at least a portion of the printed circuit boardmay be arranged to be electrically separated from the case. Further, at least a portion of the printed circuit boardmay be arranged to be electrically connected to the case. According to an embodiment of the present disclosure, the contact partarranged in the printed circuit boardmay be electrically connected to the case. Through this, the printed circuit boardmay utilize at least a portion of the caseas a ground area. According to various embodiments, for example, the contact partof the printed circuit boardmay be connected to a communication circuit, and the contact partmay be electrically connected to at least one auxiliary body. The casemay include one or more auxiliary bodies that are partitioned by at least one segmentation part.

9 FIG. 8 FIG.B is a view exemplarily illustrating a section B-B′ as indicated in, this section being a part of a configuration of an electronic device according to an embodiment of the present disclosure.

9 FIG. 1 7 FIGS.and 100 930 980 990 990 881 980 930 990 990 931 131 231 331 431 731 831 930 931 931 980 931 Referring to, the electronic devicemay include a case, a printed circuit board, and a contact part. According to an embodiment, the contact partmay electrically or physically connect an area (for example, the contact part) of the printed circuit boardand one side of the case. For example, as illustrated, the contact partmay have a clip shape. In the drawing, the contact partmay be electrically connected to the auxiliary bodies(for example, the auxiliary bodies,,,,, and) of the case. The auxiliary body, for example, may be at least one of the one or more auxiliary bodies described with reference to. The auxiliary body, for example, may be electrically connected to a communication circuit of the printed circuit boardto perform a function of an antenna of the communication circuit. According to various embodiments, the auxiliary bodymay perform a function of a ground area of the communication circuit.

10 FIG. is a view illustrating an area of a case on an electronic device, according to an embodiment of the present disclosure.

10 FIG. 1030 1031 131 231 1039 239 339 1040 1050 1031 1030 1040 1050 1031 1040 1050 Referring to, an area of the caseof the electronic device may include an auxiliary body(for example, the auxiliary bodiesand), the main body(for example, the main bodiesand), an ear jack area, and an USB area. The auxiliary body, for example, may be at least one side of the case. Although the drawing exemplifies that the ear jack areaand the USB areaare arranged in the auxiliary bodyon the same side, various embodiments are not limited thereto. For example, the ear jack areaand the USB areamay be arranged in an auxiliary body on another side through change of a design.

1040 1045 1031 1043 240 1045 1043 1045 1043 1043 1041 341 1042 343 1041 1042 1045 1031 1039 1045 1039 1031 1045 The ear jack area, for example, may include a first hole areathat passes through the auxiliary body, and a first insulation layer(for example, a configuration corresponding to the bonding insulation layer) that is arranged on an inner wall of the first hole areato have a specific thickness. The first insulation layermay be bonded to an inner wall of the first hole areaand have a specific thickness, and a through-hole may be formed at a central portion of the first insulation layer. A diameter of the through-hole, for example, may be the same as or similar to a diameter of a connector of an inserted ear jack. The first insulation layer, for example, may include a first bonding layer(a configuration corresponding to the bonding layer) and a first insulation member(for example, a configuration corresponding to the insulation member). The first bonding layermay correspond to the above-mentioned organic bonding layer. The first insulation membermay be formed of the above-mentioned polymer resin. An inner wall of the first hole area, for example, may have the above-mentioned first roughness. Further, a roughness of an area of the outside (for example, a side close to the auxiliary bodyfrom the center of the main body) of the inner wall of the first hole areamay be smaller (smoother) than a roughness of an area (for example, a side close to the center of the main bodyfrom the auxiliary body) of the inside of the inner wall of the first hole area.

1050 1055 1031 1053 1055 1053 1055 1053 1053 1051 341 342 1052 343 1051 1052 1055 1039 1031 1055 1031 1039 1055 1043 1053 1043 1053 The USB area, for example, may include a second hole areathat passes through one side of a side part of the auxiliary bodyand a length along one axis of which is longer than a length along another axis thereof, and a second insulation layerthat is arranged on an inner wall of the second hole areato have a specific thickness. At least a portion of the second insulation layermay be bonded to the inner wall of the second hole areaand have a specific thickness, and a through-hole having a specific length may be formed at a central portion of the second insulation layer. A diameter of the through-hole, for example, may be the same as or similar to a diameter of an inserted USB connector. The second insulation layer, for example, may include a second bonding layer(a configuration corresponding to the bonding layeror) and a second insulation member(for example, a configuration corresponding to the insulation member). The second bonding layermay correspond to the above-mentioned organic bonding layer. The second insulation membermay be formed of the above-mentioned polymer resin. An inner wall of the second hole area, for example, may have the above-mentioned first roughness. Further, a roughness of an area of the inside (for example, a side close to the main bodyfrom the auxiliary body) of the inner wall of the second hole areamay be larger than a roughness of an area (for example, a side close to the auxiliary bodyfrom the main body) of the outside of the inner wall of the second hole areaThe first insulation layerand the second insulation layer, which have been described above, may have the same thickness from the inner wall of the hole area. Based on the first insulation layerand the second insulation layer, which have been described above, the electronic device may prevent, minimize, or reduce a likelihood or intensity of an electric shock, improve a resistance to an external pressure, and reduce a damage to the electronic device.

11 FIG. is a view illustrating another area of a case according to an embodiment of the present disclosure.

11 FIG. 10 FIG. 1130 1131 131 231 1139 239 339 1160 1131 1130 1160 1131 1040 1050 1160 1131 Referring to, an area of the caseof the electronic device may include an auxiliary body(for example, the auxiliary bodiesand), the main body(for example, the main bodiesand), and a SIM area. The auxiliary body, for example, may be at least one side of the case. Although the drawing exemplifies that only the SIM areais arranged on the auxiliary body, various embodiments are not limited thereto. For example, at least one of the ear jack areaand the USB area, which have been described in, as well as the SIM areamay be arranged in the auxiliary bodyaccording to a change of design or the like.

1160 1165 1131 1163 1165 1165 1160 The SIM area, for example, may include a third hole areathat passes through the auxiliary body, and a third insulation layerthat is arranged on an inner wall of the third hole areato have a specific thickness. According to various embodiments, as illustrated, the third hole areamay have a stepped shape. A cover that covers an opened part of the SIM areaafter the SIM card is inserted, for example, may be arranged in the stepped area.

1163 1165 1163 1163 1161 331 332 1162 343 1161 1162 1165 1139 1165 1139 1131 1131 1165 The third insulation layermay be bonded to an inner wall of the third hole areaand have a specific thickness, and a through-hole may be formed at a central portion of the third insulation layer. A diameter of the through-hole, for example, may be the same as or similar to a thickness of the inserted SIM card. The third insulation layer, for example, may include a third bonding layer(a configuration corresponding to the bonding layeror) and a third insulation member(for example, a configuration corresponding to the insulation member). The third bonding layermay correspond to the above-mentioned organic bonding layer. The third insulation membermay be formed of the above-mentioned polymer resin. An inner wall of the third hole area, for example, may have the above-mentioned first roughness. Further, a roughness of an area of the outside (for example, a side close to the auxiliary bodyfrom the center of the main body) of the inner wall of the third hole areamay be smaller (smoother) than a roughness of an area (for example, a side close to the center of the main bodyfrom the auxiliary body) of the inner wall of the third hole area.

1163 1165 1160 1163 1165 1163 1165 Through the third insulation layerthat is firmly arranged on an inner wall of the third hole areaof the above-mentioned SIM area, the electronic device may prevent, minimize, or reduce a size of an aperture being generated between the third insulation layerand the inner wall of the third hole area. Thus, the electronic device may further perform a waterproof or water resistant function and a dustproof or dust resistant function, while also preventing, minimizing, or reducing an electric shock, and firmly supporting the third insulation layerin the third hole area.

According to various embodiments of the present disclosure, a case of an electronic device is provided. The case may include a body part that comprises a main body at least a portion of which is formed of a metallic material, and at least one auxiliary body arranged adjacent to the main body formed of the metallic material and at least a portion of which is used as an antenna related to transmission and reception of signals, an insulation member that is arranged between the at least a portion of the auxiliary body and the main body and a bonding layer that is arranged at at least one of an area between the insulation member and at least one area of the main body or at least one area between the insulation member and the auxiliary body.

According to various embodiments of the present disclosure, a roughness of a surface of the main body, which faces the insulation member, or a surface of the auxiliary body, which faces the insulation member, is Rz 0.01 to 3 μm or Ra 0.01 to 1.5 μm.

According to various embodiments of the present disclosure, a roughness of a periphery of a surface of the main body, which faces the insulation member, is different from a roughness of a central portion of the surface of the main body.

According to various embodiments of the present disclosure, the roughness of the periphery of the surface of the main body is smaller than the roughness of the central portion of the surface of the main body.

According to various embodiments of the present disclosure, a roughness of a periphery of a surface of the auxiliary body, which faces the insulation member, is different from a roughness of a central portion of the surface of the auxiliary body.

According to various embodiments of the present disclosure, the roughness of the periphery of the surface of the auxiliary body is smaller than the roughness of the central portion of the surface of the auxiliary body.

According to various embodiments of the present disclosure, the insulation member comprises a polymer resin comprising at least one of poly phenylene sulfide (PPS), poly butylene terephthalate (PBT), polyimide (PI), or polycarbonate (PC).

According to various embodiments of the present disclosure, the insulation member is formed of a polymer resin containing inorganic particles.

According to various embodiments of the present disclosure, the insulation member has a thickness of 0.5 to 2.5 mm.

According to various embodiments of the present disclosure, the bonding layer comprises an organic bonding layer formed of at least one of triazine thiol, dibutyl amino, dithio pirymidine, or a silane-based composition.

According to various embodiments of the present disclosure, the bonding layer has a thickness of 0.1 to 3 m.

According to various embodiments of the present disclosure, the bonding layer is arranged in an area of a side periphery of the main body.

According to various embodiments of the present disclosure, the bonding layer is arranged in a transverse end area of the auxiliary body that is longer transversely than longitudinally.

According to various embodiments of the present disclosure, the bonding layer is arranged in all parts of surfaces of the main body and the auxiliary body, which face each other.

According to various embodiments of the present disclosure, an electronic device may include a body part that comprises a main body at least a portion of which is formed of a metallic material, and at least one auxiliary body arranged adjacent to the main body formed of the metallic material and at least a portion of which is used as an antenna related to transmission and reception of signals, an insulation member that is arranged between the at least a portion of the auxiliary body and the main body, a bonding layer that is arranged at at least one of an area between the insulation member and at least one area of the main body or at least one area between the insulation member and the auxiliary body, a communication circuit electrically connected to the antenna and a printed circuit board on which the communication circuit is mounted.

According to various embodiments of the present disclosure, the electronic device may further include a front part that is arranged on a front surface of the main body and a rear part that is arranged on a rear surface of the main body, wherein the auxiliary body is arranged such that at least a portion of the auxiliary body is exposed to the outside between the front part and the rear part, and wherein the bonding layer is arranged between the exposed area of the auxiliary body and the insulation member or between an exposed area of the main body and the insulation member.

According to various embodiments of the present disclosure, there is provided a metallic case of an electronic device having an segmentation structure, the metallic case including a main body at least a portion of which is metallic, an antenna part that is partitioned from the main body, at least a portion of which is metallic, and at least a portion of which is exposed to the outside, an insulation member that is arranged in a gap formed between the main body and the antenna part due to the partitioning, and a bonding layer that is arranged at one site between the insulation member and the main body and between the antenna part and the insulation member.

According to various embodiments of the present disclosure, a case of an electronic device may include a main body that has a recess at at least a portion thereof and at least a portion of which is metallic, an auxiliary body that is physically spaced apart by a distance from the recess of the main body and at least a portion of which is metallic, an insulation member that is arranged between the main body and the auxiliary body to fix the auxiliary body to the main body while electrically separating the main body and the auxiliary body, and a bonding layer that is arranged at one site between the insulation member and the main body and between the auxiliary body and the insulation member.

12 FIG. is a view illustrating an electronic device management environment according to an embodiment of the present disclosure.

12 FIG. 1200 1201 1202 1204 1206 1262 Referring to, the electronic device management environmentaccording to an embodiment of the present disclosure may include an electronic device, a first external electronic device, a second external electronic device, a server, and a network.

1262 1201 1202 1204 1201 1206 1262 1201 1202 1204 1206 1206 1201 1262 1206 1201 1206 1201 The networkmay allow formation of a communication channel between the electronic deviceand the first external electronic device, or between the second external electronic deviceor the electronic deviceand the server. The networkallows contents stored in the electronic deviceto be transmitted to the first external electronic device, the second external electronic device, or the server. The servermay form a communication channel with the electronic devicethrough the network. The servermay receive contents from the electronic deviceand store the received contents. Further, the servermay provide a feedback for the reception of the contents to the electronic device.

1201 1210 1220 1230 1250 1260 1270 1201 2076 1270 1201 1270 1220 1201 1201 The above-mentioned electronic devicemay include a bus, a processor, a memory, an input/output interface, a display, and a communication interface. Further, the electronic devicemay include an antennathat is connected to the communication interface. In addition, the electronic devicemay further include an antenna assistant device that is arranged between the communication interfaceand the processor. In some embodiments, the electronic devicemay exclude at least one of the elements or may additionally include another element. Further, the electronic devicemay include a housing (or the case) that surrounds or receives at least some of the configurations.

1210 1220 1270 The busmay be, for example, a circuit which connects the componentstowith each other and transmits a communication signal (e.g., a control message and/or data) between the components.

1220 1220 1201 1220 1220 1220 The processormay include one or more of a central processing unit (CPU), an application processor (AP), or a communication processor (CP). For example, the processormay perform calculation or data processing about control and/or communication of at least another of the components of the electronic device. The processormay control a variable value of a variable inductor, which has been described above. For example, when the antenna performance is a reference value or less, the processormay change the physical characteristics of the antenna assistant device by adjusting an inductance value of the variable inductor. Through this, the processmay improve frequency characteristics by adjusting sub-resonance characteristics.

1230 1230 1201 1230 1240 1240 1241 1243 1245 1247 1241 1243 1245 The memorymay include a volatile and/or non-volatile memory. The memorymay store, for example, a command or data associated with at least another of the components of the electronic device. According to an embodiment, the memorymay store software and/or a program. The programmay include, for example, a kernel, a middleware, an application programming interface (API), and/or an least one application program(or “at least one application”), and the like. At least part of the kernel, the middleware, or the APImay be referred to as an operating system (OS).

1241 1210 1220 1230 1243 1245 1247 1243 1245 1247 1201 1241 The kernelmay control or manage, for example, system resources (e.g., the bus, the processor, or the memory, and the like) used to execute an operation or function implemented in the other programs (e.g., the middleware, the API, or the application program). Also, as the middleware, the API, or the application programaccesses a separate component of the electronic device, the kernelmay provide an interface which may control or manage system resources.

1243 1245 1247 1241 The middlewaremay play a role as, for example, a go-between such that the APIor the application programcommunicates with the kernelto communicate data.

1243 1247 1243 1210 1220 1230 1201 1247 1243 1247 Also, the middlewaremay process one or more work requests, received from the application program, in order of priority. For example, the middlewaremay assign priority which may use system resources (the bus, the processor, or the memory, and the like) of the electronic deviceto at least one of the at least one application program. For example, the middlewaremay perform scheduling or load balancing for the one or more work requests by processing the one or more work requests in order of the priority assigned to the at least one of the at least one application program.

1245 1247 1241 1243 1245 The APImay be, for example, an interface in which the application programcontrols a function provided from the kernelor the middleware. For example, the APImay include at least one interface or function (e.g., a command) for file control, window control, image processing, or text control, and the like.

1250 1201 1250 1201 The input and output interfacemay play a role as, for example, an interface which may transmit a command or data input from a user or another external device to another component (or other components) of the electronic device. Also, input and output interfacemay output an instruction or data received from another component (or other components) of the electronic deviceto the user or the other external device.

1260 1260 1260 The displaymay include, for example, a liquid crystal display (LCD), a light emitting diode (LED) display, an organic LED (OLED) display, a microelectromechanical systems (MEMS) display, or an electronic paper display. The displaymay display, for example, a variety of content (e.g., text, images, videos, icons, or symbols, and the like) to the user. The displaymay include a touch screen, and may receive, for example, touch, gesture, proximity, or a hovering input using an electronic pen or part of a body of the user.

1270 1201 1202 1204 1206 1270 1262 1204 1206 The communication interfacemay establish communication between, for example, the electronic deviceand an external device (e.g., a first external electronic device, a second external electronic device, or a server). For example, the communication interfacemay connect to a networkthrough wireless communication or wired communication and may communicate with the external device (e.g., the second external electronic deviceor the server).

1264 1264 The wireless communication may use, for example, at least one of long term evolution (LTE), LTE-advanced (LTE-A), code division multiple access (CDMA), wideband CDMA (WCDMA), universal mobile telecommunications system (UMTS), wireless broadband (WiBro), or global system for mobile communications (GSM), and the like as a cellular communication protocol. Also, the wireless communication may include, for example, local-area communication. The local-area communicationmay include, for example, at least one of wireless-fidelity (Wi-Fi) communication, Bluetooth® (BT) communication, near field communication (NFC), or global navigation satellite system (GNSS) communication, and the like.

1201 An MST module may generate a pulse based on transmission data using an electromagnetic signal and may generate a magnetic field signal based on the pulse. The electronic devicemay output the magnetic field signal to a point of sales (POS) system. The POS system may restore the data by detecting the magnetic field signal using an MST reader and converting the detected magnetic field signal into an electric signal.

1262 1270 1 FIG. The GNSS may include, for example, at least one of a global positioning system (GPS), a Glonass®, a Beidou® navigation satellite system (hereinafter referred to as “Beidou”), or a Galileo® (i.e., the European global satellite-based navigation system) according to an available area or a bandwidth, and the like. Hereinafter, the “GPS” used herein may be interchangeably with the “GNSS”. The wired communication may include at least one of, for example, universal serial bus (USB) communication, high definition multimedia interface (HDMI) communication, recommended standard 232 (RS-232) communication, or plain old telephone service (POTS) communication, and the like. The networkmay include a telecommunications network, for example, at least one of a computer network (e.g., a local area network (LAN) or a wide area network (WAN)), the Internet, or a telephone network. The communication interfacemay use the auxiliary body described with reference toor the like as a part of an antenna or the entire antenna.

1202 1204 1201 1206 1201 1202 1204 1206 1201 1202 1204 106 1202 1204 1206 1201 1201 Each of the first and second external electronic devicesandmay be the same as or different device from the electronic device. According to an embodiment, the servermay include a group of one or more servers. According to various embodiments, all or some of operations executed in the electronic devicemay be executed in another electronic device or a plurality of electronic devices (e.g., the first external electronic device, the second external electronic device, or the server). According to an embodiment of the present disclosure, if the electronic deviceshould perform any function or service automatically or according to a request, it may request another device (e.g., the first external electronic device, the second external electronic device, or the server) to perform at least part of the function or service, rather than executing the function or service for itself or in addition to the function or service. The other electronic device (e.g., the first external electronic device, the second external electronic device, or the server) may execute the requested function or the added function and may transmit the executed result to the electronic device. The electronic devicemay process the received result without change or additionally and may provide the requested function or service. For this purpose, for example, cloud computing technologies, distributed computing technologies, or client-server computing technologies may be used.

13 FIG. is a block diagram of an electronic device according to various embodiments of the present disclosure.

1301 100 1201 1301 1310 1320 1329 1330 1340 1350 1360 1370 1380 1391 1395 1396 1397 1398 1 FIG. 12 FIG. 13 FIG. An electronic devicemay include, for example, the entirety or a part of the electronic deviceandofor. Referring to, the electronic devicemay include at least one processor (for example, an application processor (AP)), a communication module, a subscriber identification module card, a memory, a sensor module, an input device, a display, an interface, an audio module, a camera module, a power management module, a battery, an indicator, or a motor.

1310 1310 1310 1310 1321 1310 1310 1320 13 FIG. 1 FIG. The processormay drive, for example, an operating system (OS) or an application program to control a plurality of hardware or software components connected thereto and may process and compute a variety of data. The processormay be implemented with, for example, a system on chip (SoC). According to an embodiment, the processormay include a graphic processing unit (GPU) (not shown) and/or an image signal processor (not shown). The processormay include at least some (e.g., a cellular module) of the components shown in. The processormay load a command or data received from at least one of other components (e.g., a non-volatile memory) into a volatile memory to process the data and may store various data in a non-volatile memory. The processormay process transmission and reception of signals by using the auxiliary body described with reference toand the like as an antenna or the entire antenna of the communication module.

1320 1370 1320 1321 1322 1323 1324 1325 1326 1327 1320 1320 12 FIG. The communication modulemay have the same or similar configuration to a communication interfaceof. The communication modulemay include, for example, the cellular module, a wireless-fidelity (Wi-Fi) module, a Bluetooth® (BT) module, a global navigation satellite system (GNSS) module(e.g., a GPS module, a Glonass® module, a Beidou® module, or a Galileo® module), a near field communication (NFC) module, an MST module, and a radio frequency (RF) module. An antenna assistant device may be connected to at least one of the above-mentioned communication module. A capacitance of a capacitor module, an inductance of an inductor module, and the like of the connected antenna assistant device may correspond to a frequency band managed by the corresponding communication module or may be adjusted. The communication modulemay be electrically connected to at least one auxiliary body and may transmit and receive signals by using the auxiliary body.

1321 1321 1301 1329 1321 1310 1321 The cellular modulemay provide, for example, a voice call service, a video call service, a text message service, or an Internet service, and the like through a communication network. According to an embodiment of the present disclosure, the cellular modulemay identify and authenticate the electronic devicein a communication network using the SIM(e.g., a SIM card). According to an embodiment, the cellular modulemay perform at least part of functions which may be provided by the processor. According to an embodiment of the present disclosure, the cellular modulemay include a communication processor (CP).

1322 1323 1324 1325 1326 1321 1322 1323 1324 1325 1326 The Wi-Fi module, the BT module, the GNSS module, the NFC module, or the MST modulemay include, for example, a processor for processing data transmitted and received through the corresponding module. According to various embodiments, at least some (e.g., two or more) of the cellular module, the Wi-Fi module, the BT module, the GNSS module, the NFC module, or the MST modulemay be included in one integrated chip (IC) or one IC package.

1327 1327 1321 1322 1323 1324 1325 1326 The RF modulemay transmit and receive, for example, a communication signal (e.g., an RF signal). Though not shown, the RF modulemay include, for example, a transceiver, a power amplifier module (PAM), a frequency filter, or a low noise amplifier (LNA), or an antenna, and the like. According to another embodiment, at least one of the cellular module, the Wi-Fi module, the BT module, the GNSS module, the NFC module, or the MST modulemay transmit and receive an RF signal through a separate RF module.

1329 1329 The SIMmay include, for example, a card which includes a SIM and/or an embedded SIM. The SIMmay include unique identification information (e.g., an integrated circuit card identifier (ICCID)) or subscriber information (e.g., an international mobile subscriber identity (IMSI)).

1330 1230 1332 1334 1332 12 FIG. The memory(e.g., a memoryof) may include, for example, an embedded memoryor an external memory. The embedded memorymay include at least one of, for example, a volatile memory (e.g., a dynamic random access memory (DRAM), a static RAM (SRAM), a synchronous dynamic RAM (SDRAM), and the like), or a non-volatile memory (e.g., a one-time programmable read only memory (OTPROM), a programmable ROM (PROM), an erasable and programmable ROM (EPROM), an electrically erasable and programmable ROM (EEPROM), a mask ROM, a flash ROM, a flash memory (e.g., a NAND flash memory or a NOR flash memory, and the like), a hard drive, or a solid state drive (SSD)).

1334 1334 1301 The external memorymay include a flash drive, for example, a compact flash (CF), a secure digital (SD), a micro-SD, a mini-SD, an extreme digital (xD), a multimedia car (MMC), or a memory stick, and the like. The external memorymay operatively and/or physically connect with the electronic devicethrough various interfaces.

1336 1330 1336 1336 1301 1336 1301 1336 The secure modulemay be a module which has a relatively higher secure level than the memoryand may be a circuit which stores secure data and guarantees a protected execution environment. The secure modulemay be implemented with a separate circuit and may include a separate processor. The secure modulemay include, for example, an embedded secure element (eSE) which is present in a removable smart chip or a removable SD card or is embedded in a fixed chip of the electronic device. Also, the secure modulemay be driven by an OS different from the OS of the electronic device. For example, the secure modulemay operate based on a java card open platform (JCOP) OS.

1340 1301 1340 1340 1340 1340 1340 1340 1340 1340 1340 1340 1340 1340 1340 1340 1340 1301 1340 1310 1310 1310 1301 1340 1301 1340 1310 1340 1310 The sensor modulemay measure, for example, a physical quantity or may detect an operation state of the electronic device, and may convert the measured or detected information to an electric signal. The sensor modulemay include at least one of, for example, a gesture sensorA, a gyro sensorB, a biometric pressure sensorC, a magnetic sensorD, an acceleration sensorE, a grip sensorF, a proximity sensorG, a color sensorH (e.g., red, green, blue (RGB) sensor), a biometric sensorI, a temperature/humidity sensorJ, an illumination sensorK, or an ultraviolet (UV) sensorM. Additionally or alternatively, the sensor modulemay further include, for example, an e-nose sensor (not shown), an electromyography (EMG) sensor (not shown), an electroencephalogram (EEG) sensor (not shown), an electrocardiogram (ECG) sensor (not shown), an infrared (IR) sensor (not shown), an iris sensor (not shown), and/or a fingerprint sensor (not shown), and the like. The sensor modulemay further include a control circuit for controlling at least one or more sensors included therein. According to various embodiments of the present disclosure, the electronic devicemay further include a processor configured to control the sensor module, as part of the processoror to be independent of the processor. While the processoris in a sleep state, the electronic devicemay control the sensor module. In some embodiments, the electronic devicemay further include a processor configured to control the sensor moduleas a part of or separately from the processor, and may control the sensor modulewhile the processoris in a sleep state.

1350 1352 1354 1356 1358 1352 1352 1352 The input devicemay include, for example, a touch panel, a (digital) pen sensor, a key, or an ultrasonic input unit. The touch panelmay use at least one of, for example, a capacitive type, a resistive type, an infrared type, or an ultrasonic type. Also, the touch panelmay further include a control circuit. The touch panelmay further include a tactile layer and may provide a tactile reaction to a user.

1354 1352 1356 1358 1301 1388 The (digital) pen sensormay be, for example, part of the touch panelor may include a separate sheet for recognition. The keymay include, for example, a physical button, an optical key, or a keypad. The ultrasonic input unitmay allow the electronic deviceto detect a sound wave using a microphone (e.g., a microphone) and to verify data through an input tool generating an ultrasonic signal.

1360 1260 1362 1364 1366 1362 160 1260 1362 1362 1352 1364 1366 1301 1360 1362 1364 1366 12 FIG. The display(e.g., a displayof) may include a panel, a hologram device, or a projector. The panelmay include the same or similar configuration to the displayor. The panelmay be implemented to be, for example, flexible, transparent, or wearable. The paneland the touch panelmay be integrated into one module. The hologram devicemay show a stereoscopic image in a space using interference of light. The projectormay project light onto a screen to display an image. The screen may be positioned, for example, inside or outside the electronic device. According to an embodiment, the displaymay further include a control circuit for controlling the panel, the hologram device, or the projector.

1370 1372 1374 1376 1378 1370 170 1270 1370 2 12 FIG.or The interfacemay include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB), an optical interface, or a D-subminiature. The interfacemay be included in, for example, a communication interfaceorshown in. Additionally or alternatively, the interfacemay include, for example, a mobile high definition link (MHL) interface, an SD card/multimedia card (MMC) interface, or an infrared data association (IrDA) standard interface.

1380 1380 1250 1380 1382 1384 1386 1388 12 FIG. The audio modulemay convert a sound and an electric signal in dual directions. At least part of components of the audio modulemay be included in, for example, an input and output interface(or a user interface) shown in. The audio modulemay process sound information input or output through, for example, a speaker, a receiver, an earphone, or the microphone, and the like.

1391 1391 The camera modulemay be a device which captures a still image and a moving image. According to an embodiment of the present disclosure, the camera modulemay include one or more image sensors (not shown) (e.g., a front sensor or a rear sensor), a lens (not shown), an image signal processor (ISP) (not shown), or a flash (not shown) (e.g., an LED or a xenon lamp).

1395 1301 1395 1396 1396 1396 The power management modulemay manage, for example, power of the electronic device. According to an embodiment of the present disclosure, though not shown, the power management modulemay include a power management integrated circuit (PMIC), a charger IC or a battery or fuel gauge. The PMIC may have a wired charging method and/or a wireless charging method. The wireless charging method may include, for example, a magnetic resonance method, a magnetic induction method, or an electromagnetic method, and the like. An additional circuit for wireless charging, for example, a coil loop, a resonance circuit, or a rectifier, and the like may be further provided. The battery gauge may measure, for example, the remaining capacity of the batteryand voltage, current, or temperature thereof while the batteryis charged. The batterymay include, for example, a rechargeable battery or a solar battery.

1397 1301 1310 1398 1301 The indicatormay display a specific state of the electronic deviceor part (e.g., the processor) thereof, for example, a booting state, a message state, or a charging state, and the like. The motormay convert an electric signal into mechanical vibration and may generate vibration or a haptic effect, and the like. Though not shown, the electronic devicemay include a processing unit (e.g., a GPU) for supporting a mobile TV. The processing unit for supporting the mobile TV may process media data according to standards, for example, a digital multimedia broadcasting (DMB) standard, a digital video broadcasting (DVB) standard, or a mediaFlo® standard, and the like.

Each of the above-mentioned elements of the electronic device according to various embodiments of the present disclosure may be configured with one or more components, and names of the corresponding elements may be changed according to the type of the electronic device. The electronic device according to various embodiments of the present disclosure may include at least one of the above-mentioned elements, some elements may be omitted from the electronic device, or other additional elements may be further included in the electronic device. Also, some of the elements of the electronic device according to various embodiments of the present disclosure may be combined with each other to form one entity, thereby making it possible to perform the functions of the corresponding elements in the same manner as before the combination.

Various embodiments of the present disclosure can provide at least one of a waterproof improving effect, a dustproof improving effect, an insulation effect, and a support effect by arranging a bonding layer between insulation members arranged in various areas (for example, an antenna that uses a portion of a case, an ear jack area, and a USB area) used in the electronic device.

The terminology “module” used herein may mean, for example, a unit including one of hardware, software, and firmware or two or more combinations thereof. The terminology “module” may be interchangeably used with, for example, terminologies “unit”, “logic”, “logical block”, “component”, or “circuit”, and the like. The “module” may be a minimum unit of an integrated component or a part thereof. The “module” may be a minimum unit performing one or more functions or a part thereof. The “module” may be mechanically or electronically implemented. For example, the “module” may include at least one of an application-specific integrated circuit (ASIC) chip, field-programmable gate arrays (FPGAs), or a programmable-logic device, which is well known or will be developed in the future, for performing certain operations.

According to various embodiments of the present disclosure, at least part of a device (e.g., modules or the functions) or a method (e.g., operations) may be implemented with, for example, instructions stored in computer-readable storage media which have a program module. When the instructions are executed by a processor, one or more processors may perform functions corresponding to the instructions. The computer-readable storage media may be, for example, a memory.

The computer-readable storage media may include a hard disc, a floppy disk, magnetic media (e.g., a magnetic tape), optical media (e.g., a compact disc read only memory (CD-ROM) and a digital versatile disc (DVD)), magneto-optical media (e.g., a floptical disk), a hardware device (e.g., a ROM, a random access memory (RAM), or a flash memory, and the like), and the like. Also, the program instructions may include not only mechanical codes compiled by a compiler but also high-level language codes which may be executed by a computer using an interpreter and the like. The above-mentioned hardware device may be configured to operate as one or more software modules to perform operations according to various embodiments of the present disclosure, and vice versa.

Modules or program modules according to various embodiments of the present disclosure may include at least one or more of the above-mentioned components, some of the above-mentioned components may be omitted, or other additional components may be further included. Operations executed by modules, program modules, or other components may be executed by a successive method, a parallel method, a repeated method, or a heuristic method. Also, some operations may be executed in a different order or may be omitted, and other operations may be added.

Embodiments of the present disclosure described and shown in the drawings are provided as examples to describe technical content and help understanding but do not limit the present disclosure. Accordingly, it should be interpreted that besides the embodiments listed herein, all modifications or modified forms derived based on the technical ideas of the present disclosure are included in the present disclosure as defined in the claims, and their equivalents.

The above-described embodiments of the present disclosure can be implemented in hardware, firmware or via the execution of software or computer code that can be stored in a recording medium such as a CD ROM, a Digital Versatile Disc (DVD), a magnetic tape, a RAM, a floppy disk, a hard disk, or a magneto-optical disk or computer code downloaded over a network originally stored on a remote recording medium or a non-transitory machine readable medium and to be stored on a local recording medium, so that the methods described herein can be rendered via such software that is stored on the recording medium using a general purpose computer, or a special processor or in programmable or dedicated hardware, such as an ASIC or FPGA. As would be understood in the art, the computer, the processor, microprocessor controller or the programmable hardware include memory components, e.g., RAM, ROM, Flash, etc. that may store or receive software or computer code that when accessed and executed by the computer, processor or hardware implement the processing methods described herein.

The control unit may include a microprocessor or any suitable type of processing circuitry, such as one or more general-purpose processors (e.g., ARM-based processors), a Digital Signal Processor (DSP), a Programmable Logic Device (PLD), an Application-Specific Integrated Circuit (ASIC), a Field-Programmable Gate Array (FPGA), a Graphical Processing Unit (GPU), a video card controller, etc. In addition, it would be recognized that when a general purpose computer accesses code for implementing the processing shown herein, the execution of the code transforms the general purpose computer into a special purpose computer for executing the processing shown herein. Any of the functions and steps provided in the Figures may be implemented in hardware, software or a combination of both and may be performed in whole or in part within the programmed instructions of a computer. No claim element herein is to be construed under the provisions of 35 U.S.C. 112, sixth paragraph, unless the element is expressly recited using the phrase “means for”. In addition, an artisan understands and appreciates that a “processor” or “microprocessor” may be hardware in the claimed disclosure. Under the broadest reasonable interpretation, the appended claims are statutory subject matter in compliance with 35 U.S.C. § 101.

Although the present disclosure has been described with an exemplary embodiment, various changes and modifications may be suggested to one skilled in the art. It is intended that the present disclosure encompass such changes and modifications as fall within the scope of the appended claims.